公开(公告)号：EP2434297A4

公开(公告)日：2012-11-14

申请号：EP09844914

申请日：2009-05-21

申请人： PANASONIC CORP

发明人： HAYASHI SHINTAROU ,  UEDA MITSUHIKO ,  SANAGAWA YOSHIHARU ,  SAKAI TAKAMASA

IPC分类号： G01P15/08 ,  B81B7/00 ,  G01P15/12 ,  G01P15/18 ,  H01L21/60 ,  H01L29/84

CPC分类号： G01P15/123 ,  B81B7/0048 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0842 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13191 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13561 ,  H01L2224/1357 ,  H01L2224/13691 ,  H01L2224/14155 ,  H01L2224/14165 ,  H01L2224/14179 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/29191 ,  H01L2224/321 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81862 ,  H01L2224/83 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/0715 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is applied to the upper surface of the base. The chip has a rectangular shape to have a width and a length, and is bonded at its lower surface to the base. The adhesive agents comprises the first adhesive agent, the second adhesive agent, and the third adhesive agent which are disposed on the three spots of the upper surface of the base, respectively. The three spots on the base are located on vertexes of a triangle. The first chip is bonded to the base by only the first adhesive agent, the second adhesive agent, and the third adhesive agent.

公开(公告)号：EP2517242A2

公开(公告)日：2012-10-31

申请号：EP10793117.2

申请日：2010-12-11

申请人： Advanced Micro Devices, Inc.

发明人： SU, Michael, Z.

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/42 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L21/54 ,  H01L23/055 ,  H01L23/3185 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/2747 ,  H01L2224/29011 ,  H01L2224/29023 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29164 ,  H01L2224/29169 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/321 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00 ,  H01L2924/00012

摘要： Various methods and apparatus for establishing thermal pathways for a semiconductor device are disclosed. In one aspect, a method of manufacturing is provided that includes providing a first semiconductor chip that has a substrate and a first active circuitry portion extending a first distance into the substrate. A barrier is formed in the first semiconductor chip that surrounds but is laterally separated from the first active circuitry portion and extends into the substrate a second distance greater than the first distance.

摘要翻译： 公开了用于建立半导体器件的热通路的各种方法和装置。 在一个方面，提供了一种制造方法，其包括提供具有衬底的第一半导体芯片和将第一距离延伸到衬底中的第一有源电路部分。 在所述第一半导体芯片中形成屏障，所述第一半导体芯片围绕着所述第一半导体芯片，但是与所述第一有源电路部分横向分离，并且延伸到所述衬底中比所述第一

公开(公告)号：EP3186950B1

公开(公告)日：2018-09-19

申请号：EP15747438.8

申请日：2015-07-31

申请人： Robert Bosch GmbH

发明人： REICHE, Martin ,  SEGER, Ulrich ,  BRAUNE, Thomas

IPC分类号： H04N5/225

CPC分类号： H04N5/2257 ,  B60R1/00 ,  B60R2300/10 ,  G03B17/55 ,  H01L24/11 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L27/14636 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/321 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/8385 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2924/07802 ,  H01L2924/15151 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/00014

公开(公告)号：EP2434297A1

公开(公告)日：2012-03-28

申请号：EP09844914.3

申请日：2009-05-21

申请人： Panasonic Corporation

发明人： HAYASHI, Shintarou ,  UEDA, Mitsuhiko ,  SANAGAWA, Yoshiharu ,  SAKAI, Takamasa

IPC分类号： G01P15/08 ,  G01P15/12 ,  G01P15/18 ,  H01L29/84 ,  H01L21/60

CPC分类号： G01P15/123 ,  B81B7/0048 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0842 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13191 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13561 ,  H01L2224/1357 ,  H01L2224/13691 ,  H01L2224/14155 ,  H01L2224/14165 ,  H01L2224/14179 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/29191 ,  H01L2224/321 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81862 ,  H01L2224/83 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/0715 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is applied to the upper surface of the base. The chip has a rectangular shape to have a width and a length, and is bonded at its lower surface to the base. The adhesive agents comprises the first adhesive agent, the second adhesive agent, and the third adhesive agent which are disposed on the three spots of the upper surface of the base, respectively. The three spots on the base are located on vertexes of a triangle. The first chip is bonded to the base by only the first adhesive agent, the second adhesive agent, and the third adhesive agent.

摘要翻译： 芯片的安装结构包括具有基座，基座的上表面上的芯片以及粘合基座和第一芯片的粘合剂的基板。 粘合剂被施加到基部的上表面。 芯片具有矩形形状以具有宽度和长度，并且在其下表面处结合到基部。 粘合剂包括分别设置在基底上表面的三个点上的第一粘合剂，第二粘合剂和第三粘合剂。 底座上的三个点位于三角形的顶点上。 第一芯片仅通过第一粘合剂，第二粘合剂和第三粘合剂粘合到基部。