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    Method of manufacturing printed circuit board with built-in multilayer capacitor
    93.
    发明专利
    Method of manufacturing printed circuit board with built-in multilayer capacitor 有权
    利用内置多层电容器制造印刷电路板的方法

    公开(公告)号：JP2006253656A

    公开(公告)日：2006-09-21

    申请号：JP2006017832

    申请日：2006-01-26

    Applicant: Samsung Electro Mech Co Ltd ,  三星電機株式会社

    Inventor： SOHN SEUNG HYUN ,  CHUNG YUL KYO ,  JIN HYUN JU ,  PARK EUN TAE

    IPC: H05K3/46 ,  H01G2/00 ,  H01G2/06 ,  H01G4/30 ,  H01L23/12

    CPC classification number: H05K1/162 ,  H05K3/025 ,  H05K3/381 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/09309 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board with a built-in printed multilayer capacitor which increases an electrostatic capacity, so that a built-in capacitor may have plural conductive layers and plural dielectric layers. SOLUTION: This invention comprises a first step of forming an insulating layer on a base substrate constituting a core layer, and laminating on the insulating layer an RCC in which a lower electrode layer is formed on the whole surface; a second step of forming an internal electrode layer after removing an upper part copper foil of the RCC; a third step of forming multilayers consisting of the dielectric layers and the internal electrode layer, by repeating several times an RCC lamination of the first step to the second step; and a fourth step of forming plural via-holes on the printed circuit board on which plural dielectric layers and plural internal electrode layers are formed, and depositing an inner wall of the via-hole and conducting between the internal electrode layers to complete the multilayer capacitor. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 解决的问题：为了提供一种制造具有增加静电电容的内置印刷层叠电容器的电路板的方法，使得内置电容器可以具有多个导电层和多个电介质层。 解决方案：本发明包括在构成芯层的基底基板上形成绝缘层的第一步骤，并且在绝缘层上层叠在整个表面上形成下电极层的RCC; 在去除所述RCC的上部铜箔之后形成内部电极层的第二工序; 形成由电介质层和内部电极层构成的多层的第三步骤，通过重复数次第一步骤的RCC层压至第二步骤; 以及在印刷电路板上形成多个通孔的第四步骤，其上形成有多个电介质层和多个内部电极层，并且沉积通孔的内壁并在内部电极层之间传导以完成多层电容器 。 版权所有（C）2006，JPO＆NCIPI

    Method for continuously manufacturing double-side conductor polyimide laminate
    95.
    发明专利
    Method for continuously manufacturing double-side conductor polyimide laminate 有权
    连续制造双面导体聚酰亚胺层压板的方法

    公开(公告)号：JP2005203628A

    公开(公告)日：2005-07-28

    申请号：JP2004009530

    申请日：2004-01-16

    Applicant: Nippon Steel Chem Co Ltd ,  新日鐵化学株式会社

    Inventor： MIYAMOTO KAZUYA ,  TOKUMITSU AKIRA ,  II SHOICHI ,  SHIGEMATSU YOSHIHIRO ,  HIGASAYAMA ICHIRO ,  SUGANO KATSUHIRO ,  NAKAGAWA YUJIRO

    IPC: B32B15/08 ,  B32B15/088 ,  B32B37/00 ,  H05K3/00 ,  H05K3/02

    CPC classification number: B32B37/0053 ,  B32B15/08 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/068 ,  H05K2203/1105 ,  H05K2203/1545 ,  H05K2203/1572

    Abstract: PROBLEM TO BE SOLVED: To provide a method for continuously manufacturing a double-side conductor polyimide-based laminate with a rolled shape which can have a stable quality and can avoid an appearance failure such as a vertical wrinkle.
    SOLUTION: A double-side conductor polyimide laminate is manufactured by continuously introducing a base material comprising a one-side conductor laminate obtained by heat setting and laminating polyimide-based insulator layers without any adhesive and a conductive metal foil into a gap between press rolls, and by integrally laminating the conductive metal foil by thermo-compressing. The press rolls are provided with a surface temperature uniformization means and also with an interior-heating control means for causing central and both-side zones to have different thermal expansions. The internal wall surface of the central zone is heated by the heating control means at a temperature higher by 5-20°C than that of the internal wall surface of the both-side zones. Consequently, the thermo-compressing is carried out while automatically correcting non-uniform compressing power caused by a very small tilt of the press rolls during adjustment of the gap between the press rolls through the thermal expansion of the central zone, to thereby obtain an integrated laminate.
    COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 解决的问题：提供一种连续制造可以具有稳定品质并且可以避免诸如垂直皱纹等外观故障的卷成形状的双面导体聚酰亚胺系层叠体的方法。 解决方案：双面导体聚酰亚胺层压体通过连续引入包含通过热固定而获得的单面导体层叠体的基材，并且将没有粘合剂的聚酰亚胺类绝缘体层和导电金属箔层压到 压辊，并且通过热压缩将导电金属箔整体层压。 压辊设置有表面温度均匀化装置，并且还具有用于使中央和两侧区域具有不同热膨胀的内部加热控制装置。 中央区域的内壁表面由加热控制装置在比两侧壁的内壁表面高5-20℃的温度下加热。 因此，在通过中央区域的热膨胀调节压辊之间的间隙时，自动校正由压辊的非常小的倾斜引起的非均匀的压缩功率，从而获得集成 层压板。 版权所有（C）2005，JPO＆NCIPI

    Copper foil with very thin adhesive layer and its production method
    97.
    发明专利
    Copper foil with very thin adhesive layer and its production method 有权
    具有非常薄的粘合层的铜箔及其生产方法

    公开(公告)号：JP2005053218A

    公开(公告)日：2005-03-03

    申请号：JP2004172985

    申请日：2004-06-10

    Applicant: Mitsui Mining & Smelting Co Ltd ,  三井金属鉱業株式会社

    Inventor： SATO TETSURO ,  MATSUSHIMA TOSHIFUMI

    IPC: B32B15/08 ,  B32B15/088 ,  B32B15/092 ,  H05K3/38

    CPC classification number: H05K3/386 ,  H05K3/389 ,  H05K2201/0358 ,  Y10T428/12431 ,  Y10T428/26 ,  Y10T428/265 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31678 ,  Y10T428/31681

    Abstract: PROBLEM TO BE SOLVED: To provide a copper foil with a very thin resin layer for a print wiring board without roughing treatment. SOLUTION: In the copper foil, a very thin primer resin layer is formed on one surface of a copper foil 3 without roughing treatment in order to attain strong adhesiveness to a resin substrate. A silane coupling agent layer 2 is formed on the surface of a copper foil having roughness (Rz) of 2 μm or less, and a very thin primer resin layer 4 having a calculated thickness of 1-5 μm is formed on the silane coupling agent layer. The copper foil with a very thin adhesive layer is designated as the copper foil 1 or the like for a printed wiring board. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种不需要粗加工处理的印刷线路板用非常薄的树脂层的铜箔。 解决方案：在铜箔中，为了获得对树脂基材的强粘合性，在铜箔3的一个表面上形成非常薄的底漆树脂层而不进行粗加工处理。 在粗糙度（Rz）为2μm以下的铜箔的表面上形成硅烷偶联剂层2，在硅烷偶联剂上形成计算出的厚度为1-5μm的非常薄的底漆树脂层4 层。 具有非常薄的粘合剂层的铜箔被指定为用于印刷线路板的铜箔1等。 版权所有（C）2005，JPO＆NCIPI

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