表示パネル用接着剤及びそれを用いた表示パネル又は表示パネルの製造方法
    65.
    发明专利
    表示パネル用接着剤及びそれを用いた表示パネル又は表示パネルの製造方法 审中-公开
    用于显示面板的粘合剂,使用其的显示面板和用于生产显示面板的方法

    公开(公告)号:JP2014221892A

    公开(公告)日:2014-11-27

    申请号:JP2013102505

    申请日:2013-05-14

    Inventor: MATSUTANI AKIO

    Abstract: 【課題】表示パネル用接着剤で接着させる部材から、表示パネル用接着剤がはみ出さない表示パネル用接着剤であって、及び表示パネル用接着剤を用いた表示パネル、及び表示パネル用接着剤を用いた表示パネルの製造方法を提供する。【解決手段】(A)分子中に重合性の炭素−炭素二重結合を平均して1.5個以上含み、かつ数平均分子量(Mn)が5,000以上のポリマー、(B)分子中に重合性の炭素−炭素二重結合を平均して1個以下含み、かつ数平均分子量(Mn)が5,000以上のポリマー、(C)光重合開始剤、(D)表面がアルキルシリル基で修飾された疎水性シリカを含み、ずり速度D1=2.1における25℃の粘度P1が31,000mPa・s以上、ずり速度D2=21における25℃の粘度P2が30,000mPa・s未満とする表示パネル用接着剤。【選択図】図1

    Abstract translation: 要解决的问题:提供一种用于显示面板的粘合剂,其不会从由用于显示面板的粘合剂粘附的部件流出,并且提供使用该显示面板用粘合剂的显示面板和用于制造显示器的方法 使用显示面板用粘合剂的面板。解决方案:提供了一种用于显示面板的粘合剂,其包括:(A)在分子中平均含有1.5个或更多个可聚合碳 - 碳双键并且具有数均分子量 (Mn)为5000以上; (B)分子中平均含有一个或多个可聚合碳 - 碳双键且数均分子量(Mn)为5000以上的聚合物; (C)光聚合引发剂; 和(D)表面用烷基甲硅烷基改性的疏水性二氧化硅,其中在25℃下剪切速率D1 = 2.1时的粘度P1为31000mPa·s以上,在25℃时剪切速率D2 = 21时的粘度P2 ℃小于30000 mPa s。

    Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, pressure-sensitive adhesive sheet, optical member and touch panel
    67.
    发明专利
    Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, pressure-sensitive adhesive sheet, optical member and touch panel 有权
    压敏粘合剂组合物,压敏胶粘剂层,压敏粘合片,光学构件和触控面板

    公开(公告)号:JP2014177611A

    公开(公告)日:2014-09-25

    申请号:JP2013109424

    申请日:2013-05-23

    Abstract: PROBLEM TO BE SOLVED: To provide an optical member having an excellent anticorrosion effect while maintaining adhesion reliability and transparency to a high degree, and to provide a pressure-sensitive adhesive composition and a pressure-sensitive adhesive sheet from which an optical member such as above described can be efficiently and inexpensively manufactured.SOLUTION: The pressure-sensitive adhesive composition comprises a rust preventive and a base polymer, in which monomer ingredients for constituting the base polymer contain no or substantially no acidic-group-containing monomer. The pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer formed from the above pressure-sensitive adhesive composition.

    Abstract translation: 要解决的问题:提供具有优异的防腐蚀效果的光学部件,同时高度地保持粘合可靠性和透明性,并且提供一种压敏粘合剂组合物和压敏粘合剂片,通过该粘合剂组合物和粘合剂片 可以有效且廉价地制造。解决方案:压敏粘合剂组合物包含防锈剂和基础聚合物,其中用于构成基础聚合物的单体成分不含或基本上不含酸性基团的单体。 压敏粘合片具有由上述压敏粘合剂组合物形成的粘合剂层。

    Temporary adhesive agent for manufacturing semiconductor device, adhesive support using the same and manufacturing method of semiconductor device
    69.
    发明专利
    Temporary adhesive agent for manufacturing semiconductor device, adhesive support using the same and manufacturing method of semiconductor device 有权
    用于制造半导体器件的粘合剂,使用其的粘合剂支持和半导体器件的制造方法

    公开(公告)号:JP2014129431A

    公开(公告)日:2014-07-10

    申请号:JP2012286365

    申请日:2012-12-27

    Abstract: PROBLEM TO BE SOLVED: To provide a temporary adhesive agent for manufacturing a semiconductor device excellent in coating performance, capable of temporarily supporting members to be treated by high adhesive force even at a high temperature (for example 100°C) when mechanical or chemical treatments are applied to the members to be treated (a semiconductor wafer and the like), and releasing the temporary support to the treated members without damaging the treated members even after processing at a high temperature, and to provide an adhesive support using the same and a manufacturing method of the semiconductor device.SOLUTION: There is provided a temporary adhesive agent for manufacturing a semiconductor device containing (A) radical polymerizable monomer having an alicyclic skeleton, (B) a polymer compound, (C) a radical polymerization initiator. There are also provided an adhesive support using the same and a manufacturing method of the semiconductor device.

    Abstract translation: 要解决的问题:提供一种用于制造涂料性能优异的半导体装置的临时粘合剂,即使在机械或化学处理时,即使在高温(例如100℃)下也能够通过高粘合力临时支撑待处理的构件 施加到要处理的构件(半导体晶片等)上,并且即使在高温处理之后也将临时支撑件释放到处理构件而不损坏处理构件,并且提供使用其的粘合剂支撑件 半导体装置的制造方法。解决方案:提供一种用于制造半导体器件的临时粘合剂,其包含(A)具有脂环骨架的自由基聚合性单体,(B)高分子化合物,(C)自由基聚合引发剂。 还提供了使用其的粘合剂支撑件和半导体器件的制造方法。

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