公开(公告)号：JP5372112B2

公开(公告)日：2013-12-18

申请号：JP2011241947

申请日：2011-11-04

Applicant: 新光電気工業株式会社

Inventor： 啓 村山 ,  光敏 東 ,  昌宏 春原

IPC: H01L23/12 ,  H05K3/46

CPC classification number: H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method and a semiconductor package manufacturing method which can reduce displacement of a pitch of an electrode pad electrically connected with a semiconductor chip from an intended pitch. SOLUTION: A wiring board manufacturing method comprises the steps of forming a metal layer 14 on a top face of a support substrate 11 having a thermal expansion coefficient equal to that of a semiconductor substrate, forming a release layer 15 on the metal layer 14, forming a first insulation layer 16 on the release layer 15, forming a through hole 16x penetrating the release layer 15 and the first insulation layer 16 so as to expose the metal layer 14 at a position corresponding to a position on which a first wiring layer 17 is to be formed, forming the first wiring layer 17 on the metal layer 14 at the position exposed inside the through hole 16x using the metal layer 14 as a seed layer, further laminating wiring layers 20, 23, 26 and insulation layers 21, 24 on the first wiring layer 17 and the first insulation layer 16, and removing the support substrate 11 by performing predetermined processing on the release layer 15. COPYRIGHT: (C)2012,JPO&INPIT

公开(公告)号：JP5312892B2

公开(公告)日：2013-10-09

申请号：JP2008261000

申请日：2008-10-07

Applicant: 新光電気工業株式会社

Inventor： 清明 飯田 ,  和男 田中 ,  紀雄 近藤 ,  秀明 坂口 ,  光敏 東

IPC: H01L21/60 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a conductive ball mounting apparatus which shortens a processing time required for steps to mount conductive balls on a plurality of pads and to remove excessive conductive balls, improves productivity, and accurately mounts the conductive balls on the pads. SOLUTION: A housing stage 82 is provided to house a vibrator 12 and a conductive ball container 13, and it is provided with a plate 81 having a penetrated section 81A to discharge a conductive ball 14 to an adhesive material 38 formed on a pad 35. COPYRIGHT: (C)2009,JPO&INPIT

公开(公告)号：JP5210912B2

公开(公告)日：2013-06-12

申请号：JP2009023411

申请日：2009-02-04

Applicant: 新光電気工業株式会社

Inventor： 裕一 田口 ,  晶紀 白石 ,  光敏 東

IPC: H05K1/11 ,  H05K1/14

CPC classification number: B81B7/0074 ,  H01L24/16 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K3/328 ,  H05K2201/10287 ,  H05K2201/10454 ,  H05K2201/10727 ,  H05K2201/10946 ,  H01L2924/00 ,  H01L2224/48

Abstract: A wiring substrate includes a silicon substrate, a through hole formed to penetrate the silicon substrate in a thickness direction, an insulating layer formed on both surfaces and side surfaces of the silicon substrate and an inner surface of the through hole, a penetration electrode formed in the through hole, a wiring layer formed on at least one surface of the silicon substrate and connected to the penetration electrode, and a metal wire terminal connected to the wiring layer and formed to extend from one surface of the silicon substrate to a side surface thereof. The metal wire terminal on the side surface of the electronic device is connected to the mounting substrate such that a substrate direction of the electronic device in which an electronic component is mounted on the wiring substrate intersects orthogonally with a substrate direction of the mounting substrate.

公开(公告)号：JP5202353B2

公开(公告)日：2013-06-05

申请号：JP2009011363

申请日：2009-01-21

Applicant: 新光電気工業株式会社

Inventor： 清明 飯田 ,  秀明 坂口 ,  和男 田中 ,  光敏 東

IPC: H01L21/60 ,  H05K3/34

CPC classification number: H01L2224/11

公开(公告)号：JP5139347B2

公开(公告)日：2013-02-06

申请号：JP2009035674

申请日：2009-02-18

Applicant: 新光電気工業株式会社

Inventor： 裕一 田口 ,  晶紀 白石 ,  光敏 東 ,  啓 村山

IPC: H01L21/60 ,  H01L23/14

CPC classification number: H01L23/13 ,  B81B7/007 ,  B81B2207/096 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0558 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/81097 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/351 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：JP4974818B2

公开(公告)日：2012-07-11

申请号：JP2007229424

申请日：2007-09-04

Applicant: 新光電気工業株式会社

Inventor： 秀明 坂口 ,  光敏 東 ,  和男 田中 ,  清明 飯田

IPC: H05K3/34 ,  B23K3/06 ,  H01L23/12 ,  H05K3/00

公开(公告)号：JP4837696B2

公开(公告)日：2011-12-14

申请号：JP2008076823

申请日：2008-03-24

Applicant: 新光電気工業株式会社

Inventor： 秀明 坂口 ,  昌宏 春原 ,  啓 村山 ,  光敏 東

IPC: H01L23/12

CPC classification number: H05K3/242 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/6835 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/007 ,  H05K3/108 ,  H05K3/243 ,  H05K3/4682 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2203/016 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49993 ,  Y10T156/10

公开(公告)号：JP4837328B2

公开(公告)日：2011-12-14

申请号：JP2005223161

申请日：2005-08-01

Applicant: 新光電気工業株式会社

Inventor： 秀明 坂口 ,  光敏 東 ,  晶紀 白石

IPC: H01L31/02 ,  H01L23/02 ,  H01L27/14

CPC classification number: H01L2224/16225

公开(公告)号：JP4828182B2

公开(公告)日：2011-11-30

申请号：JP2005252055

申请日：2005-08-31

Applicant: 新光電気工業株式会社

Inventor： 秀明 坂口 ,  光敏 東

IPC: H01L23/52 ,  H01L21/3205 ,  H01L23/12

CPC classification number: H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：JP4783718B2

公开(公告)日：2011-09-28

申请号：JP2006318940

申请日：2006-11-27

Applicant: 新光電気工業株式会社

Inventor： 昌宏 春原 ,  啓 村山 ,  光敏 東 ,  裕一 田口 ,  晶紀 白石

IPC: F21S2/00 ,  F21S8/12 ,  F21V11/00 ,  F21V13/00 ,  F21V13/10 ,  F21V14/00 ,  F21Y101/02 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60

CPC classification number: F21V11/16 ,  F21K9/00 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2924/16195