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公开(公告)号：JP4849654B2
公开(公告)日：2012-01-11
申请号：JP2000276284
申请日：2000-09-12
申请人： 日東電工株式会社
IPC分类号： C09J7/02 , C09J153/02 , C09J163/00
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公开(公告)号：JP4666550B2
公开(公告)日：2011-04-06
申请号：JP2001049819
申请日：2001-02-26
申请人： 日東電工株式会社
IPC分类号： C09J7/02 , C09K3/00 , C09J123/00 , C09J123/08 , C09J151/06
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公开(公告)号：JP4562118B2
公开(公告)日：2010-10-13
申请号：JP2003423118
申请日：2003-12-19
申请人： 日東電工株式会社
IPC分类号： H01L21/52 , H01L21/58 , H01L21/60 , H01L21/607 , H01L21/68 , H01L21/98 , H01L25/065
CPC分类号： H01L24/85 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83856 , H01L2224/83885 , H01L2224/85001 , H01L2224/85205 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/3011 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/20752
摘要： The process for producing a semiconductor device according to the invention comprises a pre-sticking/fixing step of pre-sticking/fixing a semiconductor element (13) through an adhesive sheet (12) to an object (11) to which the semiconductor element (13) is to be stuck/fixed, and a wire (16) bonding step of performing wire (16) bonding without a heating step, wherein the shear adhesive force of the adhesive sheet (12) to the object (11) is 0.2 MPa or more at the time of the pre-sticking/fixing. This makes it possible to provide a semiconductor device producing process wherein a drop in the yield of semiconductor devices is suppressed and steps therein are made simple; wherein an adhesive sheet (12) is used in this process, and a semiconductor device obtained by the process.
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公开(公告)号：JP4441335B2
公开(公告)日：2010-03-31
申请号：JP2004172064
申请日：2004-06-10
申请人： 日東電工株式会社
IPC分类号： H01L21/52
CPC分类号： H01L24/27 , H01L2224/32145 , H01L2224/32225 , H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/85207 , H01L2224/92247 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/15747 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
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5.发明专利
公开(公告)号：JP3849978B2
公开(公告)日：2006-11-22
申请号：JP2002168689
申请日：2002-06-10
申请人： 日東電工株式会社
IPC分类号： C09J7/02 , H01L21/56 , C09J133/00 , H01L21/301 , H01L21/50 , H01L21/60 , H01L23/50
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32245 , H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85201 , H01L2224/85205 , H01L2224/92247 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
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公开(公告)号：JP4763876B2
公开(公告)日：2011-08-31
申请号：JP2000151008
申请日：2000-05-23
申请人： 日東電工株式会社
IPC分类号： C09J7/02 , C09J163/00 , C09J109/02 , C09J133/04 , C09J133/06 , C09J133/20 , C09J161/04 , C09J183/04
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公开(公告)号：JP4213793B2
公开(公告)日：2009-01-21
申请号：JP26885698
申请日：1998-09-24
申请人： 日東電工株式会社
IPC分类号： C09J4/02 , H05K3/34 , C08L63/00 , C09J7/02 , C09J133/08 , C09J133/14 , C09J163/00 , H05K3/30
CPC分类号： C09J133/14 , C08L63/00 , C08L2666/14 , C09J7/385 , C09J2201/128 , C09J2201/61 , C09J2433/00 , C09J2463/00 , H05K3/305 , Y10T428/28 , Y10T428/2809 , Y10T428/2813 , Y10T428/287 , Y10T428/2878 , Y10T428/2891
摘要： An adhesive sheet not tacky at ordinary temperatures, exhibiting strong adhesion and high heat resistance by heating under low pressure for a short period of time, having no problem of adhesive protrusion and excellent in storage stability, which comprises a base material having provided on one side or both sides thereof at least one layer of a thermosetting adhesive comprising (1) a non-tacky polymer of a monomer mixture comprising from 70% to 99% by weight of a (meth)acrylic ester represented by formula (I), a homopolymer of which has a glass transition temperature of -30 DEG C or more, and from 1% to 30% by weight of a monoethylenic unsaturated monomer being copolymerizable therewith and having a functional group capable of reacting with an epoxy resin each based on the monomer mixture and (2) from 5 parts to 30 parts by weight of the epoxy resin per 100 parts by weight of the monomer mixture, and not substantially comprising a curing agent for the epoxy resin:
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公开(公告)号：JP4140963B2
公开(公告)日：2008-08-27
申请号：JP2003374364
申请日：2003-11-04
IPC分类号： H01L23/12
CPC分类号： H01L24/32 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2924/18165 , H01L2924/00014 , H01L2924/00
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