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公开(公告)号：JP5601682B2
公开(公告)日：2014-10-08
申请号：JP2010128024
申请日：2010-06-03
申请人： 日東電工株式会社
IPC分类号： H01L21/52 , C09J7/00 , C09J11/04 , C09J11/06 , C09J109/00 , C09J109/02 , C09J113/00 , C09J161/06 , C09J163/00 , C09J163/02 , C09J163/04
CPC分类号： H01L24/29 , H01L2924/10253 , H01L2924/00
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公开(公告)号：JP5456440B2
公开(公告)日：2014-03-26
申请号：JP2009251125
申请日：2009-10-30
申请人： 日東電工株式会社
IPC分类号： H01L21/683 , B32B7/10 , C09J7/02 , C09J201/00 , H01L21/301 , H01L21/60 , H01L23/00
CPC分类号： H01L21/6836 , H01L23/544 , H01L23/562 , H01L24/81 , H01L2221/68327 , H01L2223/5448 , H01L2224/16 , H01L2224/27436 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01079 , H01L2924/12042 , Y10T428/1467 , Y10T428/28 , Y10T428/2848 , Y10T428/31511 , H01L2924/00 , H01L2224/0401
摘要： The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.
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公开(公告)号：JP5368502B2
公开(公告)日：2013-12-18
申请号：JP2011075317
申请日：2011-03-30
申请人： 日東電工株式会社
IPC分类号： H01L21/301 , C09J7/02 , C09J133/08 , C09J175/14
CPC分类号： H01L21/6835 , C08F220/18 , C08F220/34 , C08F2220/1808 , C08F2220/1833 , C08F2220/281 , C09J7/20 , C09J7/22 , C09J7/30 , C09J133/08 , C09J163/00 , C09J2201/36 , C09J2201/606 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2221/68327 , H01L2221/68336 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/85 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/19042 , H01L2924/3025 , Y10T428/31511 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The present invention is a dicing die-bonding film (10) comprising a dicing film having a pressure-sensitive adhesive layer (2) on a base (1) and a die-bonding film (3) provided on the pressure-sensitive adhesive layer (2), wherein the pressure-sensitive adhesive layer (2) is formed from an acrylic pressure-sensitive adhesive comprising an acrylic polymer which comprises an acrylic ester, a hydroxyl group-containing monomer where a ratio is in a range of 10 to 40 mol% to 100 mol% of the acrylic ester, and an isocyanate compound having a radical reactive carbon-carbon double bond within a molecule where a ratio is in a range of 70 to 90 mol% to 100 mol% of the hydroxyl group-containing monomer, and a compound having two or more radical reactive carbon-carbon double bonds within a molecule where a ratio is in a range of 10 to 60 parts by weight to 100 parts by weight of the acrylic polymer, and the die-bonding film is formed from an epoxy resin and is laminated on the pressure-sensitive adhesive layer (2).
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公开(公告)号：JP5328631B2
公开(公告)日：2013-10-30
申请号：JP2009287992
申请日：2009-12-18
申请人： 日東電工株式会社
IPC分类号： H01L21/52 , C09J7/00 , C09J9/00 , C09J11/00 , C09J133/00 , C09J161/06 , C09J163/00
CPC分类号： H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73265 , H01L2924/01047 , H01L2924/10253 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting die bond film superior in wetproof reflow properties and a dicing-die bond film comprising the same by preventing peeling-off and generation of voids between the film and an adherend in a semiconductor package, even when heat treatment is executed at a high temperature for a long time after die bonding. SOLUTION: The thermosetting die bond film 3 is used for manufacturing a semiconductor device, and formed of at least an epoxy resin, a phenol resin, an acrylic copolymer whose weight-average molecular weight is 100,000 or more, and a filler, and the acid number is within the range of 1-4. COPYRIGHT: (C)2010,JPO&INPIT
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公开(公告)号：JP5187923B2
公开(公告)日：2013-04-24
申请号：JP2012092101
申请日：2012-04-13
申请人： 日東電工株式会社
IPC分类号： H01L21/52 , H01L25/065 , H01L25/07 , H01L25/18
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公开(公告)号：JP4780653B2
公开(公告)日：2011-09-28
申请号：JP2006039139
申请日：2006-02-16
申请人： 日東電工株式会社
CPC分类号： H01L24/27 , H01L21/6836 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L2224/83099 , H01L2224/83191 , H01L2224/83192 , H01L2224/92247 , H01L2225/0651 , H01L2225/06568 , H01L2225/06572 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/15747 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device that prevents inability of wire bonding due to the smearing of a bonding pad, and prevents generation of curvature in an adherend such as a substrate, lead frame or semiconductor device, thus improving the yield and simplifying the manufacturing process, an adhesive sheet used for the method, and a semiconductor device obtained through the method. SOLUTION: The method includes a temporary adherence process that temporarily attaches a semiconductor device 13 onto an adherend 11 through an adhesive sheet 12, and a wire bonding process that performs wire bonding in a bonding temperature range of 80 to 250°C without going through a heating process. As the above-mentioned adhesive sheet 12, one is used whose storage modulus before curing is 1 MPa or more in a temperature range of 80 to 250°C, or 1 MPa or more at an arbitrary temperature within that temperature range. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译： 解决的问题：提供一种半导体器件的制造方法，其防止由于焊盘的污损导致的引线接合不能，并且防止诸如衬底，引线框架或半导体器件等被粘物的曲率的产生 ，从而提高成品率，简化制造工艺，用于该方法的粘合片和通过该方法获得的半导体器件。 解决方案：该方法包括通过粘合片12将半导体器件13暂时地附着到被粘物11上的临时粘合工艺，以及在80-250℃的接合温度范围内进行引线接合的引线接合工艺，而没有 经过加热过程。 作为上述粘合片12，使用在80〜250℃的温度范围内固化前的储能模量为1MPa以上，在该温度范围内的任意温度为1MPa以上的粘合片。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP4717086B2
公开(公告)日：2011-07-06
申请号：JP2008009494
申请日：2008-01-18
申请人： 日東電工株式会社
IPC分类号： H01L21/301 , C09J7/02 , C09J11/06 , C09J133/14
CPC分类号： C09J133/066 , C08F8/30 , C08F2220/1858 , C08F2810/50 , C08L63/00 , C08L2666/22 , C09J7/22 , C09J7/30 , C09J133/08 , C09J163/00 , C09J2201/36 , C09J2201/606 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2463/00 , C09J2463/006 , C09J2475/00 , H01L21/67132 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2221/68336 , H01L2224/274 , H01L2224/27436 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/85 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/3025 , Y10T428/31551 , C08F2220/281 , C08F220/28 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a dicing die-bonding film which is excellent in balance between holding strength of a semiconductor wafer upon dicing and peeling property upon picking up. A dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the dicing film,, wherein the pressure-sensitive adhesive layer contains a polymer obtained by the addition reaction of an acrylic polymer containing 10 to 40 mol% of a hydroxyl group-containing monomer with 70 to 90 mol% of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and 2 to 20 parts by weight of a crosslinking agent including in the molecule two or more functional groups having reactivity with a hydroxyl group based on 100 parts by weight of the polymer, and the pressure-sensitive adhesive layer is also cured by irradiation with ultraviolet rays under predetermined conditions, and wherein the die-bonding film comprises an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.
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公开(公告)号：JP4717052B2
公开(公告)日：2011-07-06
申请号：JP2007314907
申请日：2007-12-05
申请人： 日東電工株式会社
IPC分类号： H01L21/301 , C09J7/02 , C09J133/06 , H01L21/52
CPC分类号： C09J133/066 , C08L63/00 , C09J7/38 , C09J2201/606 , C09J2203/326 , C09J2475/00 , H01L21/6836 , H01L2221/68327 , H01L2221/68377 , H01L2224/2919 , H01L2924/01006 , H01L2924/0665 , H01L2924/181 , Y10T428/31511 , C08L2666/22 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides a dicing die-bonding film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the pressure-sensitive adhesive layer. A dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the dicing film, wherein the pressure-sensitive adhesive layer contains a polymer that is obtained by the addition-reaction of an acrylic polymer containing 10 to 30 mol % of a hydroxyl group-containing monomer with 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and also contains 2 to 20 parts by weight of a crosslinking agent containing two or more functional groups having reactivity with a hydroxyl group in the molecule based on 100 parts by weight of the polymer, and the die-bonding film comprises an epoxy resin.
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公开(公告)号：JP4566527B2
公开(公告)日：2010-10-20
申请号：JP2003206670
申请日：2003-08-08
申请人： 日東電工株式会社
IPC分类号： C09J7/02 , B32B7/12 , C09J9/00 , C09J133/00 , C09J201/00 , H01L21/301 , H01L21/304 , H01L21/68 , H01L21/683
CPC分类号： C09J7/29 , C09J2201/162 , C09J2203/326 , Y10T156/1052 , Y10T428/1471 , Y10T428/1476 , Y10T428/28 , Y10T428/2848
摘要： The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive layer, the intermediate layer having a storage elastic modulus (G') of 3.0x104 to 1.0x108 Pa at 23° C. and a storage elastic modulus (G') of 1.0x103 to 8.0x104 Pa at 200° C.
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公开(公告)号：JP4107417B2
公开(公告)日：2008-06-25
申请号：JP2002299930
申请日：2002-10-15
申请人： 日東電工株式会社
IPC分类号： H01L21/301 , H01L21/78 , C09J5/00 , H01L21/58 , H01L21/68
CPC分类号： H01L24/29 , C09J7/20 , C09J2201/36 , C09J2201/606 , C09J2201/61 , C09J2203/326 , C09J2205/31 , C09J2433/00 , H01L21/6836 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/3025 , Y10T428/218 , Y10T428/28 , Y10T428/2848 , H01L2924/00 , H01L2924/3512
摘要： A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching region (3a) in the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or a whole of the other region (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.
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