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公开(公告)号:TWI497675B
公开(公告)日:2015-08-21
申请号:TW101142758
申请日:2012-11-16
Inventor: 賴志維 , LAI, CHIH WEI , 何明哲 , HO, MING CHE , 楊宗翰 , YANG, TZONG HANN , 汪青蓉 , WANG, CHIEN RHONE , 張家棟 , CHANG, CHIA TUNG , 郭宏瑞 , KUO, HUNG JUI , 劉重希 , LIU, CHUNG SHI
IPC: H01L23/522 , H01L23/538 , H01L21/768
CPC classification number: G06F17/5077 , G06F17/5072 , H01L23/488 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/034 , H01L2224/03912 , H01L2224/0401 , H01L2224/05016 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05552 , H01L2224/05572 , H01L2224/05666 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14132 , H01L2924/00014 , H01L2924/00012 , H01L2924/01047 , H01L2924/01029
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公开(公告)号:TWI462248B
公开(公告)日:2014-11-21
申请号:TW100115563
申请日:2011-05-04
Inventor: 林正怡 , LIM, ZHENG-YI , 吳逸文 , WU, YI WEN , 呂文雄 , LU, WEN HSIUNG , 林志偉 , LIN, CHIH WEI , 楊宗翰 , YANG, TZONG HUANN , 林修任 , LIN, HSIU JEN , 鄭明達 , CHENG, MING DA , 劉重希 , LIU, CHUNG SHI
IPC: H01L23/488 , H01L29/41 , H01L29/43
CPC classification number: H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0345 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05027 , H01L2224/05166 , H01L2224/05181 , H01L2224/05186 , H01L2224/05572 , H01L2224/05647 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/1147 , H01L2224/1181 , H01L2224/11824 , H01L2224/11827 , H01L2224/11849 , H01L2224/1308 , H01L2224/13083 , H01L2224/13109 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/1357 , H01L2224/13583 , H01L2224/13693 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191 , H01L2224/81815 , H01L2224/94 , H01L2924/00014 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/01047 , H01L2924/01024 , H01L2924/01028 , H01L2924/0105 , H01L2924/01079 , H01L2924/04941 , H01L2924/04953 , H01L2924/01073 , H01L2924/01049 , H01L2924/0103 , H01L2924/01025 , H01L2924/01022 , H01L2924/01032 , H01L2924/01078 , H01L2924/01012 , H01L2924/01013 , H01L2924/0104 , H01L2924/01046 , H01L2924/01082 , H01L2924/01029 , H01L2924/01083 , H01L2924/01051 , H01L2224/03 , H01L2224/11 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
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公开(公告)号:TW201401399A
公开(公告)日:2014-01-01
申请号:TW102119545
申请日:2013-06-03
Inventor: 林正怡 , LIM, ZHENG-YI , 吳逸文 , WU, YI WEN , 楊宗翰 , YANG, TZONG HANN , 何明哲 , HO, MING CHE , 劉重希 , LIU, CHUNG SHI
IPC: H01L21/60
CPC classification number: H01L24/81 , H01L21/56 , H01L23/3107 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49833 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/13016 , H01L2224/13017 , H01L2224/13018 , H01L2224/13023 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13582 , H01L2224/13583 , H01L2224/13611 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/13664 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/16501 , H01L2224/16505 , H01L2224/32135 , H01L2224/32141 , H01L2224/32145 , H01L2224/81085 , H01L2224/811 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81232 , H01L2224/81355 , H01L2224/81359 , H01L2224/81801 , H01L2224/8192 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/1023 , H01L2225/1058 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3841 , H01L2924/00014 , H01L2924/00012 , H01L2924/01005 , H01L2924/01074 , H01L2924/01015 , H01L2924/06 , H01L2924/00
Abstract: 一種方法,包括將一封裝元件之一第一電連接器對準一第二封裝元件之一第二電連接器。在第一電連接器對準第二連接器後,將一金屬層電鍍至第一及第二電連接器上。金屬層將第一電連接器與第二連接器接合。
Abstract in simplified Chinese: 一种方法,包括将一封装组件之一第一电连接器对准一第二封装组件之一第二电连接器。在第一电连接器对准第二连接器后,将一金属层电镀至第一及第二电连接器上。金属层将第一电连接器与第二连接器接合。
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公开(公告)号:TWI508203B
公开(公告)日:2015-11-11
申请号:TW102119545
申请日:2013-06-03
Inventor: 林正怡 , LIM, ZHENG-YI , 吳逸文 , WU, YI WEN , 楊宗翰 , YANG, TZONG HANN , 何明哲 , HO, MING CHE , 劉重希 , LIU, CHUNG SHI
IPC: H01L21/60
CPC classification number: H01L24/81 , H01L21/56 , H01L23/3107 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49833 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/13016 , H01L2224/13017 , H01L2224/13018 , H01L2224/13023 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13582 , H01L2224/13583 , H01L2224/13611 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/13664 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/16501 , H01L2224/16505 , H01L2224/32135 , H01L2224/32141 , H01L2224/32145 , H01L2224/81085 , H01L2224/811 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81232 , H01L2224/81355 , H01L2224/81359 , H01L2224/81801 , H01L2224/8192 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/1023 , H01L2225/1058 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3841 , H01L2924/00014 , H01L2924/00012 , H01L2924/01005 , H01L2924/01074 , H01L2924/01015 , H01L2924/06 , H01L2924/00
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公开(公告)号:TW201322404A
公开(公告)日:2013-06-01
申请号:TW101142758
申请日:2012-11-16
Inventor: 賴志維 , LAI, CHIH WEI , 何明哲 , HO, MING CHE , 楊宗翰 , YANG, TZONG HANN , 汪青蓉 , WANG, CHIEN RHONE , 張家棟 , CHANG, CHIA TUNG , 郭宏瑞 , KUO, HUNG JUI , 劉重希 , LIU, CHUNG SHI
IPC: H01L23/522 , H01L23/538 , H01L21/768
CPC classification number: G06F17/5077 , G06F17/5072 , H01L23/488 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/034 , H01L2224/03912 , H01L2224/0401 , H01L2224/05016 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05552 , H01L2224/05572 , H01L2224/05666 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14132 , H01L2924/00014 , H01L2924/00012 , H01L2924/01047 , H01L2924/01029
Abstract: 本發明一實施例提供一種連接元件,包括:多個接點,位於一封裝組件的一頂面上,其中接點包括:一第一接點,具有一第一橫向尺寸;以及一第二接點,具有一第二橫向尺寸,其中第二橫向尺寸大於第一橫向尺寸,且第一橫向尺寸與第二橫向尺寸係由平行於封裝組件的一主表面的方向上量測而得的。
Abstract in simplified Chinese: 本发明一实施例提供一种连接组件,包括:多个接点,位于一封装组件的一顶面上,其中接点包括:一第一接点,具有一第一横向尺寸;以及一第二接点,具有一第二横向尺寸,其中第二横向尺寸大于第一横向尺寸,且第一横向尺寸与第二横向尺寸系由平行于封装组件的一主表面的方向上量测而得的。
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6.半導體元件的製作方法 METHOD OF FORMING SEMICONDUCTOR DEVICE 审中-公开
Simplified title: 半导体组件的制作方法 METHOD OF FORMING SEMICONDUCTOR DEVICE公开(公告)号:TW201230271A
公开(公告)日:2012-07-16
申请号:TW100115563
申请日:2011-05-04
Applicant: 台灣積體電路製造股份有限公司
IPC: H01L
CPC classification number: H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0345 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05027 , H01L2224/05166 , H01L2224/05181 , H01L2224/05186 , H01L2224/05572 , H01L2224/05647 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/1147 , H01L2224/1181 , H01L2224/11824 , H01L2224/11827 , H01L2224/11849 , H01L2224/1308 , H01L2224/13083 , H01L2224/13109 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/1357 , H01L2224/13583 , H01L2224/13693 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191 , H01L2224/81815 , H01L2224/94 , H01L2924/00014 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/01047 , H01L2924/01024 , H01L2924/01028 , H01L2924/0105 , H01L2924/01079 , H01L2924/04941 , H01L2924/04953 , H01L2924/01073 , H01L2924/01049 , H01L2924/0103 , H01L2924/01025 , H01L2924/01022 , H01L2924/01032 , H01L2924/01078 , H01L2924/01012 , H01L2924/01013 , H01L2924/0104 , H01L2924/01046 , H01L2924/01082 , H01L2924/01029 , H01L2924/01083 , H01L2924/01051 , H01L2224/03 , H01L2224/11 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
Abstract: 本發明一實施例提供一種半導體元件的製作方法,包括提供一基板,基板具有一接墊;形成一保護層延伸於基板上並具有一位於接墊上的開口;形成一金屬柱於接墊與部分保護層上;形成一焊料層於金屬柱上;以及使金屬柱的多個側壁與一有機化合物反應,以形成有機化合物的一自組裝單層於金屬柱的側壁上。
Abstract in simplified Chinese: 本发明一实施例提供一种半导体组件的制作方法,包括提供一基板,基板具有一接垫;形成一保护层延伸于基板上并具有一位于接垫上的开口;形成一金属柱于接垫与部分保护层上;形成一焊料层于金属柱上;以及使金属柱的多个侧壁与一有机化合物反应,以形成有机化合物的一自组装单层于金属柱的侧壁上。
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