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10 条记录 (耗时 0.011 秒)

    Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
    1.
    发明申请
    Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device 审中-公开
    用于冷却发热装置中所需热点的柔性流体输送的方法和装置

    公开(公告)号：US20050211427A1

    公开(公告)日：2005-09-29

    申请号：US10882142

    申请日：2004-06-29

    申请人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin

    发明人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin

    IPC分类号： G05D23/00

    CPC分类号： F28F3/048 ,  F28D15/0266 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

    摘要翻译： 一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为 被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。 多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。 歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。 热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

    Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
    3.
    发明申请
    Interwoven manifolds for pressure drop reduction in microchannel heat exchangers 审中-公开
    用于微通道热交换器中压降降低的交错歧管

    公开(公告)号：US20050211417A1

    公开(公告)日：2005-09-29

    申请号：US10881980

    申请日：2004-06-29

    申请人： Girish Upadhya ,  Thomas Kenny ,  Peng Zhou ,  Mark Munch ,  James Shook ,  Kenneth Goodson ,  David Corbin

    发明人： Girish Upadhya ,  Thomas Kenny ,  Peng Zhou ,  Mark Munch ,  James Shook ,  Kenneth Goodson ,  David Corbin

    IPC分类号： F04B19/00 ,  F28D15/02 ,  F28F3/12 ,  H01L23/473 ,  F28F7/00

    CPC分类号： H01L23/473 ,  F04B19/006 ,  F28D15/0266 ,  F28F3/12 ,  F28F13/185 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

    摘要翻译： 耦合到热源并被构造用于冷却热源的微通道热交换器，其包括用于将第一温度下的流体提供给热交换区域的第一组指状物，其中热交换区域中的流体朝向第二组手指流动， 在第二温度下离开热交换器，其中每个指状物与相邻手指分开适当的尺寸，以最小化热交换器中的压力降并平行布置。 微通道热交换器包括具有热交换区域的界面层。 优选地，歧管层包括第一组指状物，并且第二组指状物构造成用于冷却热源中的热点。 或者，界面层包括沿着热交换区域配置的第一组和第二组手指。

    Assembly including vertical and horizontal joined circuit panels
    6.
    发明申请
    Assembly including vertical and horizontal joined circuit panels 有权
    组装包括垂直和水平连接电路板

    公开(公告)号：US20050269693A1

    公开(公告)日：2005-12-08

    申请号：US11143201

    申请日：2005-06-02

    申请人： Ronald Green ,  Sridhar Krishnan ,  Stuart Wilson ,  James Shook ,  Ming Tsai ,  Andy Stavros

    发明人： Ronald Green ,  Sridhar Krishnan ,  Stuart Wilson ,  James Shook ,  Ming Tsai ,  Andy Stavros

    IPC分类号： H01L23/34 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

    CPC分类号： H05K3/368 ,  H05K1/145 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2201/10484

    摘要： An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

    摘要翻译： 提供了一种组件，其包括具有顶表面的第一电路板，设置在第一介电元件上的第一介电元件和第一导电迹线。 此外，第二电路板具有底表面，第二介电元件和设置在第二电介质元件上的第二导电迹线，其中第二电路板的至少一部分覆盖在第一电路板的至少一部分上。 该组件还包括具有第三电介质元件的互连电路板，第三电介质元件具有前表面，与前表面相对的后表面，在前表面和后表面之间延伸的顶端，在前表面和后表面之间延伸的底端，以及 布置在电介质元件上的多个互连迹线。 互连元件的底端邻接第一电路板的顶表面，并且顶端邻接第二电路板的底表面，其中至少一些第一导电迹线通过第二导电迹线与第二导电迹线导通连通 互连线。