COMPOSITE ADHESIVES
    5.
    发明申请

    公开(公告)号:US20250084198A1

    公开(公告)日:2025-03-13

    申请号:US18723907

    申请日:2023-03-01

    Abstract: Described herein is an adhesive composite composition. The composition comprises: a plurality of polymeric microspheres dispersed within a (meth)acrylate-based matrix, wherein the polymeric microspheres are derived from 20 to 99 wt % of a (meth)acrylate monomer having a Tg above room temperature and at least 1 wt % of a polar (meth)acrylate monomer; and the (meth)acrylate-based matrix is derived from a C1 to C20 (meth)acrylate ester monomer and at least 1 wt % of a (meth)acrylate macromer. In some embodiments, these composite adhesives show good impact resistance and good shear. In one embodiment, an ionic liquid is added to the adhesive composite composition to aid in electro-debonding of articles.

    UV-CURABLE TAPE
    7.
    发明公开
    UV-CURABLE TAPE 审中-公开

    公开(公告)号:US20240084125A1

    公开(公告)日:2024-03-14

    申请号:US18269720

    申请日:2021-12-23

    CPC classification number: C08L53/005 C08K7/16 C08L2205/18 C08L2312/00

    Abstract: A curable composition comprising 20 wt. % to 60 wt. %, optionally 30 wt. % to 58 wt. %, or optionally 40 wt. % to 55 wt. % of an acrylic block copolymer, 5 wt. % to 60 wt. %, optionally 20 wt. % to 50 wt. %, or optionally 15 wt. % to 45 wt. %, of an epoxy resin; 1 wt. % to 60 wt. %, optionally 5 wt. % to 50 wt. %, or optionally 15 wt. % to 45 wt. %, of a polyol; and 0.5 wt. % to 10 wt. %, optionally 0.75 wt. % to 8 wt. %, or optionally 1 wt. % to 5 wt. %, of a curing agent. The curable composition may be used to prepare a tape that is initially soft (i.e., low-modulus), which enables a water-tight seal during an electronics assembly process at ambient temperatures, and then cures after UV-activation into a more rigid (i.e., higher modulus) tape that has a desirable balance of impact resistance (both tensile and shear impact), dynamic shear resistance, and pushout resistance.

    COMPOSITE ADHESIVES
    8.
    发明申请

    公开(公告)号:US20250084244A1

    公开(公告)日:2025-03-13

    申请号:US18723704

    申请日:2023-02-28

    Abstract: Described herein is an adhesive composite composition. The composition comprises: a plurality of polymeric microspheres dispersed within a (meth)acrylate-based matrix, wherein the polymeric microspheres are derived from 20-100 wt % of a (meth)acrylate monomer having a Tg above room temperature; and the (meth)acrylate-based matrix is derived from a C1 to C20 (meth)acrylate ester monomer and a (meth)acrylate macromer. In some embodiments, these composite adhesives show good impact resistance and good shear.

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