-
公开(公告)号:US20040206373A1
公开(公告)日:2004-10-21
申请号:US10680616
申请日:2003-10-06
Applicant: Applied Materials, Inc.
Inventor: Bernardo Donoso , Tetsuya Ishikawa , Lily L. Pang , Svetlana Sherman
IPC: B08B003/02
CPC classification number: H01L21/67051 , B08B3/02 , C25D21/08 , H01L21/67028 , H01L21/67034
Abstract: Embodiments of the invention generally provide a substrate spin rinse dry cell that may be used in a semiconductor processing system. The cell generally includes a cell body defining an interior processing volume, and a rotatable substrate support member positioned in the processing volume. The rotatable substrate support member includes a rotatable hub assembly having a plurality of upstanding substrate engaging members extending therefrom, and a central member positioned radially inward of the plurality of upstanding substrate engaging members, the central member having a plurality of backside fluid dispensing nozzles and at least one backside gas dispensing nozzle positioned thereon. The cell further includes at least one frontside fluid dispensing nozzle positioned to dispense a rinsing fluid onto an upper surface of a substrate supported by the substrate support member, and at least one frontside gas dispensing nozzle positioned to dispense a drying gas into the processing volume, the drying gas being directed toward the upper substrate surface.
Abstract translation: 本发明的实施方案通常提供可用于半导体处理系统的底物旋转漂洗干细胞。 电池通常包括限定内部处理容积的电池体和位于处理容积中的可旋转衬底支撑构件。 可旋转的基板支撑构件包括可旋转的毂组件,其具有从其延伸的多个直立的基板接合构件和位于多个直立的基板接合构件的径向内侧的中心构件,中心构件具有多个后侧流体分配喷嘴 位于其上的至少一个后侧气体分配喷嘴。 细胞还包括至少一个前侧流体分配喷嘴,其定位成将冲洗流体分配到由基板支撑构件支撑的基板的上表面上,以及至少一个前侧气体分配喷嘴,其定位成将干燥气体分配到处理体积中, 干燥气体被引向上基板表面。
-
公开(公告)号:US20020117262A1
公开(公告)日:2002-08-29
申请号:US09797161
申请日:2001-02-28
Applicant: Applied Materials, Inc.
Inventor: Lily L. Pang , Thomas K. Cho , Tetsuya Ishikawa
IPC: C23F001/00 , C23C016/00
CPC classification number: C23C16/44 , Y10T16/532 , Y10T16/5323 , Y10T16/53238
Abstract: A semiconductor substrate processing chamber is disclosed generally comprising a chamber body that has a semiconductor substrate support assembly disposed in the chamber body. A lid assembly is movably coupled to the chamber body via a dual pivot hinge assembly. The hinge assembly provides two pivot points that minimize the abrasion and pinching of an o-ring disposed between the lid assembly and the chamber body upon closing of the lid assembly.
Abstract translation: 公开了一种半导体基板处理室,其通常包括具有设置在室主体中的半导体基板支撑组件的室主体。 盖组件通过双枢转铰链组件可移动地联接到腔室主体。 铰链组件提供两个枢轴点,其最小化在盖组件关闭时设置在盖组件和腔体之间的O形环的磨损和夹紧。
-
公开(公告)号:US20040206375A1
公开(公告)日:2004-10-21
申请号:US10826492
申请日:2004-04-16
Applicant: Applied Materials, Inc.
Inventor: Henry Ho , Lily L. Pang , Anh N. Nguyen , Alexander N. Lerner
IPC: B08B003/02
CPC classification number: H01L21/68 , B08B3/02 , H01L21/67034 , H01L21/67051 , H01L21/6838
Abstract: A method and apparatus for cleaning the bevel of a semiconductor substrate. The apparatus generally includes a cell body having upstanding walls and a fluid drain basin, a rotatable vacuum chuck positioned centrally positioned in the fluid drain basin, and at least 3 substrate centering members positioned at equal radial increments around the rotatable vacuum chuck. The substrate centering members include a vertically oriented shaft having a longitudinal axis extending therethrough, a cap member positioned over an upper terminating end of the shaft, a raised central portion formed onto the cap member, the raised central portion having a maximum thickness at a location the coincides with the longitudinal axis, and a substrate centering post positioned on the cap member radially outward of the raised central portion, an upper terminating end of the substrate centering post extending from the cap member to a distance that exceeds the maximum thickness. The apparatus further includes a centering actuation mechanism in communication with the substrate centering posts, and a fluid dispensing arm pivotally connected to the cell body, the fluid dispensing arm being configured to dispense a processing fluid onto a first side of the substrate.
Abstract translation: 一种用于清洁半导体衬底的斜面的方法和设备。 该装置通常包括具有直立壁的细胞体和流体排放盆,位于流体排放盆中心定位的可旋转真空吸盘,以及围绕可旋转真空吸盘以相等的径向增量定位的至少3个基体定心构件。 基板定心构件包括垂直定向的轴,其具有延伸穿过其中的纵向轴线;盖构件,其定位在所述轴的上终端上方;凸起中心部分形成在所述盖构件上,所述凸起中心部分在位置处具有最大厚度 与纵向轴线重合,以及定位在凸起中心部分的径向外侧的盖构件上的基板定心柱,该基板定心柱的上终端从盖构件延伸至超过最大厚度的距离。 所述装置还包括与所述基板定心柱连通的定心致动机构,以及可枢转地连接到所述电池体的流体分配臂,所述流体分配臂构造成将处理流体分配到所述基板的第一侧上。
-
公开(公告)号:US20040016637A1
公开(公告)日:2004-01-29
申请号:US10616284
申请日:2003-07-08
Applicant: APPLIED MATERIALS, INC.
Inventor: Michael X. Yang , Ming Xi , Russell C. Ellwanger , Eric B. Britcher , Bernardo Donoso , Lily L. Pang , Svetlana Sherman , Henry Ho , Anh N. Nguyen , Alexander N. Lerner , Allen L. D'Ambra , Arulkumar Shanmugasundram , Tetsuya Ishikawa , Yevgeniy Rabinovich , Dmitry Lubomirsky , Yeuk-Fai Edwin Mok , Son T. Nguyen
IPC: C25D017/00
CPC classification number: H01L21/6719 , A23D7/00 , A23D7/005 , A23D7/01 , A23J7/00 , B08B3/02 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02 , C25D21/02 , C25D21/08 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/6715 , H01L21/67196 , H01L21/6723 , H01L21/68 , H01L21/6838 , H01L21/68707
Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.
Abstract translation: 本发明的实施方案通常提供电化学电镀系统。 电镀系统包括位于与主机处理平台连通的基板装载站,位于主机上的至少一个基板镀覆单元,位于主机上的至少一个基板斜面清洁单元,以及与 主机和加载站中的至少一个,层叠基板退火站中的每个室具有加热板,冷却板和基板传送机器人。
-
公开(公告)号:US20020011204A1
公开(公告)日:2002-01-31
申请号:US09797214
申请日:2001-02-28
Applicant: Applied Materials, Inc.
Inventor: Rudolf Gujer , Thomas K. Cho , Lily L. Pang , Michael P. Karazim , Tetsuya Ishikawa
IPC: C23C016/00 , B05C013/02
CPC classification number: C23C16/4409 , C23C16/405 , C23C16/4401 , C23C16/4412 , C23C16/45561 , C23C16/4586
Abstract: A modular lift-pin assembly comprises a lift-pin having a distal end and a connector having a lift-pin end and an actuator end. The lift-pin end of the connector is coupled to the distal end of the lift-pin and an actuator pin is then coupled to the actuator end of the connector to actuate the lift-pin through the connector.
Abstract translation: 模块化提升销组件包括具有远端的提升销和具有提升销端和致动器端的连接器。 连接器的提升针端连接到提升销的远端,然后致动器销耦合到连接器的致动器端,以通过连接器致动提升销。
-
-
-
-