Vertical channel field effect transistor
    2.
    发明授权
    Vertical channel field effect transistor 失效
    垂直沟道场效应晶体管

    公开(公告)号:US4343015A

    公开(公告)日:1982-08-03

    申请号:US149936

    申请日:1980-05-14

    摘要: Improved high frequency GaAs FETs have a higher breakdown voltage, lower input gate capacitance and lower source (or drain) resistance. A preferentially etched groove structure yields parallel trapezoidal semiconductor fingers that are wider at the top than at the bottom. Every finger intersects a high resistivity, semi-insulating region which surrounds the active device area and is fabricated by high energy particle bombardment. Metal gates are deposited within the grooves on three sides of the trapezoidal fingers.

    摘要翻译: 改进的高频GaAs FET具有更高的击穿电压,较低的输入栅极电容和较低的源极(或漏极)电阻。 优先蚀刻的凹槽结构产生在顶部比底部更宽的平行梯形半导体指状物。 每个指状物与围绕有源器件区域的高电阻率半绝缘区域相交,并且通过高能量粒子轰击制造。 金属门沉积在梯形手指三侧的槽内。

    Bidirectional AC switching device with MOS-gated turn-on and turn-off
control
    3.
    发明授权
    Bidirectional AC switching device with MOS-gated turn-on and turn-off control 失效
    具有MOS门控开关控制的双向交流开关装置

    公开(公告)号:US5493134A

    公开(公告)日:1996-02-20

    申请号:US338392

    申请日:1994-11-14

    摘要: A bidirectional semiconductor switching device includes a semiconductor substrate having first and second device terminals on opposite faces thereof, a thyristor in the substrate for providing regenerative conduction in a first direction, between the first device terminal and the second device terminal, and an insulated-gate bipolar junction transistor (IGBT) in the substrate for providing nonregenerative conduction in a second opposite direction, between the second device terminal and the first device terminal. In particular, the switching device includes first and second adjacent trenches therein at a face and respective first and second insulated-gate field effect transistors (IGFETs) in the trenches for providing gate-controlled turn-on and turn-off of the thyristor and the IGBT, by being electrically connected in series therewith.

    摘要翻译: 一种双向半导体开关器件,包括:在其相对面上具有第一和第二器件端子的半导体衬底,用于在第一器件端子和第二器件端子之间的第一方向上提供再生传导的衬底中的晶闸管,以及绝缘栅极 在第二器件端子和第一器件端子之间在第二相反方向提供非再生导通的衬底中的双极结型晶体管(IGBT)。 特别地,开关器件包括位于其中的第一和第二相邻沟槽以及沟槽中的相应的第一和第二绝缘栅场效应晶体管(IGFET),用于提供栅极控制的晶闸管的导通和截止,以及 IGBT通过与其串联电连接。

    Method for forming a p-n junction in silicon carbide
    4.
    发明授权
    Method for forming a p-n junction in silicon carbide 失效
    在碳化硅中形成p-n结的方法

    公开(公告)号:US5318915A

    公开(公告)日:1994-06-07

    申请号:US8203

    申请日:1993-01-25

    IPC分类号: H01L21/04 H01L21/20

    CPC分类号: H01L21/046 Y10S438/931

    摘要: A method for forming a p-n junction in silicon carbide includes the steps of amorphizing a portion of a monocrystalline silicon carbide substrate, implanting dopant ions into the amorphous portion of the substrate and then recrystallizing the amorphous portion to thereby form a substantially monocrystalline region including the dopant ions. In particular, the amorphizing step includes the steps of masking an area on the face of the monocrystalline silicon carbide substrate and then directing electrically inactive ions to the masked area so that an amorphous region in the substrate is formed. Accordingly, the amorphous region has sidewalls extending to the face that are substantially orthogonal to the bottom edge of the amorphous region. Once the amorphized region is defined, electrically active dopant ions are implanted into the amorphous region. The dopant ions are then diffused into the amorphous region and become uniformly distributed. Next, the doped amorphized region is recrystallized to obtain a substantially monocrystalline doped region. If the region surrounding the recrystallized region are of opposite conductivity type, a vertically walled p-n junction is formed.

    摘要翻译: 用于在碳化硅中形成pn结的方法包括以下步骤:将单晶碳化硅衬底的一部分非晶化,将掺杂剂离子注入到衬底的非晶部分中,然后使非晶部分重结晶,从而形成包括掺杂剂的基本单晶区域 离子。 特别地,非晶化步骤包括以下步骤:掩蔽单晶碳化硅衬底的表面上的区域,然后将非活性离子引导到掩蔽区域,从而形成衬底中的非晶区域。 因此,非晶区域具有延伸到基本上正交于非晶区域的底部边缘的面的侧壁。 一旦定义了非晶化区域,则将电活性掺杂剂离子注入非晶区域。 然后掺杂剂离子扩散到非晶区域并变得均匀分布。 接下来,掺杂的非晶化区域被重结晶以获得基本单晶掺杂区域。 如果再结晶区域周围的区域具有相反的导电型,则形成垂直壁的p-n结。

    Unit cell arrangement for emitter switched thyristor with base
resistance control
    5.
    发明授权
    Unit cell arrangement for emitter switched thyristor with base resistance control 失效
    用于具有基极电阻控制的发射极开关晶闸管的单元电池布置

    公开(公告)号:US5294816A

    公开(公告)日:1994-03-15

    申请号:US897456

    申请日:1992-06-10

    摘要: An emitter switched thyristor with base resistance control for preventing parasitic latch-up includes a P-N-P-N main thyristor with an N.sup.+ floating emitter for MOS-gated controlled turn-on and a lateral P-channel MOSFET for shunting hole current in a second base region to a P.sup.+ diverting region electrically connected to the cathode. The P-channel MOSFET is enabled by the application of a negative gate voltage to form a P-type inversion layer between the second base region and the P.sup.+ diverter region, thus reducing the resistance between the cathode and the second base region and raising the holding current of the emitter switched thyristor to above the operating current level. The formation of an alternative current path to the cathode has the further effect of reducing the forward bias across the base-emitter junction of an adjacent parasitic thyristor to thereby prevent the sustained regenerative action of the parasitic thyristor.

    摘要翻译: 具有用于防止寄生闩锁的基极电阻控制的发射极开关晶闸管包括具有用于MOS门控控制导通的N +浮置发射极的PNPN主晶闸管和用于在第二基极区中的分流电流的侧向P沟道MOSFET P +转移区电连接到阴极。 P沟道MOSFET通过施加负栅极电压来使能,以在第二基极区域和P +转移区域之间形成P型反型层,从而减小阴极和第二基极区域之间的电阻并且提高保持 发射极开关晶闸管的电流高于工作电流电平。 形成到阴极的替代电流路径具有减小相邻寄生晶闸管的基极 - 发射极结两端的正向偏压的进一步的效果,从而防止寄生晶闸管的持续再生作用。

    Power rectifier with trenches
    6.
    发明授权
    Power rectifier with trenches 失效
    电源整流器带沟槽

    公开(公告)号:US4982260A

    公开(公告)日:1991-01-01

    申请号:US415850

    申请日:1989-10-02

    摘要: A semiconductor power rectifier attains low forward voltage drop, low reverse leakage current and improved switching speed by utilizing Schottky contact regions in a p-i-n rectifier along with other means for reducing the required forward bias voltage. In a preferred embodiment, the other means for reducing the required forward bias voltage includes a respective trench between each respective pair of successively spaced current interruption means.

    摘要翻译: 半导体功率整流器通过利用p-i-n整流器中的肖特基接触区域以及用于减少所需正向偏置电压的其它装置,获得低正向压降,低反向漏电流和提高的开关速度。 在优选实施例中,用于减小所需正向偏置电压的另一种装置包括在每个相应的一对连续间隔的电流中断装置之间的相应沟槽。

    MOS-pilot structure for an insulated gate transistor
    8.
    发明授权
    MOS-pilot structure for an insulated gate transistor 失效
    绝缘栅晶体管的MOS引导结构

    公开(公告)号:US4980740A

    公开(公告)日:1990-12-25

    申请号:US329034

    申请日:1989-03-27

    CPC分类号: H01L29/1095 H01L29/7395

    摘要: A MOS-pilot structure for an IGT device consisting of a multiplicity of IGT cells interconnected in a lattice network includes a plurality of pilot emitter electrodes each in electrical contact with only at least one pilot emitter region of a first plurality of the multiplicity of IGT cells and electrically isolated from a common cathode electrode of the multiplicity of IGT cells. The plurality of pilot emitter electrodes are each electrically connected to a contact metal strip deposited on the substrate surface and spaced therefrom by a layer of insulation. The contact metal strip is connected to ground potential through a sense resistor for producing a sense voltage responsive only to the channel currents flowing through the at least one pilot emitter regions; therefore, a MOS pilot structure that utilizes only the MOS channel current to produce the sense voltage to cause turn-off of the IGT device at a large total current is disclosed. The MOS-pilot structure does not suffer from the avalanche breakdown problems during turn-off, that are associated with other prior art IGT pilot structures.

    Insulated gate transistor with vertical integral diode and method of
fabrication
    9.
    发明授权
    Insulated gate transistor with vertical integral diode and method of fabrication 失效
    具有垂直积分二极管的绝缘栅晶体管及其制造方法

    公开(公告)号:US4933740A

    公开(公告)日:1990-06-12

    申请号:US243211

    申请日:1988-09-09

    IPC分类号: H01L29/06 H01L29/739

    CPC分类号: H01L29/0696 H01L29/7393

    摘要: An improved lateral insulated gate transistor includes a dual function anode and employs specially configured anode and cathode regions within the drift layer to promote lateral current flow. A vertical diode is disposed between a substrate cathode and anode of the device. Under forward bias conditions, the device exhibits insulated gate controlled conduction, and under reverse bias conditions, the device exhibits conduction between the substrate cathode and anode of the vertical diode.

    摘要翻译: 改进的横向绝缘栅晶体管包括双功能阳极,并且在漂移层内采用特别配置的阳极和阴极区域以促进横向电流流动。 垂直二极管设置在器件的衬底阴极和阳极之间。 在正向偏置条件下,器件表现出绝缘栅极控制导通,并且在反向偏置条件下,器件在垂直二极管的衬底阴极和阳极之间呈现导通。

    Vertical double diffused metal oxide semiconductor (VDMOS) device
including high voltage junction exhibiting increased safe operating area
    10.
    发明授权
    Vertical double diffused metal oxide semiconductor (VDMOS) device including high voltage junction exhibiting increased safe operating area 失效
    垂直双扩散金属氧化物半导体(VDMOS)器件包括高压结,表现出更大的安全工作面积

    公开(公告)号:US4823176A

    公开(公告)日:1989-04-18

    申请号:US33952

    申请日:1987-04-03

    摘要: A power field effect device has a high voltage blocking junction which intersects the device surface under the gate electrode. That intersection is a closed plane geometric figure whose center is within the body region of the device rather than in the more heavily doped base region of the device. The figure preferably is everywhere convex and has a maximum width of substantially less than the depletion width, at breakdown, of a corresponding parallel plane junction. The device breakdown voltage is higher than the breakdown voltage of a corresponding junction having a cylindrical edge with a straight axis. In a preferred embodiment, the high voltage blocking junction has a plurality of such intersections with the device surface, each situated beneath a segment of the gate electrode. In a bipolar embodiment, the gate electrode may be omitted.

    摘要翻译: 功率场效应器件具有与栅电极下方的器件表面相交的高电压阻挡连接。 该交点是一个闭平面几何图形,其中心在器件的体区内,而不是器件的更高掺杂的基极区域内。 该图优选地是凸起的,并且具有基本上小于相应的平行平面结的击穿时的耗尽宽度的最大宽度。 器件击穿电压高于具有直轴的圆柱形边缘的对应连接点的击穿电压。 在优选实施例中,高电压阻塞连接点具有与器件表面的多个这样的交点,每个交点位于栅电极的一段的下方。 在双极实施例中,可以省略栅电极。