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1.发明申请Fabricating method of semiconductor package and heat-dissipating structure applicable thereto 审中-公开适用于其的半导体封装和散热结构的制造方法公开(公告)号：US20080251910A1
公开(公告)日：2008-10-16
申请号：US12082718
申请日：2008-04-11
CPC分类号： H01L21/56 , H01L23/4334 , H01L2224/73253 , H01L2924/01019 , H01L2924/01079
摘要： A method for fabricating semiconductor packages is disclosed, including mounting and electrically connecting a semiconductor chip onto a chip carrier; mounting a heat-dissipating structure on the semiconductor chip; placing the heat-dissipating structure into a mold cavity for filling therein a packaging material to form an encapsulant, wherein the heat-dissipating structure has a heat spreader having a size larger than that of the predetermined size of the semiconductor package, a covering layer formed on the, and a plurality of protrusions formed on edges of the covering layer that are free from being corresponding in position to the semiconductor chip, such that the protrusions can abut against a top surface of the mold cavity to prevent the heat spreader from being warped; and finally performing a singulation process according to the predetermined size and removing the encapsulant formed on the covering layer to form the desired semiconductor package. Also, this invention discloses a heat-dissipating structure applicable to the method described above.
摘要翻译： 公开了一种用于制造半导体封装的方法，包括将半导体芯片安装并电连接到芯片载体上; 在半导体芯片上安装散热结构; 将散热结构放置在模腔中，用于在其中填充包装材料以形成密封剂，其中散热结构具有尺寸大于半导体封装的预定尺寸的散热器，形成覆盖层 以及在覆盖层的边缘上形成的多个突起，其不与半导体芯片的位置相对应，使得突起可抵靠模腔的顶表面以防止散热器翘曲 ; 最后按照规定的尺寸进行分割处理，除去覆盖层上形成的密封剂，形成所需的半导体封装。 此外，本发明公开了一种适用于上述方法的散热结构。
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公开(公告)号：US07608915B2
公开(公告)日：2009-10-27
申请号：US12151902
申请日：2008-05-08
申请人： Chun-Ming Liao , Chien-Ping Huang , Ho-Yi Tsai , Cheng-Hsu Hsiao
发明人： Chun-Ming Liao , Chien-Ping Huang , Ho-Yi Tsai , Cheng-Hsu Hsiao
IPC分类号： H01L23/495 , H01J23/10
CPC分类号： H01L23/4334 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A heat dissipation semiconductor package includes a chip carrier, a semiconductor chip, a heat conductive adhesive, a heat dissipation member, and an encapsulant. The semiconductor chip is flip-chip mounted on the chip carrier and defined with a heat conductive adhesive mounting area. Periphery of the heat adhesive mounting area is spaced apart from edge of the semiconductor chip. The heat dissipation member is mounted on the heat conductive adhesive formed in the heat conductive adhesive mounting area. The encapsulant formed between the chip carrier and the heat dissipation member encapsulates the semiconductor chip and the heat conductive adhesive, and embeds edges of the active surface and non-active surface and side edge of the semiconductor chip, thereby increasing bonding area between the encapsulant and the semiconductor chip. The side edges of the heat conductive adhesive and the semiconductor chip are not flush with each other, thereby preventing propagation of delamination.
摘要翻译： 散热半导体封装包括芯片载体，半导体芯片，导热粘合剂，散热构件和密封剂。 半导体芯片倒装芯片安装在芯片载体上，并用导热粘合剂安装区域限定。 热粘合剂安装区域的周边与半导体芯片的边缘间隔开。 散热构件安装在形成在导热粘合剂安装区域中的导热粘合剂上。 形成在芯片载体和散热构件之间的密封剂封装半导体芯片和导热粘合剂，并且嵌入半导体芯片的有源表面和非有源表面和侧边缘的边缘，从而增加密封剂和 半导体芯片。 导热粘合剂和半导体芯片的侧边缘彼此不齐平，从而防止分层的蔓延。
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公开(公告)号：US20080277777A1
公开(公告)日：2008-11-13
申请号：US12151902
申请日：2008-05-08
申请人： Chun-Ming Liao , Chien-Ping Huang , Ho-Yi Tsai , Cheng-Hsu Hsiao
发明人： Chun-Ming Liao , Chien-Ping Huang , Ho-Yi Tsai , Cheng-Hsu Hsiao
IPC分类号： H01L23/36
CPC分类号： H01L23/4334 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A heat dissipation semiconductor package includes a chip carrier, a semiconductor chip, a heat conductive adhesive, a heat dissipation member, and an encapsulant. The semiconductor chip is flip-chip mounted on the chip carrier and defined with a heat conductive adhesive mounting area. Periphery of the heat adhesive mounting area is spaced apart from edge of the semiconductor chip. The heat dissipation member is mounted on the heat conductive adhesive formed in the heat conductive adhesive mounting area. The encapsulant formed between the chip carrier and the heat dissipation member encapsulates the semiconductor chip and the heat conductive adhesive, and embeds edges of the active surface and non-active surface and side edge of the semiconductor chip, thereby increasing bonding area between the encapsulant and the semiconductor chip. The side edges of the heat conductive adhesive and the semiconductor chip are not flush with each other, thereby preventing propagation of delamination.
摘要翻译： 散热半导体封装包括芯片载体，半导体芯片，导热粘合剂，散热构件和密封剂。 半导体芯片倒装芯片安装在芯片载体上，并用导热粘合剂安装区域限定。 热粘合剂安装区域的周边与半导体芯片的边缘间隔开。 散热构件安装在形成在导热粘合剂安装区域中的导热粘合剂上。 形成在芯片载体和散热构件之间的密封剂封装半导体芯片和导热粘合剂，并且嵌入半导体芯片的有源表面和非有源表面和侧边缘的边缘，从而增加密封剂和 半导体芯片。 导热粘合剂和半导体芯片的侧边缘彼此不齐平，从而防止分层的蔓延。
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4.发明申请公开(公告)号：US20080157346A1
公开(公告)日：2008-07-03
申请号：US11796320
申请日：2007-04-26
申请人： Min-Shun Hung , Ho-Yi Tsai , Chien-Ping Huang , Chun-Ming Liao , Cheng-Hsu Hsiao
发明人： Min-Shun Hung , Ho-Yi Tsai , Chien-Ping Huang , Chun-Ming Liao , Cheng-Hsu Hsiao
CPC分类号： H01L21/565 , H01L23/4334 , H01L24/16 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating a heat-dissipating package and a heat-dissipating structure applicable thereto are disclosed. The method includes: mounting and electrically connecting to a chip carrier a semiconductor chip mounted with a heat-dissipating structure; disposing on the heat-dissipating structure a covering layer protrudingly formed with an abutting portion surrounding the covering layer, wherein the size of the heat-dissipating structure is greater than the predetermined one of the package to position the chip carrier in a cavity of a mold and encapsulate the heat-dissipating structure and semiconductor chip by encapsulant, and the protruding portion abuts against a top surface of the cavity and prevent the heat-dissipating structure from warping; and singulating the package and removing the encapsulant from the covering layer thereunder according to the predetermined size of the package.
摘要翻译： 公开了一种制造散热封装的方法和可应用的散热结构。 该方法包括：将安装有散热结构的半导体芯片安装并电连接到芯片载体; 在所述散热结构上设置突出地形成有围绕所述覆盖层的邻接部分的覆盖层，其中所述散热结构的尺寸大于所述封装中的预定的尺寸，以将所述芯片载体定位在模具的空腔中 并且通过密封剂封装散热结构和半导体芯片，并且突出部分抵靠空腔的顶表面并防止散热结构翘曲; 并且根据包装的预定尺寸对包装进行分离并从其下面的覆盖层去除密封剂。
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公开(公告)号：US20080122070A1
公开(公告)日：2008-05-29
申请号：US11986359
申请日：2007-11-21
IPC分类号： H01L23/373 , H01L21/58
CPC分类号： H01L23/3128 , H01L21/568 , H01L23/4334 , H01L24/16 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/16152 , H01L2224/0401
摘要： A heat dissipating semiconductor package and a fabrication method therefor are provided. The fabrication method for the heat dissipating semiconductor package mainly includes steps of: containing a substrate having a chip mounted thereon in an aperture of a carrier; mounting a heat dissipating sheet having supporting portions on the carrier with the heat dissipating sheet being attached on the chip; forming an encapsulant to encapsulate the semiconductor chip and the heat dissipating structure; removing a part of the encapsulant above the heat dissipating sheet with a part of the heat dissipating sheet exposed from the encapsulant by lapping; and forming a cover layer on the part of heat dissipating sheet to prevent it from oxidation; and cutting along a predetermined size of the semiconductor package, thereby heat generated from an operation of the chip is dissipated via the heat dissipating structure.
摘要翻译： 提供一种散热半导体封装及其制造方法。 用于散热半导体封装的制造方法主要包括以下步骤：将载置有孔的芯片安装在其上; 将散热板安装在载体上，并将散热板安装在芯片上; 形成密封剂以封装半导体芯片和散热结构; 通过研磨从所述密封剂暴露出的部分所述散热片去除所述散热片上方的所述密封剂的一部分; 在散热片的一部分上形成覆盖层以防止其氧化; 并且沿着预定尺寸的半导体封装进行切割，由此从芯片的操作产生的热量经由散热结构消散。
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公开(公告)号：US20080122071A1
公开(公告)日：2008-05-29
申请号：US11986362
申请日：2007-11-21
IPC分类号： H01L23/373
CPC分类号： H01L23/3128 , H01L21/568 , H01L23/4334 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/15311
摘要： A heat dissipating semiconductor package and the fabrication method therefor are provided. The fabrication method for the heat dissipating semiconductor package mainly includes steps of: containing a substrate having a chip mounted thereon in an aperture of a carrier, wherein the carrier has an electroconductive layer; allowing a heat dissipating structure having supporting portions to be mounted on and electrically connected to the electroconductive layer of the carrier via the supporting portions thereof while heat dissipating structure being mounted on the chip; after an encapsulation process and removing a part of the encapsulant above the heat dissipating sheet by lapping to expose a surface of the heat dissipating structure from the encapsulant, depositing and forming a metal passivation layer on the surface of the heat dissipating structure by electroplating for preventing the heat dissipating structure from oxidizing.
摘要翻译： 提供一种散热半导体封装及其制造方法。 用于散热半导体封装的制造方法主要包括以下步骤：在载体的孔中容纳其上安装有芯片的基板，其中载体具有导电层; 允许散热结构，其具有支撑部分，其安装在载体的导电层上并通过其支撑部分电连接，同时散热结构安装在芯片上; 在封装工艺之后并且通过研磨去除散热片上方的一部分密封剂，以从密封剂暴露出散热结构的表面，在散热结构的表面上沉积和形成金属钝化层，通过电镀防止 散热结构从氧化。
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公开(公告)号：US20070138632A1
公开(公告)日：2007-06-21
申请号：US11642439
申请日：2006-12-19
IPC分类号： H01L23/34
CPC分类号： H05K3/3452 , H05K3/284 , H05K3/303 , H05K2201/0989 , H05K2201/10636 , H05K2201/10727 , H05K2201/2036 , Y02P70/611 , Y02P70/613
摘要： An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. An opening is formed in the protective layer to expose at least three sides of each of the paired bond pads. The protective layer includes at least one independent residual portion located in the opening and between the paired bond pads, such that an electronic component is mounted on the independent residual portion and electrically connected to the bond pads. A groove without a dead space is formed between the electronic component and the carrier, such that a molding compound for encapsulating the electronic component can flow through the groove to fill the opening and a space under the electronic component and encapsulate the at least three sides of each of the bond pads.
摘要翻译： 提供电子载体板及其封装结构。 电子载板包括载体，形成在载体上的至少一对接合焊盘和覆盖载体的保护层。 在保护层中形成开口以暴露每个配对接合焊盘的至少三个侧面。 保护层包括至少一个独立的残留部分，位于开口内和成对的接合焊盘之间，使得电子部件安装在独立的残留部分上并电连接到接合焊盘。 在电子部件和载体之间形成没有死空间的凹槽，使得用于封装电子部件的模制化合物可以流过凹槽以填充开口和电子部件下方的空间，并将至少三个侧面 每个接合垫。
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公开(公告)号：US07348211B2
公开(公告)日：2008-03-25
申请号：US11117158
申请日：2005-04-27
申请人： Ying-Ren Lin , Ho-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
发明人： Ying-Ren Lin , Ho-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
CPC分类号： H01L21/565 , H01L21/568 , H01L23/3128 , H01L24/48 , H01L2224/16225 , H01L2224/16227 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating semiconductor packages is proposed. A plurality of substrates each having a chip thereon are prepared. Each substrate has similar length and width to the predetermined length and width of the semiconductor package. A carrier having a plurality of openings is prepared. Each opening is larger in length and width than the substrate. The substrates are positioned in the corresponding openings, and gaps between the substrates and the carrier are sealed. A molding process is performed to form an encapsulant over each opening to encapsulate the chip. An area on the carrier covered by the encapsulant is larger in length and width than the opening. After performing a mold-releasing process, a plurality of the semiconductor packages are formed by a singulation process to cut along substantially edges of each substrate according to the predetermined size of the semiconductor package. A waste of substrate material is avoided.
摘要翻译： 提出了制造半导体封装的方法。 制备各自具有芯片的多个基板。 每个衬底具有与半导体封装的预定长度和宽度相似的长度和宽度。 制备具有多个开口的载体。 每个开口的长度和宽度大于衬底。 基板定位在相应的开口中，基板和载体之间的间隙被密封。 执行成型工艺以在每个开口上形成密封剂以封装芯片。 由密封剂覆盖的载体上的区域的长度和宽度大于开口的宽度。 在执行脱模工艺之后，通过单片化工艺形成多个半导体封装，以根据半导体封装的预定尺寸沿着每个衬底的大致边缘切割。 避免了衬底材料的浪费。
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公开(公告)号：US20060292741A1
公开(公告)日：2006-12-28
申请号：US11471516
申请日：2006-06-21
IPC分类号： H01L21/00
CPC分类号： H01L23/3128 , H01L21/561 , H01L23/4334 , H01L24/48 , H01L24/97 , H01L2224/16 , H01L2224/48227 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/351 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A heat-dissipating semiconductor package and a fabrication method thereof are provided. A semiconductor chip is mounted and electrically connected to a substrate. A heat-dissipating structure includes a heat sink and at least one supporting portion, wherein the supporting portion is attached to the substrate at a position outside a predetermined package area for the semiconductor package, and the semiconductor chip is disposed under the heat sink. An encapsulant is formed on the substrate to encapsulate the semiconductor chip and the heat-dissipating structure, wherein a projection area of the encapsulant on the substrate is larger in size than the predetermined package area. A cutting process is performed along edges of the predetermined package area to remove parts of the encapsulant, the supporting portion and the substrate, which are located outside the predetermined package area, so as to form the semiconductor package integrated with the heat-dissipating structure.
摘要翻译： 提供散热半导体封装及其制造方法。 半导体芯片安装并电连接到基板。 散热结构包括散热器和至少一个支撑部分，其中支撑部分在用于半导体封装的预定封装区域外的位置处附接到基板，并且半导体芯片设置在散热器下方。 在基板上形成密封剂以封装半导体芯片和散热结构，其中密封剂在基板上的投影面积大于预定封装面积。 沿着预定包装区域的边缘进行切割处理以去除位于预定包装区域外部的密封剂，支撑部分和基底的部分，以形成与散热结构集成的半导体封装。
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公开(公告)号：US20050287707A1
公开(公告)日：2005-12-29
申请号：US11117158
申请日：2005-04-27
申请人： Ying-Ren Lin , Ho-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
发明人： Ying-Ren Lin , Ho-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
CPC分类号： H01L21/565 , H01L21/568 , H01L23/3128 , H01L24/48 , H01L2224/16225 , H01L2224/16227 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating semiconductor packages is proposed. A plurality of substrates each having a chip thereon are prepared. Each substrate has similar length and width to the predetermined length and width of the semiconductor package. A carrier having a plurality of openings is prepared. Each opening is larger in length and width than the substrate. The substrates are positioned in the corresponding openings, and gaps between the substrates and the carrier are sealed. A molding process is performed to form an encapsulant over each opening to encapsulate the chip. An area on the carrier covered by the encapsulant is larger in length and width than the opening. After performing a mold-releasing process, a plurality of the semiconductor packages are formed by a singulation process to cut along substantially edges of each substrate according to the predetermined size of the semiconductor package. A waste of substrate material is avoided.
摘要翻译： 提出了制造半导体封装的方法。 制备各自具有芯片的多个基板。 每个衬底具有与半导体封装的预定长度和宽度相似的长度和宽度。 制备具有多个开口的载体。 每个开口的长度和宽度大于衬底。 基板定位在相应的开口中，基板和载体之间的间隙被密封。 执行成型工艺以在每个开口上形成密封剂以封装芯片。 由密封剂覆盖的载体上的区域的长度和宽度大于开口的宽度。 在执行脱模工艺之后，通过单片化工艺形成多个半导体封装，以根据半导体封装的预定尺寸沿着每个衬底的大致边缘切割。 避免了衬底材料的浪费。
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