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公开(公告)号：US12219708B2
公开(公告)日：2025-02-04
申请号：US17883648
申请日：2022-08-09
Applicant: CYNTEC CO., LTD.
Inventor： Chien Ming Chen , Da-Jung Chen
Abstract: An electronic module, comprising an inductor, a first circuit board, and a second circuit board, wherein the first circuit board is disposed on a lateral surface of the body of the inductor with at least one electronic device being disposed on the first circuit board, wherein the second circuit board is disposed under the body of the inductor and electrically connected to the inductor.
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公开(公告)号：US10199361B2
公开(公告)日：2019-02-05
申请号：US16021026
申请日：2018-06-28
Applicant: CYNTEC CO., LTD.
Inventor： Chi-Feng Huang , Bau-Ru Lu , Da-Jung Chen
Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.
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公开(公告)号：US20180308829A1
公开(公告)日：2018-10-25
申请号：US16021026
申请日：2018-06-28
Applicant: CYNTEC CO., LTD.
Inventor： Chi-Feng Huang , Bau-Ru Lu , Da-Jung Chen
CPC classification number: H01L25/16 , H05K1/181 , H05K1/188 , H05K3/284 , H05K3/3405 , H05K3/3421 , H05K2201/086 , H05K2201/1003 , H05K2201/10166 , H05K2201/10515 , H05K2203/0415
Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.
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公开(公告)号：US09451701B2
公开(公告)日：2016-09-20
申请号：US14594083
申请日：2015-01-10
Applicant: CYNTEC CO., LTD.
Inventor： Da-Jung Chen , Chun-Tiao Liu , Bau-Ru Lu
IPC: H05K7/00 , H05K1/18 , H01L23/64 , H01L25/16 , H01F27/24 , H01F27/29 , H01F27/40 , H01F27/02 , H05K3/34 , H01L23/24 , H01L23/31 , H01L23/552 , H01L23/00
CPC classification number: H05K1/181 , H01F27/022 , H01F27/027 , H01F27/24 , H01F27/29 , H01F27/40 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K3/3421 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
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公开(公告)号：US08837168B2
公开(公告)日：2014-09-16
申请号：US13754910
申请日：2013-01-31
Applicant: Cyntec Co., Ltd.
Inventor： Da-Jung Chen , Chau-Chun Wen , Chun-Tiao Liu
IPC: H05K7/18 , H05K3/30 , H05K1/18 , H01L23/64 , H01L25/16 , H01F27/29 , H05K9/00 , H01L23/24 , H01L23/31 , H01L23/552 , H01F27/02 , H05K3/34
CPC classification number: H05K1/18 , H01F27/027 , H01F27/29 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H05K1/181 , H05K3/30 , H05K3/3421 , H05K9/00 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49071 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.
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Patent Agency Ranking
公开(公告)号：US11153973B2
公开(公告)日：2021-10-19
申请号：US16592786
申请日：2019-10-04
Applicant: CYNTEC CO., LTD.
Inventor： Kaipeng Chiang , Da-Jung Chen , Bau-Ru Lu , Chun Hsien Lu
Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.
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公开(公告)号：US11017934B2
公开(公告)日：2021-05-25
申请号：US15835486
申请日：2017-12-08
Applicant: CYNTEC CO., LTD.
Inventor： Bau-Ru Lu , Chun Hsien Lu , Da-Jung Chen
IPC: H01F27/02 , H01F27/28 , H01F41/00 , H01F27/32 , H01F27/36 , H01F27/24 , H01F17/04 , H05K1/11 , H05K1/14 , H05K1/18
Abstract: The present invention discloses an electronic module. The electronic module comprises: a substrate, having a top surface and a bottom surface; a plurality of coils on the top surface of the substrate, wherein each coil comprises a corresponding first end and a corresponding second end; and a molding body, disposed on the substrate to encapsulate said coils, wherein said corresponding first end and said corresponding second end of each coil are electrically coupled to a corresponding first electrode and a corresponding second electrode of the electronic module.
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公开(公告)号：US10991681B2
公开(公告)日：2021-04-27
申请号：US16779660
申请日：2020-02-02
Applicant: CYNTEC CO., LTD.
Inventor： Da-Jung Chen , Chun-Tiao Liu , Chau-Chun Wen
IPC: H01L25/16 , H01L23/495 , H01L23/552 , H01L23/04 , H01L23/498 , H01L23/64 , H01L23/00 , H01L25/10
Abstract: A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The three-dimensional package structure is applicable to a POL, (Point of Load) converter.
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公开(公告)号：US20200176429A1
公开(公告)日：2020-06-04
申请号：US16779660
申请日：2020-02-02
Applicant: CYNTEC CO., LTD.
Inventor： Da-Jung Chen , Chun-Tiao Liu , Chau-Chun Wen
IPC: H01L25/16 , H01L23/64 , H01L23/498 , H01L23/495 , H01L23/04 , H01L23/552
Abstract: A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The three-dimensional package structure is applicable to a POL, (Point of Load) converter.
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公开(公告)号：US20180166200A1
公开(公告)日：2018-06-14
申请号：US15835486
申请日：2017-12-08
Applicant: CYNTEC CO., LTD.
Inventor： Bau-Ru Lu , Chuh Hsien Lu , Da-Jung Chen
CPC classification number: H01F27/022 , H01F17/04 , H01F27/24 , H01F27/28 , H01F27/2823 , H01F27/32 , H01F27/36 , H01F41/00 , H05K1/111 , H05K1/115 , H05K1/144 , H05K1/181 , H05K2201/041 , H05K2201/09063 , H05K2201/10015 , H05K2201/1003 , H05K2201/10522 , H05K2201/10545
Abstract: The present invention discloses an electronic module. The electronic module comprises: a substrate, having a top surface and a bottom surface; a plurality of coils on the top surface of the substrate, wherein each coil comprises a corresponding first end and a corresponding second end; and a molding body, disposed on the substrate to encapsulate said coils, wherein said corresponding first end and said corresponding second end of each coil are electrically coupled to a corresponding first electrode and a corresponding second electrode of the electronic module.
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