摘要:
A semiconductor device includes a semiconductor substrate including a P-type semiconductor region, and an N channel MOSFET formed in the P-type semiconductor region, the N channel MOSFET including an insulating film of silicon oxide film or silicon oxynitride film formed on the semiconductor substrate, a gate insulating film including hafnium and formed on the insulating film, a lanthanum oxide film having a film thickness not larger than a predetermined value and formed between the gate insulating film and insulating film, and a gate electrode including a titanium nitride film having a N/Ti atomic ratio less than 1.
摘要翻译:半导体器件包括包括P型半导体区域的半导体衬底和形成在P型半导体区域中的N沟道MOSFET,N沟道MOSFET包括形成在半导体衬底上的氧化硅膜或氧氮化硅膜的绝缘膜 包括铪并形成在所述绝缘膜上的栅极绝缘膜,形成在所述栅极绝缘膜和绝缘膜之间的膜厚度不大于预定值的氧化镧膜,以及包括氮化钛膜的栅电极,所述氮化钛膜具有 N / Ti原子比小于1。
摘要:
A first adjusting metal, capable of varying the threshold voltage of a first-conductivity-type transistor of a complementary transistor, is added to the first-conductivity-type transistor and a second-conductivity-type transistor at the same time, and a diffusion suppressive element, capable of suppressing diffusion of the first adjusting metal, is added from above a metal gate electrode of the second-conductivity-type transistor.
摘要:
A barium strontium titanate is the ferroelectric substance with the perovskite structure available for a capacitor as a dielectric layer, and is crystallized through a high temperature heat treatment, in which the barium strontium titanate is further subjected to a low temperature heat treatment under the crystallizing temperature of the barium strontium titanate for eliminating impurities such as carbon and hydrogen therefrom so that the leakage current is drastically reduced.
摘要:
A method of manufacturing a semiconductor device having a p-type field effect transistor and an n-type field effect transistor includes the steps of: forming an interface insulating layer and a high-permittivity layer on a substrate in the stated order; forming a pattern of a sacrifice layer on the high-permittivity layer; forming a metal-containing film containing metal elements therein on the high-permittivity layer in a first region where the sacrifice layer is formed and a second region where no sacrifice layer is formed; introducing the metal elements into an interface between the interface insulating layer and the high-permittivity layer in the second region by conducting a heat treatment; and removing the sacrifice layer by wet etching, wherein in the removing step, the sacrifice layer is etched easily more than the high-permittivity layer. With this configuration, the semiconductor device excellent in reliability is obtained.
摘要:
There is provided a semiconductor device comprising a dielectric film made of a high dielectric constant material, in which a leak current is reduced in the film and which exhibits improved device reliability. Specifically, a dielectric film 142 is a metal-compound film having a composition represented by the formula MOxCyNz wherein x, y and z meet the conditions: 0
摘要:
This invention provides a magnetic head device to be incorporated in a hard disc drive device which can minimize the fluctuations in the height of a floating head slider between the outer periphery and inner periphery of a magnetic disc and which has stable floating characteristics over the whole recording area thereof. The magnetic head device includes a head arm which is attached within a hard disc drive device in a rotatable/swingable manner and a head slider fixed on an end of a suspension member extending from the head arm, wherein the distance between the rotational center of the head arm to the center of the head slider and the position of the center of the rotation of the head arm are so determined to satisfy the relation, −0.1≦(D−L)≦0.6 W−4.4 when the distance between the rotational center of the head arm and the center of a magnetic disc is given as D, the distance from the rotational center of the head arm to the center of the head slider as L, and the width of the recording area on radius of the magnetic disc as W.
摘要:
A semiconductor device having a logic section and a memory section that are formed on the same semiconductor chip, including: a first transistor formed in the logic section and having gate electrodes and source and drain regions, and a second transistor formed in the memory section having gate electrodes, source and drain regions and a capacitor, the capacitor being of a MIM structure and having an upper and a lower metal electrode and a capacitor dielectric film sandwiched therebetween, the capacitor dielectric film being formed of a dielectric material which is selected from the group consisting of ZrO2, Hf92, (Zrx, Hf1-x)O2 (0
摘要:
A method of manufacturing a semiconductor device such as a semiconductor memory device having a thin film capacitor. The thin film capacitor is formed by sequentially stacking a lower electrode of noble metal, a high dielectric constant insulating film and an upper electrode of noble metal. After forming said capacitor, a first annealing process is performed in an atmosphere including hydrogen and, thereafter, a second annealing process is performed in an atmosphere which does not include hydrogen at a temperature equal to or lower than a temperature of said first annealing process. The first annealing process is performed, for example, in a mixed gas including hydrogen and nitrogen. The second annealing process is performed, for example, in an atmosphere including at least one selected from a group consisting of nitrogen gas, inert gas and oxygen gas.
摘要:
A capacitor is provided that is optimal for use in DRAM and has high dielectric constant, and allows leakage current flowing therethrough to be maintained at a low level, and further, permits dependence of the leakage current on temperatures to be small. That is, capacitor openings are formed in an inter layer silicon oxide layer and a TiN film is patterned so that TiN films are left only within the openings to form lower electrodes within the openings. Subsequently, a Zr- and/or Hf-containing oxide film (represented by the formula, multicomponent Zr.sub.x.Hf.sub.1-x.O.sub.2 film (0≦x≦1)) formed from a metal-containing organic compound as a reactant and a Ti-containing oxide film are laminated to form capacitor dielectrics. After deposition of the Zr- and/or Hf-containing oxide film, the Zr- and/or Hf-containing oxide film is subjected to heat treatment to be performed in an oxidizing ambient to remove residual carbon being retained in the Zr- and/or Hf-containing oxide film, leading to formation of a capacitor that is optimal for use in DRAM and has high dielectric constant, and allows leakage current flowing therethrough to be maintained at a low level.
摘要翻译:提供了一种电容器,其优选用于DRAM并具有高介电常数,并且允许流过其的漏电流保持在低水平,并且还允许漏电流对温度的依赖性较小。 也就是说,电容器开口形成在层间氧化硅层中,并且TiN膜被图案化,使得TiN膜仅留在开口内以在开口内形成下电极。 随后,由一种由ZrO和/或Hf组成的Zr和/或Hf的氧化物膜(由式表示的多组分Zr.sub.Hf-xO.2薄膜(0 <= x <= 1)) 含金属的有机化合物作为反应物和含Ti氧化物膜层压以形成电容器电介质。 在沉积含Zr和/或Hf的氧化物膜之后,对含Zr和/或Hf的氧化物膜进行热处理以在氧化环境中进行,以除去保留在Zr和/ 或含Hf氧化物膜,导致形成最适用于DRAM并具有高介电常数的电容器,并允许流过其中的漏电流保持在低水平。
摘要:
The method for fabricating a semiconductor device in accordance with the present invention has the steps of: forming a metal film as a lower electrode of a capacitor on a semiconductor substrate, followed by forming a capacity insulator film over the lower electrode by the ALCVD process; and forming an upper electrode of the capacitor on the capacity insulator film.