Method for forming capacitor
    7.
    发明授权
    Method for forming capacitor 失效
    电容器形成方法

    公开(公告)号:US06875667B2

    公开(公告)日:2005-04-05

    申请号:US10680217

    申请日:2003-10-08

    摘要: A capacitor is provided that is optimal for use in DRAM and has high dielectric constant, and allows leakage current flowing therethrough to be maintained at a low level, and further, permits dependence of the leakage current on temperatures to be small. That is, capacitor openings are formed in an inter layer silicon oxide layer and a TiN film is patterned so that TiN films are left only within the openings to form lower electrodes within the openings. Subsequently, a Zr- and/or Hf-containing oxide film (represented by the formula, multicomponent Zr.sub.x.Hf.sub.1-x.O.sub.2 film (0≦x≦1)) formed from a metal-containing organic compound as a reactant and a Ti-containing oxide film are laminated to form capacitor dielectrics. After deposition of the Zr- and/or Hf-containing oxide film, the Zr- and/or Hf-containing oxide film is subjected to heat treatment to be performed in an oxidizing ambient to remove residual carbon being retained in the Zr- and/or Hf-containing oxide film, leading to formation of a capacitor that is optimal for use in DRAM and has high dielectric constant, and allows leakage current flowing therethrough to be maintained at a low level.

    摘要翻译: 提供了一种电容器,其优选用于DRAM并具有高介电常数,并且允许流过其的漏电流保持在低水平,并且还允许漏电流对温度的依赖性较小。 也就是说,电容器开口形成在层间氧化硅层中,并且TiN膜被图案化,使得TiN膜仅留在开口内以在开口内形成下电极。 随后,由一种由ZrO和/或Hf组成的Zr和/或Hf的氧化物膜(由式表示的多组分Zr.sub.Hf-xO.2薄膜(0 <= x <= 1)) 含金属的有机化合物作为反应物和含Ti氧化物膜层压以形成电容器电介质。 在沉积含Zr和/或Hf的氧化物膜之后,对含Zr和/或Hf的氧化物膜进行热处理以在氧化环境中进行,以除去保留在Zr和/ 或含Hf氧化物膜,导致形成最适用于DRAM并具有高介电常数的电容器,并允许流过其中的漏电流保持在低水平。