公开(公告)号：US20150158116A1

公开(公告)日：2015-06-11

申请号：US14558324

申请日：2014-12-02

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Haibin Zhang ,  Mathew Rekow ,  Chuan Yang ,  Michael J. Darwin

IPC: B23K26/00 ,  B23K26/30

CPC classification number: B23K26/009 ,  B23K26/0006 ,  B23K26/083 ,  B23K26/0876 ,  B23K26/50 ,  B23K26/53 ,  B23K26/55 ,  B23K37/0235 ,  B23K2103/50 ,  H01L23/544 ,  Y10T428/24364

Abstract: A method for laser processing provides a coating material (130) applied to a rough surface (42) of a substrate (44) to mitigate adverse optical effects that would be caused by roughness of the surface (42). Laser pulses (52) of the laser output of suitable parameters can be directed and focused to internally mark the substrate (44) material without damaging the rough surface (42) after passing through the coating material (130).

Abstract translation: 一种用于激光加工的方法提供了施加到基底（44）的粗糙表面（42）上的涂层材料（130），以减轻由表面（42）的粗糙度引起的不良光学效应。 激光输出的合适参数的激光脉冲（52）可以被引导和聚焦，以在通过涂层材料（130）之后不损坏粗糙表面（42）来内部标记衬底（44）材料。

公开(公告)号：US20160250714A1

公开(公告)日：2016-09-01

申请号：US15055037

申请日：2016-02-26

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Haibin Zhang ,  Chuan Yang ,  Mark Alan Unrath ,  Martin Orrick

IPC: B23K26/0622 ,  B23K26/06 ,  B23K26/352 ,  B23K26/00

Abstract: A laser processing system includes a first positioning system (1044) for imparting first relative movement of a beam axis along a beam trajectory (1062) with respect to a workpiece (1060), a processor for determining a second relative movement of the beam axis (1061) along a plurality of dither rows, a second positioning system (1042) for imparting the second relative movement, and a laser source (1046) for emitting laser beam pulses. The laser beam pulses of individually selected energies can be directed to individually selected transverse spot locations (5310) one or more times during a primary laser pass to permit three-dimensional patterning. The laser beam pulses can also be directed to the spatially identical, overlapping, or non-overlapping neighboring spot area locations on the workpiece in a temporally nonsequential order.

Abstract translation: 激光处理系统包括用于相对于工件（1060）沿光束轨迹（1062）传递光束轴线的第一相对运动的第一定位系统（1044），用于确定光束轴的第二相对运动的处理器 1061），用于施加第二相对运动的第二定位系统（1042）和用于发射激光束脉冲的激光源（1046）。 单独选择的能量的激光束脉冲可以在主激光通过期间被引导到单独选择的横向光斑位置（5310）一次或多次以允许三维图案化。 激光束脉冲也可以以时间上不连续的顺序被引导到工件上的空间上相同，重叠或非重叠的相邻斑点区域位置。

公开(公告)号：US10507544B2

公开(公告)日：2019-12-17

申请号：US15055037

申请日：2016-02-26

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Haibin Zhang ,  Chuan Yang ,  Mark Alan Unrath ,  Martin Orrick

IPC: B23K26/36 ,  B23K26/0622 ,  B23K26/06

Abstract: A laser processing system includes a first positioning system (1044) for imparting first relative movement of a beam axis along a beam trajectory (1062) with respect to a workpiece (1060), a processor for determining a second relative movement of the beam axis (1061) along a plurality of dither rows, a second positioning system (1042) for imparting the second relative movement, and a laser source (1046) for emitting laser beam pulses. The laser beam pulses of individually selected energies can be directed to individually selected transverse spot locations (5310) one or more times during a primary laser pass to permit three-dimensional patterning. The laser beam pulses can also be directed to the spatially identical, overlapping, or non-overlapping neighboring spot area locations on the workpiece in a temporally nonsequential order.

公开(公告)号：US20190001442A1

公开(公告)日：2019-01-03

申请号：US15750140

申请日：2016-09-08

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Mark Unrath ,  Chuan Yang ,  Jan Kleinert ,  Mark Peeples ,  Hugh Owens ,  Gwendolyn Byrne ,  Haibin Zhang ,  Justin Redd ,  Corie Neufeld ,  James D. Brookhyser ,  Yasu Osako ,  Mehmet Alpay ,  Zhibin Lin ,  Patrick Riechel ,  Tim Nuckolls ,  Hisashi Matsumoto ,  Chris Ryder

IPC: B23K26/382 ,  B23K26/082 ,  B23K26/70 ,  B23K26/0622

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.

公开(公告)号：US09463528B2

公开(公告)日：2016-10-11

申请号：US14461171

申请日：2014-08-15

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Robert Reichenbach ,  Chuan Yang ,  Fang Shan

IPC: B32B3/02 ,  B23K26/00 ,  B23K26/08

CPC classification number: B23K26/0624 ,  B23K26/0006 ,  B23K26/082 ,  B23K26/0823 ,  B23K26/083 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/0876 ,  B23K26/53 ,  B23K26/57 ,  B23K2101/007 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/14 ,  B23K2103/15 ,  B23K2103/56 ,  Y10T428/24802

Abstract: Laser output (114) is employed to mark an article (100) including a layer (104) supported by a substrate (102), wherein the layer (104) has a thickness (t) that is less than or equal to 50 microns. The laser output (114) is focused to a numerical aperture diffraction-limited spot size (32) of less than or equal to 5 microns at a focal point (80) of the beam waist (90) and directed into the layer (104) to form a plurality of structures comprising a plurality of laser-induced cracks within the layer (104) and within a region of the article (100), wherein the laser-induced cracks terminate within the layer (104) without extending to the substrate (102) or an outer surface (108) of the layer (104), and wherein the plurality of structures are configured to scatter light incident upon the article (100).

Abstract translation: 激光输出（114）用于标记包括由衬底（102）支撑的层（104）的制品（100），其中该层（104）的厚度（t）小于或等于50微米。 在束腰（90）的焦点（80）处将激光输出（114）聚焦到小于或等于5微米的数值孔径衍射限制光斑尺寸（32）并被引导到层（104）中， 以形成在层（104）内并且在制品（100）的区域内包括多个激光诱发的裂纹的多个结构，其中激光诱发的裂纹终止于层（104）内而不延伸到基底 102）或所述层（104）的外表面（108），并且其中所述多个结构被配置为散射入射在所述物品（100）上的光。