Abstract:
A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.
Abstract:
A piezoelectric component includes an electromechanical transducer with two first electrodes and a second electrode. The second electrode is arranged between the two first electrodes. The transducer also includes a first main side, a second main side, opposite from the first main side, and a first longitudinal side. A first contiguous metallization layer is arranged on a first partial region of the first main side and on a partial region of the first longitudinal side adjacent to the first partial region of the first main side. Here, the partial region of the first longitudinal side is kept at a sufficient distance from a side edge facing the second main side and the partial region electrically contacts the at least two first electrodes.
Abstract:
A multi-layer component (1) is specified, comprising a main body (2) with an external contact (3) arranged thereon, a further contact (5) for electrically contacting the multi-layer component (1), and a connecting element (4) for connecting the external contact (3) and the further contact (5), wherein the connecting element (4) is embodied in such a way that a decoupling of mechanical stresses that occur in the further contact (5) from the external contact (3) is brought about.
Abstract:
A method for producing a multilayer carrier body is disclosed. A method for producing a multilayer carrier body. The method includes producing films by printing a first area of each film with a first paste and printing a second area of the film with a second paste. The method also includes stacking the films and laminating the films.
Abstract:
A component carrier includes a multi-layer carrier body having a substrate containing a structured functional. The substrate extends both laterally and also at least partially above and below the functional region. Alternatively, or in addition, the substrate extends both laterally and also completely above and/or below the functional region. Alternatively, or in addition, the substrate or a further region is arranged in or extends into the functional region.
Abstract:
A component carrier includes a multi-layer carrier body having a substrate containing a structured functional. The substrate extends both laterally and also at least partially above and below the functional region. Alternatively, or in addition, the substrate extends both laterally and also completely above and/or below the functional region. Alternatively, or in addition, the substrate or a further region is arranged in or extends into the functional region.
Abstract:
A method for producing an electrical contact is disclosed. In an embodiment the method includes providing a piezoelectric component that includes an electromechanical transducer having two first electrodes and a second electrode arranged between the two first electrodes and spaced from the two first electrodes by a piezoelectric material, the transducer further including a first main side, a second main side opposite from the first main side and a first longitudinal side, and forming a contiguous metallization layer onto a first partial region of the first main side and onto a second partial region along the first longitudinal side, so that the second partial region along the first longitudinal side is at a distance from a side edge facing the second main side and the metallization layer in the second partial region of the first longitudinal side contacts the two first electrodes in an electrically conducting manner.
Abstract:
A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.