Bipolar semiconductor device and manufacturing method

    公开(公告)号:US10566462B2

    公开(公告)日:2020-02-18

    申请号:US12512285

    申请日:2009-07-30

    IPC分类号: H01L29/861

    摘要: A bipolar semiconductor device and method are provided. One embodiment provides a bipolar semiconductor device including a first semiconductor region of a first conductivity type having a first doping concentration, a second semiconductor region of a second conductivity type forming a pn-junction with the first semiconductor region, and a plurality of third semiconductor regions of the first conductivity type at least partially arranged in the first semiconductor region and having a doping concentration which is higher than the first doping concentration. Each of the third semiconductor regions is provided with at least one respective junction termination structure.

    Reverse Conducting IGBT
    3.
    发明申请
    Reverse Conducting IGBT 审中-公开
    反向导通IGBT

    公开(公告)号:US20130341673A1

    公开(公告)日:2013-12-26

    申请号:US13529166

    申请日:2012-06-21

    IPC分类号: H01L29/739

    摘要: A semiconductor device includes a first emitter region of a first conductivity type, a second emitter region of a second conductivity type complementary to the first conductivity type, and a drift region of the second conductivity type arranged in a semiconductor body. The first and second emitter regions are arranged between the drift region and a first electrode and are each connected to the first electrode. A device cell of a cell region includes a body region of the first conductivity type adjoining the drift region, a source region of the second conductivity type adjoining the body region, and a gate electrode adjacent the body region and dielectrically insulated from the body region by a gate dielectric. A second electrode is electrically connected to the source region and the body region. A floating parasitic region of the first conductivity type is disposed outside the cell region.

    摘要翻译: 半导体器件包括第一导电类型的第一发射极区域,与第一导电类型互补的第二导电类型的第二发射极区域和布置在半导体本体中的第二导电类型的漂移区域。 第一和第二发射极区域布置在漂移区域和第一电极之间并且各自连接到第一电极。 单元区域的器件单元包括邻接漂移区的第一导电类型的主体区域,与身体区域邻接的第二导电类型的源极区域和与身体区域相邻并且与身体区域电介质绝缘的栅电极, 栅极电介质。 第二电极电连接到源区域和身体区域。 第一导电类型的浮置寄生区域设置在单元区域的外部。

    Semiconductor device having a floating semiconductor zone
    4.
    发明授权
    Semiconductor device having a floating semiconductor zone 有权
    具有浮动半导体区的半导体器件

    公开(公告)号:US08482062B2

    公开(公告)日:2013-07-09

    申请号:US13610240

    申请日:2012-09-11

    IPC分类号: H01L29/66

    摘要: A semiconductor device includes a first trench and a second trench extending into a semiconductor body from a surface. A body region of a first conductivity type adjoins a first sidewall of the first trench and a first sidewall of the second trench, the body region including a channel portion adjoining to a source structure and being configured to be controlled in its conductivity by a gate structure. The channel portion is formed at the first sidewall of the second trench and is not formed at the first sidewall of the first trench. An electrically floating semiconductor zone of the first conductivity type adjoins the first trench and has a bottom side located deeper within the semiconductor body than the bottom side of the body region.

    摘要翻译: 半导体器件包括从表面延伸到半导体本体中的第一沟槽和第二沟槽。 第一导电类型的主体区域邻接第一沟槽的第一侧壁和第二沟槽的第一侧壁,主体区域包括邻近源极结构的沟道部分,并且被配置为通过栅极结构来控制其导电性 。 通道部分形成在第二沟槽的第一侧壁处,并且不形成在第一沟槽的第一侧壁处。 第一导电类型的电浮动半导体区域邻接第一沟槽,并且具有位于半导体本体内比底体区域的底侧更深的底侧。

    IGBT device and related device having robustness under extreme conditions
    8.
    发明授权
    IGBT device and related device having robustness under extreme conditions 有权
    IGBT器件及相关器件在极端条件下具有鲁棒性

    公开(公告)号:US07696600B2

    公开(公告)日:2010-04-13

    申请号:US11713226

    申请日:2007-03-02

    IPC分类号: H01L29/10 H01L29/72

    摘要: A semiconductor device in the form of an IGBT has a front side contact, a rear side contact, and a semiconductor volume disposed between the front side contact and the rear side contact. The semiconductor volume includes a field stop layer for spatially delimiting an electric field that can be formed in the semiconductor volume. The semiconductor volume further includes a plurality of semiconductor zones, the plurality of semiconductor zones spaced apart from each other and each inversely doped with respect to adjacent areas. The plurality of semiconductor zones are located within the field stop layer.

    摘要翻译: IGBT形式的半导体器件具有前侧触点,后侧触点和设置在前侧触点和后侧触点之间的半导体体。 半导体体积包括用于空间地限定可以形成在半导体体积中的电场的场停止层。 半导体体积还包括多个半导体区域,多个半导体区域彼此间隔开并且相对于相邻区域反向掺杂。 多个半导体区域位于场停止层内。

    Trench diffusion isolation in semiconductor devices
    9.
    发明授权
    Trench diffusion isolation in semiconductor devices 有权
    半导体器件中的沟槽扩散隔离

    公开(公告)号:US07541260B2

    公开(公告)日:2009-06-02

    申请号:US11677430

    申请日:2007-02-21

    IPC分类号: H01L21/76

    CPC分类号: H01L29/0634 H01L29/66727

    摘要: A semiconductor structure is formed comprising a plurality of columns doped with alternating dopants. The columns are separated by trenches, and the dopant is diffused in the doped columns. The trenches are filled with semiconductor material. Other embodiments may be described and claimed.

    摘要翻译: 形成包括掺杂有交替掺杂剂的多个列的半导体结构。 这些列由沟槽分开,并且掺杂剂在掺杂柱中扩散。 沟槽填充有半导体材料。 可以描述和要求保护其他实施例。