摘要:
A method of manufacturing a wafer level package is disclosed. The method may include stacking an insulation layer over a wafer substrate; processing a via hole in the insulation layer; forming a seed layer over the insulation layer; forming a plating resist, which is in a corresponding relationship with a redistribution pattern, over the seed layer; forming the redistribution pattern, which includes a terminal for external contact, by electroplating; and coupling a conductive ball to the terminal. As multiple redistribution layers can be formed using inexpensive PCB processes, the manufacturing costs can be reduced, and the stability and efficiency of the process can be increased.
摘要:
A method of manufacturing a wafer level package is disclosed. The method may include stacking an insulation layer over a wafer substrate; processing a via hole in the insulation layer; forming a seed layer over the insulation layer; forming a plating resist, which is in a corresponding relationship with a redistribution pattern, over the seed layer; forming the redistribution pattern, which includes a terminal for external contact, by electroplating; and coupling a conductive ball to the terminal. As multiple redistribution layers can be formed using inexpensive PCB processes, the manufacturing costs can be reduced, and the stability and efficiency of the process can be increased.
摘要:
Disclosed are a solder attachment jig and a method of manufacturing a semiconductor device using the same. The solder ball attachment jig, which arranges a solder ball to be aligned with a conductive post of a semiconductor wafer, can include a body and a receiving hole, which is formed on the body to hold the solder ball. Internal walls of the receiving hole that face each other are symmetrically inclined. Using the solder ball attachment jig in accordance with an embodiment of the present invention, the alignment of the solder ball can be improved while reducing the cost and simplifying the processes.
摘要:
A printed circuit board and a manufacturing method of the printed circuit board are disclosed. The printed circuit board includes: a first insulation layer having a first pattern formed thereon; a first trench caved in one surface of the first insulation layer along at least a portion of the first pattern; and a second insulation layer stacked on one surface of the first insulation layer so as to cover the first pattern. The first trench is filled by the second insulation layer.
摘要:
A printed circuit board and a manufacturing method of the printed circuit board are disclosed. The printed circuit board includes: a first insulation layer having a first pattern formed thereon; a first trench caved in one surface of the first insulation layer along at least a portion of the first pattern; and a second insulation layer stacked on one surface of the first insulation layer so as to cover the first pattern. The first trench is filled by the second insulation layer.
摘要:
In one embodiment, a motion vector for a current block is generated based on motion vector information for a block in a second picture layer and motion vector difference information associated with the current block. The second picture layer has lower quality pictures than pictures in the first picture layer, and the block of the second picture layer being temporally associated with the current block in the first picture layer. The current block is reconstructed using the generated motion vector and a reference picture.
摘要:
In one embodiment, the method includes parsing data from a data stream for the first picture layer into a sequence of data blocks on a cycle-by-cycle basis such that at least one data block earlier in the sequence is skipped during a cycle if a data block later in the sequence includes an empty data location closer to DC components than in the earlier data block. A motion vector pointing to a reference block for at least one of the data blocks is generated based on motion vector information for a block in a second picture layer and motion vector difference information associated with the data block. The second picture layer represents lower quality pictures than pictures represented by the first picture layer, and the block of the second picture layer is temporally associated with the data block in the first picture layer. An image block is reconstructed based on the data block and the reference block.
摘要:
The present invention pertains to a package module of a battery protection circuit, and the package module of the battery protection circuit according to the present invention comprises: a first internal connection terminal area and a second internal connection terminal area, which are respectively disposed at both edge parts thereof, and in which first and second internal connection terminals connected to a battery can provided with a bare cell are respectively disposed; an external connection terminal area, which is adjacent to the first internal connection terminal area, and in which a plurality of external connection terminals are disposed; and a protection circuit area comprising a device area in which a plurality of passive devices forming the battery protection circuit are disposed and a chip area, which is adjacent to the device area, and in which a protection IC and a dual FET chip forming the battery protection circuit are disposed, are disposed between the external connection terminal area and the second internal connection terminal area, and has a packaged structure to expose the plurality of external connection terminals on the upper surface thereof and expose the first internal connection terminal and the second internal connection terminal on the lower surface thereof. According to the present invention, a manufacturing process is minimized when compared with existing methods requiring a separate module manufacturing process, and a battery pack is easily formed and is able to be miniaturized and integrated.
摘要:
In one embodiment, data from a data stream is parsed into a sequence of data blocks on a cycle-by-cycle basis such that at least one data block earlier in the sequence is skipped during a cycle if a data block later in the sequence includes an empty data location closer to DC components than in the earlier data block. In another embodiment, the method includes parsing data from a sequence of data blocks into a data stream on a cycle-by-cycle basis such that at least one data block earlier in the sequence is skipped during a cycle if data closer to DC components exists in a data block later in the sequence.
摘要:
One embodiment provides a method of generating a motion vector associated with a current block in a first picture layer. In this embodiment, motion vector information for a block in a second picture layer is obtained. The second picture layer has lower quality pictures than pictures in the first picture layer, and the block of the second picture layer is temporally associated with the current block in the first picture layer. Motion vector difference information associated with the current block in the first picture layer is also obtained. The motion vector associated with the current block in the first picture layer is generated based on the obtained motion vector information and the obtained motion vector difference information.