公开(公告)号：US09589922B2

公开(公告)日：2017-03-07

申请号：US14214962

申请日：2014-03-16

Applicant: Infineon Technologies AG

Inventor： Christian Neugirg ,  Andreas Grassmann ,  Wolfram Hable ,  Ottmar Geitner ,  Frank Winter ,  Alexander Schwarz ,  Inpil Yoo

IPC: H01L23/373 ,  H01L23/00

CPC classification number: H01L23/3733 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/373 ,  H01L23/49833 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/181 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.

Abstract translation: 提供一种电子模块，其包括第一载体; 电子芯片，其包括至少一个电子部件并且布置在所述第一载体上; 间隔元件，包括布置在所述电子芯片上并与所述至少一个电子部件导热连接的表面; 布置在间隔元件上的第二载体; 以及至少部分地包围所述电子芯片和所述间隔元件的模具化合物; 其中所述间隔元件包括具有与至少一个其它CTE匹配的CTE值的材料。

公开(公告)号：US09275926B2

公开(公告)日：2016-03-01

申请号：US13886284

申请日：2013-05-03

Applicant: Infineon Technologies AG

Inventor： Wolfram Hable ,  Andreas Grassmann ,  Frank Winter ,  Ottmar Geitner ,  Alexander Schwarz ,  Alexander Herbrandt ,  Lothar Koenig ,  Andre Uhlemann

IPC: H01L23/34 ,  H01L21/50 ,  H01L23/00 ,  H01L23/373 ,  H01L23/433 ,  H01L23/467 ,  H01L23/473 ,  H01L25/07

CPC classification number: H01L23/34 ,  H01L21/50 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/467 ,  H01L23/473 ,  H01L24/33 ,  H01L24/36 ,  H01L24/40 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099 ,  H01L2224/37599

Abstract: According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid.

Abstract translation: 根据示例性实施例，提供了一种功率模块，其包括半导体芯片，包括导电片的接合衬底和直接附接到导电片并且热耦合到半导体芯片的电绝缘片，以及 直接连接到导电片的冷却结构的阵列，并被配置为当与冷却流体相互作用时从半导体芯片移除热量。

公开(公告)号：US20170154835A1

公开(公告)日：2017-06-01

申请号：US15432680

申请日：2017-02-14

Applicant: Infineon Technologies AG

Inventor： Christian Neugirg ,  Andreas Grassmann ,  Wolfram Hable ,  Ottmar Geitner ,  Frank Winter ,  Alexander Schwarz ,  Inpil Yoo

IPC: H01L23/373 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/3733 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/373 ,  H01L23/49833 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/181 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.

公开(公告)号：US20160056088A1

公开(公告)日：2016-02-25

申请号：US14826629

申请日：2015-08-14

Applicant: Infineon Technologies AG

Inventor： Andre Uhlemann ,  Christoph Koch ,  Alexander Schwarz

IPC: H01L23/473 ,  H01L23/492 ,  H01L23/498 ,  B23K9/00 ,  B23K1/00 ,  B23K20/12 ,  B23K20/22 ,  B23K26/21 ,  B23K26/323 ,  H01L23/373 ,  B23K9/23

CPC classification number: H01L23/473 ,  B23K1/00 ,  B23K9/0026 ,  B23K9/232 ,  B23K20/129 ,  B23K20/22 ,  B23K26/21 ,  B23K26/323 ,  B23K2103/18 ,  H01L23/3736 ,  H01L23/4924 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cold plate includes a single piece member and a channel. A top side of the channel is open. A bottom side of the channel opposite the top side has an inlet and an outlet.

Abstract translation: 冷板包括单件件和通道。 频道的顶端是开放的。 通道的与顶侧相对的底侧具有入口和出口。

公开(公告)号：US20160021780A1

公开(公告)日：2016-01-21

申请号：US14797304

申请日：2015-07-13

Applicant: Infineon Technologies AG

Inventor： Alexander Schwarz

IPC: H05K7/20 ,  H05K1/09 ,  H05K1/03 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K7/205 ,  H01L23/13 ,  H01L23/15 ,  H01L23/367 ,  H01L23/49838 ,  H01L2224/32225 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/303 ,  H05K2201/066 ,  H05K2201/09009 ,  H05K2201/09036 ,  H05K2201/09745

Abstract: A semiconductor module includes a carrier having a first carrier surface and a second carrier surface opposite the first carrier surface, a first semiconductor chip mounted over the first carrier surface and a heatsink coupled to the second carrier surface with a first heatsink surface facing the carrier. The second carrier surface or the first heatsink surface has at least one cavity in the form of one or more of dimples and trenches.

Abstract translation: 半导体模块包括具有第一载体表面和与第一载体表面相对的第二载体表面的载体，安装在第一载体表面上的第一半导体芯片和耦合到第二载体表面的散热器，其具有面向载体的第一散热器表面。 第二载体表面或第一散热表面具有凹坑和沟槽中的一个或多个形式的至少一个空腔。

公开(公告)号：US20150085446A1

公开(公告)日：2015-03-26

申请号：US14034669

申请日：2013-09-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Wolfram Hable ,  Andreas Grassmann ,  Frank Winter ,  Ottmar Geitner ,  Alexander Schwarz ,  Alexander Herbrandt

IPC: H05K1/02 ,  H05K3/32 ,  H05K1/03

CPC classification number: H05K1/021 ,  H01L21/4882 ,  H01L23/051 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/467 ,  H01L23/473 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0306 ,  H05K3/32 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

Abstract: In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.

Abstract translation: 在各种实施例中，提供基板。 衬底可以包括：陶瓷载体，其具有与第一侧相对的第一侧和第二侧; 设置在陶瓷载体的第一侧上的第一金属层; 设置在陶瓷载体的第二侧上的第二金属层; 以及形成在第二金属层中或上方的冷却结构。

公开(公告)号：US09585241B2

公开(公告)日：2017-02-28

申请号：US14034669

申请日：2013-09-24

Applicant: Infineon Technologies AG

Inventor： Wolfram Hable ,  Andreas Grassmann ,  Frank Winter ,  Ottmar Geitner ,  Alexander Schwarz ,  Alexander Herbrandt

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/32 ,  H01L23/31 ,  H01L23/373 ,  H01L21/48 ,  H05K1/03 ,  H01L23/467 ,  H01L23/473 ,  H01L23/498

CPC classification number: H05K1/021 ,  H01L21/4882 ,  H01L23/051 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/467 ,  H01L23/473 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0306 ,  H05K3/32 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

Abstract: In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.

Abstract translation: 在各种实施例中，提供基板。 衬底可以包括：陶瓷载体，其具有与第一侧相对的第一侧和第二侧; 设置在陶瓷载体的第一侧上的第一金属层; 设置在陶瓷载体的第二侧上的第二金属层; 以及形成在第二金属层中或上方的冷却结构。

公开(公告)号：US20140327127A1

公开(公告)日：2014-11-06

申请号：US13886284

申请日：2013-05-03

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Wolfram HABLE ,  Andreas Grassmann ,  Frank Winter ,  Ottmar Geitner ,  Alexander Schwarz ,  Alexander Herbrandt ,  Lothar Koenig ,  Andre Uhlemann

IPC: H01L23/34 ,  H01L21/50

CPC classification number: H01L23/34 ,  H01L21/50 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/467 ,  H01L23/473 ,  H01L24/33 ,  H01L24/36 ,  H01L24/40 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099 ,  H01L2224/37599

Abstract: According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid.

Abstract translation: 根据示例性实施例，提供了一种功率模块，其包括半导体芯片，包括导电片的接合衬底和直接附接到导电片并且热耦合到半导体芯片的电绝缘片，以及 直接连接到导电片的冷却结构的阵列，并被配置为当与冷却流体相互作用时从半导体芯片移除热量。

公开(公告)号：US20140291832A1

公开(公告)日：2014-10-02

申请号：US13852141

申请日：2013-03-28

Applicant: Infineon Technologies AG

Inventor： Alexander Schwarz

IPC: H01L23/46 ,  H01L21/48 ,  H01L23/473

CPC classification number: H01L23/473 ,  H01L21/4871 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor module is disclosed having at least one power semiconductor device, wherein the at least one power semiconductor device has first and second planar sides; a first thermally conductive substrate in thermal contact with the first planar side of the power semiconductor device; a first cooling module defining a first cavity, the first cavity in thermal contact with the first thermally conductive substrate, and the first cooling module in mechanical connection with the first thermally conductive substrate; a first inlet provided in the first cavity for receiving a coolant; a first outlet provided in the first cavity for discharging said coolant; wherein the power semiconductor device is in coolant-proof isolation from the cavity.

Abstract translation: 公开了具有至少一个功率半导体器件的半导体模块，其中所述至少一个功率半导体器件具有第一和第二平面侧; 与功率半导体器件的第一平面侧热接触的第一导热衬底; 限定第一腔的第一冷却模块，与第一导热衬底热接触的第一空腔，以及与第一导热衬底机械连接的第一冷却模块; 设置在所述第一腔中的用于接收冷却剂的第一入口; 第一出口，设置在所述第一腔中，用于排出所述冷却剂; 其中所述功率半导体器件处于与所述空腔隔离的冷却剂隔离中。