公开(公告)号：US10829368B2

公开(公告)日：2020-11-10

申请号：US16509145

申请日：2019-07-11

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stephan Pindl ,  Bernhard Knott ,  Carsten Ahrens

IPC: B81C1/00 ,  H04R19/00 ,  H04R31/00 ,  H04R19/04

Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack over a first main surface of a substrate, forming a polymer layer over a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

公开(公告)号：US09402138B2

公开(公告)日：2016-07-26

申请号：US13651372

申请日：2012-10-12

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stephan Pindl ,  Bernhard Knott ,  Carsten Ahrens

IPC: H01L29/84 ,  H04R19/04 ,  H04R19/00 ,  H04R31/00 ,  B81C1/00

CPC classification number: B81C1/00825 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00873 ,  B81C2201/017 ,  B81C2201/053 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003

Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

Abstract translation: 公开了一种制造MEMS器件的方法。 此外，公开了一种MEMS器件和包括MEMS器件的模块。 一个实施例包括用于制造MEMS器件的方法，包括在衬底的第一主表面上形成MEMS堆叠，在衬底的第二主表面上形成聚合物层，并在聚合物层和衬底中形成第一开口，使得 第一个开口与MEMS堆栈相邻。

公开(公告)号：US20190330057A1

公开(公告)日：2019-10-31

申请号：US16509145

申请日：2019-07-11

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stephan Pindl ,  Bernhard Knott ,  Carsten Ahrens

IPC: B81C1/00 ,  H04R31/00 ,  H04R19/04 ,  H04R19/00

Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack over a first main surface of a substrate, forming a polymer layer over a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

公开(公告)号：US09269654B2

公开(公告)日：2016-02-23

申请号：US14180146

申请日：2014-02-13

Applicant: Infineon Technologies AG

Inventor： Stefan Willkofer ,  Uwe Wahl ,  Bernhard Knott ,  Markus Hammer ,  Andreas Strasser

IPC: H01F5/00 ,  H01F27/28 ,  H01L23/495 ,  H01L23/48 ,  H01L23/522 ,  H01L25/065 ,  H01L49/02 ,  H01L23/64 ,  H01L23/00 ,  H01F17/00

CPC classification number: H01L23/4952 ,  H01F2017/0086 ,  H01L23/48 ,  H01L23/49575 ,  H01L23/5227 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L28/10 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/49107 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/19102 ,  H01L2924/19104 ,  H01L2924/19107 ,  Y10T29/4902 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device, a method of manufacturing a semiconductor device and a method for transmitting a signal are disclosed. In accordance with an embodiment of the present invention, the semiconductor device comprises a first semiconductor chip comprising a first coil, a second semiconductor chip comprising a second coil inductively coupled to the first coil, and an isolating intermediate layer between the first semiconductor chip and the second semiconductor chip.

公开(公告)号：US20140103460A1

公开(公告)日：2014-04-17

申请号：US13651372

申请日：2012-10-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Alfons Dehe ,  Stephan Pindl ,  Bernhard Knott ,  Carsten Ahrens

IPC: H01L29/84 ,  H01L21/02

CPC classification number: B81C1/00825 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00873 ,  B81C2201/017 ,  B81C2201/053 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003

Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

Abstract translation: 公开了一种制造MEMS器件的方法。 此外，公开了一种MEMS器件和包括MEMS器件的模块。 一个实施例包括用于制造MEMS器件的方法，包括在衬底的第一主表面上形成MEMS堆叠，在衬底的第二主表面上形成聚合物层，并在聚合物层和衬底中形成第一开口，使得 第一个开口与MEMS堆栈相邻。

公开(公告)号：US10102967B2

公开(公告)日：2018-10-16

申请号：US14571316

申请日：2014-12-16

Applicant: Infineon Technologies AG

Inventor： Gottfried Beer ,  Bernhard Knott ,  Rainer Leuschner

IPC: H01F5/00 ,  H01F27/28 ,  H01F41/02 ,  H01F17/00 ,  H01F41/04 ,  H01L23/64 ,  H01L23/00

Abstract: A method for manufacturing an inductor core is developed, wherein the method comprises the following: Forming a first electrical conductor on a first surface of a plate-shaped magnetic core; forming a second electrical conductor on a second surface of the plate-shaped magnetic core, which is opposite the first surface; and forming the inductor core by dicing the plate-shaped magnetic core transverse to the first electrical conductor and second electrical conductor.

公开(公告)号：US20180201504A1

公开(公告)日：2018-07-19

申请号：US15923599

申请日：2018-03-16

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stephan Pindl ,  Bernhard Knott ,  Carsten Ahrens

IPC: B81C1/00 ,  H04R31/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: B81C1/00825 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00873 ,  B81C2201/017 ,  B81C2201/053 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003

Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack over a first main surface of a substrate, forming a polymer layer over a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

公开(公告)号：US09938140B2

公开(公告)日：2018-04-10

申请号：US15206836

申请日：2016-07-11

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stephan Pindl ,  Bernhard Knott ,  Carsten Ahrens

IPC: B81C1/00 ,  H04R19/04 ,  H04R19/00 ,  H04R31/00

CPC classification number: B81C1/00825 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00873 ,  B81C2201/017 ,  B81C2201/053 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003

Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

公开(公告)号：US20160282212A1

公开(公告)日：2016-09-29

申请号：US14667858

申请日：2015-03-25

Applicant: Infineon Technologies AG

Inventor： Sebastian Beer ,  Helmut Wietschorke ,  Jochen Dangelmaier ,  Horst Theuss ,  Bernhard Knott ,  Thomas Mueller ,  Andreas Allmeier

IPC: G01L19/14 ,  H01L25/18 ,  H01L21/52 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC classification number: G01L19/147 ,  G01L19/0084 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49586 ,  H01L25/18 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012

Abstract: A molded semiconductor package includes a substrate having opposing first and second main surfaces, a semiconductor die attached to the first main surface of the substrate, an adhesion adapter attached to the second main surface of the substrate or a surface of the semiconductor die facing away from the substrate, and a mold compound encapsulating the semiconductor die, the adhesion adapter and at least part of the substrate. The adhesion adapter is configured to adapt adhesion properties of the mold compound to adhesion properties of the substrate or semiconductor die to which the adhesion adapter is attached, such that the mold compound more strongly adheres to the adhesion adapter than directly to the substrate or semiconductor die to which the adhesion adapter is attached. The adhesion adapter has a surface feature which strengthens the adhesion between the adhesion adapter and the mold compound.

Abstract translation: 模制的半导体封装包括具有相对的第一和第二主表面的基板，附接到基板的第一主表面的半导体管芯，附接到基板的第二主表面的粘合适配器或半导体管芯的远离 衬底和封装半导体管芯，粘合适配器和至少部分衬底的模具化合物。 粘合适配器被配置成使得模制化合物的粘合性能适应于粘合适配器所附着的基底或半导体管芯的粘合性能，使得模制化合物比直接连接到基底或半导体模具更强烈地粘附到粘合适配器 附着适配器附接到该装置。 粘合适配器具有加强粘合适配器和模具化合物之间的粘附的表面特征。

公开(公告)号：US10384934B2

公开(公告)日：2019-08-20

申请号：US15923599

申请日：2018-03-16

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stephan Pindl ,  Bernhard Knott ,  Carsten Ahrens

IPC: B81C1/00 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack over a first main surface of a substrate, forming a polymer layer over a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.