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公开(公告)号：US20210003466A1
公开(公告)日：2021-01-07
申请号：US17024228
申请日：2020-09-17
Applicant: Infineon Technologies AG
Inventor： Rainer Leuschner , Kerstin Kaemmer , Roland Meier , Marten Oldsen , Karolina Zogal
Abstract: A sensor device includes a sensor unit sensitive for a property of a gaseous medium. The sensor unit is formed on a first surface of a sensor substrate. A frame structure on the first surface includes a first loop portion laterally surrounding a first area that includes the sensor unit. A communicating channel accesses the first area through at least one of a lateral port in the first loop portion and a base port in the sensor substrate. A lid structure completely covers the frame structure and the first area.
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公开(公告)号：US20180127267A1
公开(公告)日：2018-05-10
申请号：US15864787
申请日：2018-01-08
Applicant: Infineon Technologies AG
Inventor： Bernhard Winkler , Rainer Leuschner , Horst Theuss
CPC classification number: B81B7/0058 , B81B2201/025 , B81B2201/0264 , B81B2207/012 , B81B2207/015 , B81C2203/0154 , G01L9/0054 , G01L15/00 , G01L19/141 , G01L19/148 , H01L29/84 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/1461 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.
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3.发明授权公开(公告)号：US09917333B2
公开(公告)日：2018-03-13
申请号：US14230071
申请日：2014-03-31
Applicant: Infineon Technologies AG
Inventor： Vijaye Kumar Rajaraman , Kamil Karlovsky , Thomas Neidhart , Karl Mayer , Rainer Leuschner , Christine Moser , Ravi Keshav Joshi , Alexander Breymesser , Bernhard Goller , Francisco Javier Santos Rodriguez , Peter Zorn
IPC: H01M14/00 , H01M10/42 , H01M2/02 , H01M2/08 , H01M10/04 , H01M2/04 , H01M2/06 , H01M10/052 , H01M6/40
CPC classification number: H01M10/4257 , H01M2/0202 , H01M2/024 , H01M2/0404 , H01M2/06 , H01M2/08 , H01M6/40 , H01M10/04 , H01M10/0436 , H01M10/052 , Y10T29/4911
Abstract: A lithium ion battery includes a first substrate having a first main surface, and a lid including an insulating material. The lid is attached to the first main surface of the first substrate, and a cavity is defined between the first substrate and the lid. The lithium ion battery further includes an electrical interconnection element in the lid, the electrical interconnection element providing an electrical connection between a first main surface and a second main surface of the lid. The lithium ion battery further includes an electrolyte in the cavity, an anode at the first substrate, the anode including a component made of a semiconductor material, and a cathode at the lid.
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公开(公告)号：US20160155680A1
公开(公告)日：2016-06-02
申请号：US14954145
申请日：2015-11-30
Applicant: Infineon Technologies AG
Inventor： Andreas Stueckjuergen , Rainer Leuschner , Daniel Porwol
CPC classification number: H01L21/78 , H01L21/561 , H01L21/568 , H01L23/3185 , H01L24/03 , H01L24/13 , H01L24/96 , H01L2224/02381 , H01L2224/04105 , H01L2224/1132 , H01L2224/11334 , H01L2224/12105 , H01L2224/13022 , H01L2224/13111 , H01L2224/14131 , H01L2224/94 , H01L2224/96 , H01L2924/182 , H01L2224/03 , H01L2224/11 , H01L2924/00014
Abstract: A semiconductor package includes a semiconductor chip having a first main face and side faces, an encapsulation covering at least the side faces of the semiconductor chip, and an electrical redistribution structure arranged over the first main face of the semiconductor chip. A first main surface of the semiconductor package includes a surface of the electrical redistribution structure and a surface of the encapsulation.
Abstract translation: 半导体封装包括具有第一主面和侧面的半导体芯片，至少覆盖半导体芯片的侧面的封装，以及布置在半导体芯片的第一主面上的电再分布结构。 半导体封装的第一主表面包括电再分布结构的表面和封装的表面。
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公开(公告)号：US20150147850A1
公开(公告)日：2015-05-28
申请号：US14088523
申请日：2013-11-25
Applicant: Infineon Technologies AG
Inventor： Gudrun Stranzl , Martin Zgaga , Rainer Leuschner , Bernhard Goller , Bernhard Boche , Manfred Engelhardt , Hermann Wendt , Bernd Noehammer , Karl Mayer , Michael Roesner , Monika Cornelia Voerckel
IPC: H01L21/82 , H01L21/283 , H01L21/265 , H01L23/00
CPC classification number: H01L21/6835 , H01L21/0331 , H01L21/283 , H01L21/2855 , H01L21/304 , H01L21/3065 , H01L21/3081 , H01L21/3086 , H01L21/6836 , H01L21/76895 , H01L21/78 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2924/12042 , H01L2924/13055 , H01L2924/0001
Abstract: Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.
Abstract translation: 用于处理半导体工件的方法可以包括提供包括一个或多个切口区域的半导体工件; 通过从所述工件的第一侧移除来自所述一个或多个切割区域的材料，在所述工件中形成一个或多个沟槽; 将具有第一侧的工件安装到载体上; 从工件的第二侧使工件变薄; 以及在所述工件的第二侧上形成金属化层。
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Patent Agency Ranking
公开(公告)号：US20150028436A1
公开(公告)日：2015-01-29
申请号：US14515304
申请日：2014-10-15
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Edward Fuergut , Horst Theuss , Rainer Leuschner
CPC classification number: B81B7/0041 , B81B3/0021 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00253 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H04R19/005 , H04R31/006 , H04R2201/003 , H01L2924/00
Abstract: A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area.
Abstract translation: 公开了一种用于形成封装的MEMS器件的系统和方法。 在一个实施例中，封装的MEMS器件包括具有第一主表面的MEMS器件，第一主表面具有沿着第一方向的第一区域和第二方向，设置在MEMS器件的第一主表面上的膜和邻近膜的背板。 封装的MEMS器件还包括封装MEMS器件并且限定后部体积的封装材料，后部体积具有沿第一方向和第二方向的第二区域，其中第一区域小于第二区域。
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公开(公告)号：US12188839B2
公开(公告)日：2025-01-07
申请号：US18304989
申请日：2023-04-21
Applicant: Infineon Technologies AG
Inventor： Rainer Leuschner , Kerstin Kaemmer , Roland Meier , Marten Oldsen , Karolina Zogal
Abstract: A sensor device includes a sensor unit sensitive for a property of a gaseous medium. The sensor unit is formed on a first surface of a sensor substrate. A frame structure on the first surface includes a first loop portion laterally surrounding a first area that includes the sensor unit. A communicating channel accesses the first area through at least one of a lateral port in the first loop portion and a base port in the sensor substrate. A lid structure completely covers the frame structure and the first area.
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公开(公告)号：US11192777B2
公开(公告)日：2021-12-07
申请号：US15864787
申请日：2018-01-08
Applicant: Infineon Technologies AG
Inventor： Bernhard Winkler , Rainer Leuschner , Horst Theuss
Abstract: Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.
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9.发明授权公开(公告)号：US09614256B2
公开(公告)日：2017-04-04
申请号：US14230086
申请日：2014-03-31
Applicant: Infineon Technologies AG
Inventor： Kamil Karlovsky , Rafael Janski , Michael Sorger , Magdalena Forster , Katharina Schmut , Vijaye Kumar Rajaraman , Rainer Leuschner , Bernhard Goller
IPC: H01M10/42 , H01M2/02 , H01M10/04 , H01M2/04 , H01M2/36 , H01M4/38 , H01M4/66 , H01M10/0525 , H01M10/058
CPC classification number: H01M10/058 , H01M2/0202 , H01M2/0207 , H01M2/024 , H01M2/026 , H01M2/027 , H01M2/0285 , H01M2/0404 , H01M2/0486 , H01M2/08 , H01M2/361 , H01M4/134 , H01M4/386 , H01M4/66 , H01M10/04 , H01M10/0525 , H01M10/4257 , H01M2220/20 , H01M2220/30 , Y02E60/122 , Y02P70/54 , Y10T29/4911
Abstract: A lithium ion battery includes a first substrate having a first main surface, and a lid including a conductive cover element, the lid being attached to the first main surface. A cavity is formed between the first substrate and the lid. The battery further includes an electrolyte disposed in the cavity. An anode of the battery includes a component made of a semiconductor material and is formed at the first substrate, and a cathode of the battery is formed at the lid.
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10.发明申请Lithium Ion Battery, Integrated Circuit and Method of Manufacturing a Lithium Ion Battery 有权锂离子电池，集成电路和制造锂离子电池的方法公开(公告)号：US20150280289A1
公开(公告)日：2015-10-01
申请号：US14230086
申请日：2014-03-31
Applicant: Infineon Technologies AG
Inventor： Kamil Karlovsky , Rafael Janski , Michael Sorger , Magdalena Forster , Katharina Schmut , Vijaye Kumar Rajaraman , Rainer Leuschner , Bernhard Goller
CPC classification number: H01M10/058 , H01M2/0202 , H01M2/0207 , H01M2/024 , H01M2/026 , H01M2/027 , H01M2/0285 , H01M2/0404 , H01M2/0486 , H01M2/08 , H01M2/361 , H01M4/134 , H01M4/386 , H01M4/66 , H01M10/04 , H01M10/0525 , H01M10/4257 , H01M2220/20 , H01M2220/30 , Y02E60/122 , Y02P70/54 , Y10T29/4911
Abstract: A lithium ion battery includes a first substrate having a first main surface, and a lid including a conductive cover element, the lid being attached to the first main surface. A cavity is formed between the first substrate and the lid. The battery further includes an electrolyte disposed in the cavity. An anode of the battery includes a component made of a semiconductor material and is formed at the first substrate, and a cathode of the battery is formed at the lid.
Abstract translation: 锂离子电池包括具有第一主表面的第一基板和包括导电盖元件的盖，所述盖附接到第一主表面。 在第一基板和盖之间形成空腔。 电池还包括设置在空腔中的电解质。 电池的阳极包括由半导体材料制成的部件，并且形成在第一基板上，并且电池的阴极形成在盖子上。
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