公开(公告)号：US20230019643A1

公开(公告)日：2023-01-19

申请号：US17956598

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Daniel Neumann ,  Andrew Larson ,  Eric Buddrius ,  Jeffory Smalley ,  Shelby Ferguson

IPC: H05K5/02

Abstract: Example integrated separator devices for hardware component separation are disclosed herein. An example apparatus include a processor carrier having an inner edge and an outer edge; and a component separator rotatably coupled to the processor carrier, the component separator including a shaft, an entirety of the component separator closer to a center of the processor carrier than the outer edge is to the center of the processor carrier.

公开(公告)号：US10260961B2

公开(公告)日：2019-04-16

申请号：US14975938

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Shelby Ferguson ,  Rashelle Yee ,  Russell S. Aoki ,  Michael Hui ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski

IPC: G01K7/00 ,  G01K1/00 ,  G01K7/16 ,  H01L23/34 ,  H01L23/00 ,  H01L23/31 ,  H01L23/473 ,  H01L25/065

Abstract: Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature sensor trace, and an electrical resistance of the temperature sensor trace is representative of an equivalent temperature of the temperature sensor trace.

公开(公告)号：US20170181271A1

公开(公告)日：2017-06-22

申请号：US14975941

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Rashelle Yee ,  Russell S. Aoki ,  Shelby Ferguson ,  Michael Hui ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski ,  Kevin J. Ceurter

IPC: H05K1/02 ,  H01L23/498 ,  G06F1/16 ,  B23K1/00 ,  B23K31/02 ,  H05K1/14 ,  H05B1/02

CPC classification number: H05K1/0271 ,  B23K1/0016 ,  B23K2101/42 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05B1/0233 ,  H05K1/0212 ,  H05K1/141 ,  H05K2201/041 ,  H05K2201/10378

Abstract: Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace.

公开(公告)号：US10178763B2

公开(公告)日：2019-01-08

申请号：US14975941

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Rashelle Yee ,  Russell S. Aoki ,  Shelby Ferguson ,  Michael Hui ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski ,  Kevin J. Ceurter

IPC: H05K1/02 ,  H01L23/498 ,  H05B1/02 ,  B23K1/00 ,  H05K1/14 ,  B23K101/42

Abstract: Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace.

公开(公告)号：US20170176260A1

公开(公告)日：2017-06-22

申请号：US14975938

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： Shelby Ferguson ,  Rashelle Yee ,  Russell S. Aoki ,  Michael Hui ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski

IPC: G01K7/16 ,  H01L23/34

CPC classification number: G01K7/16 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/345 ,  H01L23/473 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81139 ,  H01L2224/81193 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2224/45099

Abstract: Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature sensor trace, and an electrical resistance of the temperature sensor trace is representative of an equivalent temperature of the temperature sensor trace.

公开(公告)号：US20250112392A1

公开(公告)日：2025-04-03

申请号：US18980411

申请日：2024-12-13

Applicant: Intel Corporation

Inventor： Richard Canham ,  Ernesto Borboa Lizarraga ,  Daniel Neumann ,  Shelby Ferguson ,  Eric Buddrius ,  Hardikkumar Prajapati ,  Kirk Wheeler ,  Steven Klein ,  Shaun Immeker ,  Jeffory L. Smalley

IPC: H01R12/85

Abstract: A semiconductor package carrier used to support a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) as the semiconductor package is moved from a shipping tray to a land grid array (LGA) socket during assembly of an electronic device. The semiconductor package carrier including a carrier body including a plurality of support structures arranged to support a portion of the semiconductor package. The semiconductor package carrier further including a locking structure moveable between a first position and a second position, wherein the first position allows the support structures to receive the semiconductor package and the second position secures the semiconductor package to the carrier body. In some embodiments, the semiconductor package carrier may also include a thermal interface material (TIM) breaker to facilitate removal of a heatsink from the semiconductor package. Other embodiments are described and claimed.

公开(公告)号：US20230395460A1

公开(公告)日：2023-12-07

申请号：US18450928

申请日：2023-08-16

Applicant: Intel Corporation

Inventor： David Shia ,  Rick Canham ,  Eric W. Buddrius ,  Jeffory L. Smalley ,  John Beatty ,  Kenan Arik ,  Mohanraj Prabhugoud ,  Kirk Wheeler ,  Shelby Ferguson ,  Jorge Contreras Perez ,  Daniel Neumann ,  Ernesto Borboa Lizarraga

IPC: H01L23/40

CPC classification number: H01L23/4093 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2023/405

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices. An example support includes an integrated circuit (IC) carrier that includes a plurality of walls, supports carried by the walls to support an IC from below the IC, and a retention clip to secure the IC.

公开(公告)号：US20180174940A1

公开(公告)日：2018-06-21

申请号：US15383858

申请日：2016-12-19

Applicant: Intel Corporation

Inventor： Shelby Ferguson ,  Gong Ouyang ,  Russell S. Aoki ,  Zhichao Zhang ,  Kai Xiao

IPC: H01L23/34 ,  H01L23/373 ,  H01L23/498

CPC classification number: H01L23/345 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/16225

Abstract: Disclosed herein are fine-featured traces for integrated circuit (IC) package support structures, and related systems, devices, and methods. For example, a device may include a printed circuit board (PCB) having an insulating material and a heater trace on the insulating material. In some embodiments, the heater trace may have a section with a width less than 3.5 mils. In some embodiments, a section of the heater trace may be adjacent to a burned portion of the insulating material.

公开(公告)号：US20170178994A1

公开(公告)日：2017-06-22

申请号：US14975943

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Michael Hui ,  Rashelle Yee ,  Jonathan Thibado ,  Daniel P. Carter ,  Shelby Ferguson ,  Anthony P. Valpiani ,  Russell S. Aoki ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski ,  Harvey R. Kofstad ,  Michael Brazel ,  Tracy Clack ,  Viktor Vogman ,  Penny Woodcock ,  Kevin J. Ceurter ,  Hongfei Yan

IPC: H01L23/34 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/345 ,  H01L21/4853 ,  H01L21/4871 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Disclosed herein are integrated circuit (IC) package support structures, and related systems, devices, and methods. In some embodiments, an IC package support structure may include a first heater trace, and a second heater trace, wherein the second heater trace is not conductively coupled to the first heater trace in the IC package support structure.