公开(公告)号：US20180331329A1

公开(公告)日：2018-11-15

申请号：US16028085

申请日：2018-07-05

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Eric P. Lewandowski ,  Yu Luo ,  Adinath S. Narasgond

IPC: H01M2/02 ,  G02C7/08 ,  A61B5/145 ,  H01M10/04 ,  C25D1/04 ,  C25D1/22 ,  H01M4/66 ,  H01M4/42 ,  H01M4/48 ,  H01M4/50 ,  C25D5/02 ,  H01M4/38 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D5/10 ,  C25D5/50 ,  H01M4/139 ,  H01M4/02

Abstract: A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.

公开(公告)号：US10096802B2

公开(公告)日：2018-10-09

申请号：US14340343

申请日：2014-07-24

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Gregory M. Fritz ,  Michael S. Gordon ,  Eric P. Lewandowski ,  Yu Luo

IPC: H01M2/02 ,  G02C7/08 ,  A61B5/145 ,  H01M4/38 ,  H01M4/50 ,  H01M4/66 ,  H01M10/04 ,  C25D5/02 ,  H01M4/42 ,  H01M4/48 ,  C25D1/04 ,  C25D1/22 ,  H01M4/139 ,  H01M4/02 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D5/10 ,  C25D5/50

Abstract: A battery, comprising a cathode comprising a cathode material in contact with a cathode current collector. The battery also comprises an electrolyte. The battery also comprises an anode comprising an electroplated homogeneous solid metallic alloy comprising 100 ppm to 1000 ppm Bi and 100 ppm to 1000 ppm In, and a remainder Zn.

公开(公告)号：US10069116B2

公开(公告)日：2018-09-04

申请号：US15789584

申请日：2017-10-20

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Eric P. Lewandowski ,  Yu Luo ,  Adinath S. Narasgond

IPC: H01M2/02 ,  C25D1/04 ,  C25D1/22 ,  C25D5/02 ,  G02C7/08 ,  H01M4/38 ,  H01M4/42 ,  H01M4/48 ,  H01M4/50 ,  H01M4/66 ,  H01M10/04 ,  A61B5/145 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D5/10 ,  C25D5/50 ,  H01M4/139 ,  H01M4/02

CPC classification number: H01M2/0202 ,  A61B5/145 ,  A61B2562/028 ,  C25D1/04 ,  C25D1/22 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D3/565 ,  C25D5/02 ,  C25D5/10 ,  C25D5/50 ,  G02C7/083 ,  H01M4/139 ,  H01M4/38 ,  H01M4/42 ,  H01M4/48 ,  H01M4/50 ,  H01M4/661 ,  H01M4/664 ,  H01M10/0436 ,  H01M2002/0205 ,  H01M2004/027 ,  H01M2004/028 ,  Y10T29/49108 ,  Y10T29/49115

Abstract: A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.

公开(公告)号：US20150287960A1

公开(公告)日：2015-10-08

申请号：US14340253

申请日：2014-07-24

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Joana Sofia Branquinho Teresa Maria ,  Bing Dang ,  Michael A. Gaynes ,  John U. Knickerbocker ,  Eric P. Lewandowski ,  Cornelia K. Tsang ,  Bucknell C. Webb

IPC: H01M2/02 ,  A61B5/145 ,  A61F9/00 ,  G02C7/08

CPC classification number: H01M2/0202 ,  A61B5/145 ,  A61B2562/028 ,  C25D1/04 ,  C25D1/22 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D3/565 ,  C25D5/02 ,  C25D5/10 ,  C25D5/50 ,  G02C7/083 ,  H01M4/139 ,  H01M4/38 ,  H01M4/42 ,  H01M4/48 ,  H01M4/50 ,  H01M4/661 ,  H01M4/664 ,  H01M10/0436 ,  H01M2002/0205 ,  H01M2004/027 ,  H01M2004/028 ,  Y10T29/49108 ,  Y10T29/49115

Abstract: A system comprising a first dielectric element and a second dielectric element each having a first surface, wherein the first surface of the first dielectric element and the first surface of the second dielectric element are joined. The system further comprises one or more enclosed voids within the joined first and second dielectric elements. The system further comprises a flexible battery in a first enclosed void of the one or more enclosed voids, the flexible battery having a thickness of less than about 150 microns.

Abstract translation: 一种包括第一介电元件和第二介电元件的系统，每个第一介质元件和第二介质元件均具有第一表面，其中第一介电元件的第一表面和第二介电元件的第一表面被接合。 该系统还包括在所接合的第一和第二介电元件内的一个或多个封闭的空隙。 该系统还包括在一个或多个封闭空隙的第一封闭空间中的柔性电池，柔性电池具有小于约150微米的厚度。

公开(公告)号：US10692831B1

公开(公告)日：2020-06-23

申请号：US16281770

申请日：2019-02-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Nicholas T. Bronn ,  Jared B. Hertzberg ,  Eric P. Lewandowski ,  Jae-woong Nah

IPC: H01L23/00 ,  G06N10/00 ,  H01L23/66 ,  H01L21/66 ,  H01L23/498

Abstract: According to an embodiment of the present invention, a method of producing a quantum computer chip includes performing a frequency measurement on a qubit chip bonded to a test interposer chip for qubits on the qubit chip at an operating temperature of the qubit chip. The method further includes pulling the qubit chip apart from the test interposer chip after performing the frequency measurement, and modifying a frequency of a subset of qubits after pulling the qubit chip apart from the test interposer chip. The method further includes bonding the qubit chip to a device interposer chip after modifying the frequency of the subset of qubits.

公开(公告)号：US20190103542A1

公开(公告)日：2019-04-04

申请号：US15721238

申请日：2017-09-29

Applicant: International Business Machines Corporation

Inventor： David W. Abraham ,  John M. Cotte ,  Eric P. Lewandowski

IPC: H01L39/04 ,  H01L23/00 ,  H01L39/24

Abstract: A technique relates to a structure. An under-bump-metallization (UBM) structure includes a first region and a second region. The first and second regions are laterally positioned in the UBM structure. The first region includes a superconducting material. A substrate opposes the UBM structure. A superconducting solder material joins the first region to the substrate and the second region to the substrate.

公开(公告)号：US09806299B2

公开(公告)日：2017-10-31

申请号：US14340304

申请日：2014-07-24

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Eric P. Lewandowski ,  Yu Luo ,  Adinath S. Narasgond

IPC: H01M6/04 ,  H01M2/02 ,  G02C7/08 ,  A61B5/145 ,  H01M4/38 ,  H01M4/50 ,  H01M4/66 ,  H01M10/04 ,  C25D5/02 ,  H01M4/42 ,  H01M4/48 ,  C25D1/04 ,  C25D1/22 ,  H01M4/139 ,  H01M4/02 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D5/10 ,  C25D5/50

CPC classification number: H01M2/0202 ,  A61B5/145 ,  A61B2562/028 ,  C25D1/04 ,  C25D1/22 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D3/565 ,  C25D5/02 ,  C25D5/10 ,  C25D5/50 ,  G02C7/083 ,  H01M4/139 ,  H01M4/38 ,  H01M4/42 ,  H01M4/48 ,  H01M4/50 ,  H01M4/661 ,  H01M4/664 ,  H01M10/0436 ,  H01M2002/0205 ,  H01M2004/027 ,  H01M2004/028 ,  Y10T29/49108 ,  Y10T29/49115

Abstract: A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.

公开(公告)号：US20160049344A1

公开(公告)日：2016-02-18

申请号：US14460671

申请日：2014-08-15

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Bing Dang ,  Eric P. Lewandowski ,  Jae-Woong Nah ,  Bucknell C Webb

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L27/02 ,  H01L21/82 ,  H01L21/56

CPC classification number: H01L21/565 ,  H01L21/56 ,  H01L21/561 ,  H01L21/82 ,  H01L23/3121 ,  H01L23/5387 ,  H01L23/564 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the invention include a method for shaping a flexible integrated circuit to a curvature and the resulting structure. A flexible circuit is provided. An epoxy resin and amine composition is deposited on the flexible integrated circuit. The deposited epoxy resin and amine composition is B-staged. The flexible integrated circuit is placed within a mold of a curvature. The B-staged epoxy resin and amine composition is cured subsequent to placing the flexible integrated circuit within the mold of the curvature.

Abstract translation: 本发明的实施例包括一种用于将柔性集成电路成形为曲率的方法以及所得到的结构。 提供了一个灵活的电路。 环氧树脂和胺组合物沉积在柔性集成电路上。 沉积的环氧树脂和胺组合物是B阶段的。 柔性集成电路放置在曲率的模具内。 在将柔性集成电路放置在曲率的模具中之后，B阶环氧树脂和胺组合物被固化。

公开(公告)号：US08815725B2

公开(公告)日：2014-08-26

申请号：US13744468

申请日：2013-01-18

Applicant: International Business Machines Corporation

Inventor： Michael A. Gaynes ,  Michael S. Gordon ,  Eric P. Lewandowski

IPC: H01L21/20

CPC classification number: C09D5/24 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  Y10T428/1372

Abstract: An electrically conductive paste providing low alpha particle emission is provided. A resin and conductive particles are mixed, and a curing agent is added. A solvent is subsequently added. The electrically conductive paste including a resin compound is formed by mixing the mixture in a high shear mixer. The electrically conductive paste can be applied to a surface of an article to form a coating, or can be molded into an article. The solvent is evaporated, and the electrically conductive paste is cured to provide a graphite-containing resin compound. The graphite-containing resin compound is electrically conductive, and provides low alpha particle emission at a level suitable for a low alpha particle emissivity coating.

Abstract translation: 提供了提供低α粒子发射的导电膏。 混合树脂和导电颗粒，并加入固化剂。 随后加入溶剂。 通过在高剪切混合器中混合该混合物来形成包含树脂化合物的导电糊料。 导电性糊料可以施加到制品的表面以形成涂层，或者可以模制成制品。 蒸发溶剂，使导电糊固化，得到含石墨的树脂化合物。 含石墨的树脂化合物是导电的，并且在适于低α粒子​​发射率涂层的水平下提供低的α粒子发射。

公开(公告)号：US20190131510A1

公开(公告)日：2019-05-02

申请号：US16233852

申请日：2018-12-27

Applicant: International Business Machines Corporation

Inventor： David W. Abraham ,  John M. Cotte ,  Eric P. Lewandowski

IPC: H01L39/04 ,  H01L23/00 ,  H01L39/24

Abstract: A structure has a first substrate bonded to a first under-bump metallization (UBM) structure, the first UBM structure comprising a first bonding region laterally surrounded by a first superconducting region. A second substrate is bonded to a second under-bump metallization (UBM) structure, the second UBM structure comprising a second bonding region laterally surrounded by a second superconducting region; and a superconducting solder material joins the first UBM structure to the second UBM structure.