公开(公告)号：US20180096966A1

公开(公告)日：2018-04-05

申请号：US15284580

申请日：2016-10-04

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Gerald Ofner ,  Peter Scherl ,  Stephan Bradl ,  Stefan Miethaner ,  Alexander Heinrich ,  Horst Theuss

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A method of producing packaged semiconductor devices includes providing a first packaging substrate panel. A second packaging substrate panel is provided. The first and second packaging substrate panels are moved through an assembly line that includes a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The second type packaged semiconductor device is different than the first type packaged semiconductor device. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner.

公开(公告)号：US20210043603A1

公开(公告)日：2021-02-11

申请号：US17078460

申请日：2020-10-23

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Gerald Ofner ,  Stephan Bradl ,  Stefan Miethaner ,  Alexander Heinrich ,  Horst Theuss ,  Peter Scherl

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/677 ,  H01L21/56 ,  H01L21/67 ,  H01L21/48 ,  H01L21/78 ,  H01L23/31

Abstract: A method of forming a semiconductor package includes providing a panel, providing one or more metal layers on an upper surface of the panel, forming a die pad and bond pads from the one or more metal layers, the die pad being adjacent to and spaced apart from the bond pads, attaching a die to the die pad, forming electrical connections between the die and the bond pads, encapsulating the die and the electrical connections with an electrically insulating mold compound, removing portions of the panel, and exposing the die pad and the bond pads after encapsulating the die.

公开(公告)号：US10566309B2

公开(公告)日：2020-02-18

申请号：US15284580

申请日：2016-10-04

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Gerald Ofner ,  Peter Scherl ,  Stephan Bradl ,  Stefan Miethaner ,  Alexander Heinrich ,  Horst Theuss

IPC: H01L21/48 ,  H01L21/78 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

Abstract: A method of producing packaged semiconductor devices includes providing a first packaging substrate panel. A second packaging substrate panel is provided. The first and second packaging substrate panels are moved through an assembly line that includes a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The second type packaged semiconductor device is different than the first type packaged semiconductor device. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner.

公开(公告)号：US11302668B2

公开(公告)日：2022-04-12

申请号：US16720867

申请日：2019-12-19

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Gerald Ofner ,  Stephan Bradl ,  Stefan Miethaner ,  Alexander Heinrich ,  Horst Theuss ,  Peter Scherl

IPC: H01L21/677 ,  H01L21/56 ,  H01L21/67 ,  H01L21/48 ,  H01L21/78 ,  H01L23/00 ,  H01L23/495 ,  H01L23/31

Abstract: A method of producing packaged semiconductor devices includes providing a first packaging substrate panel, providing a second packaging substrate panel, and moving the first and second packaging substrate panels through an assembly line that comprises a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner. The first and second packaged semiconductor devices differ with respect to at least one of: lead configuration, and encapsulant configuration.

公开(公告)号：US10497587B1

公开(公告)日：2019-12-03

申请号：US16007038

申请日：2018-06-13

Applicant: Infineon Technologies AG

Inventor： Rabie Djemour ,  Michael Bauer ,  Stefan Miethaner

IPC: H01L21/00 ,  H01L21/56 ,  H01L23/29 ,  H01L21/67

Abstract: A method for manipulating ions contained in an encapsulation material for a semiconductor device is provided. The method includes processing the encapsulation material and applying an electric field to the encapsulation material before the encapsulation material is finally cured. The ions contained in the encapsulation material have a mobility that decreases as the encapsulation material cures. By applying the electric field to the encapsulation material before the encapsulation material is finally cured, the amount of ions contained in the encapsulation material is reduced and/or the ions contained are concentrated in one or more regions of the encapsulation material. Corresponding apparatuses and semiconductor packages manufactured by the method are also described.

公开(公告)号：US20190318996A1

公开(公告)日：2019-10-17

申请号：US16385337

申请日：2019-04-16

Applicant: Infineon Technologies AG

Inventor： Anton Mauder ,  Oliver Hellmund ,  Peter Irsigler ,  Hanno Melzner ,  Stefan Miethaner ,  Sebastian Schmidt ,  Hans-Joachim Schulze

IPC: H01L23/552 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  H01L25/07

Abstract: A molding compound and a semiconductor arrangement with a molding compound are disclosed. The molding compound includes a matrix and a filler including filler particles. The filler particles each include a core with an electrically conducting or a semiconducting material and an electrically insulating cover.

公开(公告)号：US12230547B2

公开(公告)日：2025-02-18

申请号：US18130662

申请日：2023-04-04

Applicant: Infineon Technologies AG

Inventor： Edmund Riedl ,  Steffen Jordan ,  Stefan Miethaner ,  Stefan Schwab

IPC: H01L23/29 ,  H01L21/56

Abstract: A method of manufacturing a package includes forming an adhesion promoter on at least part of an electronic component. The adhesion promoter is a morphological adhesion promoter including a morphological structure having a plurality of openings. The method further includes at least partially encapsulating the electronic component with an inorganic encapsulant with the adhesion promoter in between. The adhesion promoter enhances adhesion between at least part of the electronic component and the encapsulant.

公开(公告)号：US11652084B2

公开(公告)日：2023-05-16

申请号：US17078460

申请日：2020-10-23

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Gerald Ofner ,  Stephan Bradl ,  Stefan Miethaner ,  Alexander Heinrich ,  Horst Theuss ,  Peter Scherl

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/677 ,  H01L21/56 ,  H01L21/67 ,  H01L21/48 ,  H01L21/78

CPC classification number: H01L24/96 ,  H01L21/4825 ,  H01L21/4839 ,  H01L21/561 ,  H01L21/677 ,  H01L21/67011 ,  H01L21/67703 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/97 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/8384 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/291 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

Abstract: A method of forming a semiconductor package includes providing a panel, providing one or more metal layers on an upper surface of the panel, forming a die pad and bond pads from the one or more metal layers, the die pad being adjacent to and spaced apart from the bond pads, attaching a die to the die pad, forming electrical connections between the die and the bond pads, encapsulating the die and the electrical connections with an electrically insulating mold compound, removing portions of the panel, and exposing the die pad and the bond pads after encapsulating the die.

公开(公告)号：US20190385866A1

公开(公告)日：2019-12-19

申请号：US16007038

申请日：2018-06-13

Applicant: Infineon Technologies AG

Inventor： Rabie Djemour ,  Michael Bauer ,  Stefan Miethaner

IPC: H01L21/56 ,  H01L21/67 ,  H01L23/29

Abstract: A method for manipulating ions contained in an encapsulation material for a semiconductor device is provided. The method includes processing the encapsulation material and applying an electric field to the encapsulation material before the encapsulation material is finally cured. The ions contained in the encapsulation material have a mobility that decreases as the encapsulation material cures. By applying the electric field to the encapsulation material before the encapsulation material is finally cured, the amount of ions contained in the encapsulation material is reduced and/or the ions contained are concentrated in one or more regions of the encapsulation material. Corresponding apparatuses and semiconductor packages manufactured by the method are also described.

公开(公告)号：US20230260860A1

公开(公告)日：2023-08-17

申请号：US18130662

申请日：2023-04-04

Applicant: Infineon Technologies AG

Inventor： Edmund Riedl ,  Steffen Jordan ,  Stefan Miethaner ,  Stefan Schwab

IPC: H01L23/29 ,  H01L21/56

CPC classification number: H01L23/29 ,  H01L21/56

Abstract: A method of manufacturing a package includes forming an adhesion promoter on at least part of an electronic component. The adhesion promoter is a morphological adhesion promoter including a morphological structure having a plurality of openings. The method further includes at least partially encapsulating the electronic component with an inorganic encapsulant with the adhesion promoter in between. The adhesion promoter enhances adhesion between at least part of the electronic component and the encapsulant.