公开(公告)号：US20200310016A1

公开(公告)日：2020-10-01

申请号：US16684016

申请日：2019-11-14

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young BYUN ,  So Hye CHO ,  Seung Yong LEE ,  Kwang-deok CHOI ,  In Uk BAEK ,  Yun Hee KIM

IPC: G02B5/28 ,  C23C14/08 ,  C23C14/06 ,  C23C14/00

Abstract: Provided is a coloring pattern structure. The coloring pattern structure includes: a substrate; a light-transmitting dielectric layer formed on at least one surface of the substrate; and a composite material layer disposed on an upper surface of the light-transmitting dielectric layer and formed of a metal and a first material not having a thermodynamic solid solubility in the metal, wherein the metal included in the composite material layer has a pattern coated only on portions of the upper surface of the light-transmitting dielectric layer, and the first material is coated on the remaining area where the metal is not coated.

公开(公告)号：US20140030532A1

公开(公告)日：2014-01-30

申请号：US13663728

申请日：2012-10-30

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young BYUN ,  Sang Hoon KIM ,  Ju Yeon HWANG ,  Heon Phil HA

IPC: H01B19/04 ,  C23C16/503 ,  B32B15/00 ,  C23C16/48 ,  B05D5/10 ,  B05D1/36 ,  C23C16/44 ,  C23C16/50

CPC classification number: C23C18/44 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/38 ,  Y10T428/31678

Abstract: Provided is a technique for electroless deposition (ELD) for forming metal conductive layer on an insulating substrate made of glass, polymer, etc. According to an aspect, an adhesive layer and a catalyst layer are formed on a substrate using a dry deposition method, such as are plasma deposition (APD) or sputtering, etc., and electroless deposition is performed thereon, thereby forming a metal thin, film. Therefore, it is possible to significantly simplify a complicated pretreatment process required for electroless depositions and increase adhesive strength of a deposited metal thin film.

Abstract translation: 提供了一种用于在由玻璃，聚合物等制成的绝缘基板上形成金属导电层的无电沉积（ELD）技术。根据一方面，使用干法沉积法在基板上形成粘合剂层和催化剂层， 例如等离子体沉积（APD）或溅射等，并在其上进行无电沉积，从而形成金属薄膜。 因此，可以显着地简化无电沉积所需的复杂的预处理工艺并增加沉积的金属薄膜的粘合强度。

公开(公告)号：US20190224662A1

公开(公告)日：2019-07-25

申请号：US16255662

申请日：2019-01-23

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young BYUN ,  Sang Hoon KIM ,  Jong Sik KIM

IPC: B01J35/04 ,  B01J23/86 ,  B01J21/02 ,  B01J37/02 ,  B01J37/08

Abstract: Provided are a method of manufacturing a honeycomb metal structure by using aluminum (Al) powder and a metal catalyst module including the honeycomb metal structure. The method includes preparing a honeycomb structure including at least one substrate including iron (Fe), coating at least a part of the substrate with a viscid material whose viscosity is increased by moisture, attaching metal powder onto the viscid material, adhering the metal powder to the substrate by supplying the moisture to the viscid material, and generating an uneven structure made of the metal powder bonded to the substrate, by performing heat treatment of the substrate onto which the metal powder is adhered.

公开(公告)号：US20170035535A1

公开(公告)日：2017-02-09

申请号：US15304713

申请日：2015-04-14

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Kwang Koo JEE ,  Ji Young BYUN

IPC: A61C8/00 ,  F16B39/284 ,  F16B39/02

CPC classification number: A61C8/0068 ,  A61C2201/007 ,  F16B39/02 ,  F16B39/284

Abstract: The present disclosure relates to a screw coupling structure for preventing loosening, and more particularly, to a screw coupling structure for preventing loosening for preventing loosening between a screw portion and an engagement portion, which includes the screw portion having a predetermined length and the engagement portion having a screw hole through which the screw portion is inserted and engaged, in which the screw portion is formed of a shape memory alloy deformable by an external force applied thereto at a temperature lower than a predetermined threshold temperature and recoverable from the deformation by heating to a temperature higher than the threshold temperature.

Abstract translation: 本发明涉及一种用于防止松动的螺钉联接结构，更具体地说，涉及一种用于防止松动以防止螺钉部分和接合部分之间的松动的螺纹联接结构，其包括具有预定长度的螺纹部分和接合部分 具有螺纹孔，螺纹部分通过螺纹孔插入和接合，螺纹部分由形状记忆合金形成，该形状记忆合金可以通过在低于预定阈值温度的温度下施加到其上的外力而变形，并且可通过加热而变形 温度高于阈值温度。

公开(公告)号：US20220132676A1

公开(公告)日：2022-04-28

申请号：US17511572

申请日：2021-10-27

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young BYUN ,  Kwang-deok CHOI ,  Honguk CHEON

IPC: H05K3/38 ,  H05K3/10 ,  H05K3/06 ,  C25D5/48 ,  C23C28/02 ,  C23C18/31 ,  C23C18/18 ,  C25D5/34 ,  C23F1/02 ,  C23F17/00

Abstract: Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

公开(公告)号：US20230018835A1

公开(公告)日：2023-01-19

申请号：US17858391

申请日：2022-07-06

Applicant: Korea Institute of Science and Technology

Inventor： Ji Young BYUN ,  MD ABDUR RAHMAN ,  So Hye CHO ,  Seung Yong LEE ,  Hyungduk KO ,  Sung Lim CHOI ,  Dong Kyu KIM ,  Kwang-deok CHOI ,  Inuk BAEK ,  Yun Hee KIM

IPC: G02B5/28

Abstract: Provided is a high-durability coloring metal member. The high-durability coloring metal member includes a metal substrate, a dielectric layer provided on the metal substrate, and an oxynitride compound layer provided on the dielectric layer. The metal member is capable of expressing vivid and various colors with a color protection layer applied on the surface of the metal member.