摘要:
There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.
摘要:
There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.
摘要:
An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.
摘要:
An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.
摘要:
A package for an electronic device includes a cavity that houses an electronic element, and grooves or holes formed on or in sidewalls that define the cavity. The grooves or holes extend from an open side of the cavity so as not to reach a bottom side of the package.
摘要:
An acoustic wave device includes a substrate, a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate, a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate, and a metal seal part that seals the device chip.
摘要:
A surface acoustic wave device for implementing an attenuation characteristic outside of the pass band and the narrow band characteristics, preferably for use as a filter. The surface acoustic wave device includes a piezoelectric substrate, interdigital transducers formed on the piezoelectric substrate, and first and second reflectors disposed on the sides of the interdigital transducers. Each of the first and second reflectors includes an open electrode block with a plurality of electrically independent electrode fingers, and a short electrode block with a plurality of electrode fingers of which both ends are electrically shorted.
摘要:
A balance filter includes two acoustic wave filters connected between a single unbalanced terminal and two balanced terminals, and a ground terminal connected to the two acoustic wave filters via a first interconnection portion and a second interconnection portion. The first interconnection portion is connected to the two acoustic wave filters, and the second interconnection portion is connected to the first interconnection portion in a region that is located between the two acoustic wave filters and extends in a direction orthogonal to a direction in which the two acoustic wave filters are aligned.
摘要:
A surface acoustic wave filter is free from any loss arising from the impedance mismatching by finding out optimum values achieving a widened band and lowered loss for the electrode width of the interdigital transducer and reflector electrodes. The surface acoustic wave filter includes interdigital transducers and reflectors arranged on both sides of the transducer. The piezoelectric substrate has a ratio h/&lgr; of an electrode thickness h to a surface acoustic wave wavelength &lgr; lying within the range of 0.05≦h/&lgr;0.15 and has an electrode width ratio wr/pr of a reflector electrode width wr to an electrode pitch pr lying within the range of 0.5≦wr/pr≦0.6 and has an electrode width ratio wi/pi of an interdigital transducer interdigital electrode width wi to a pitch pi lying within the range of 0.6≦wi/pi≦0.9.
摘要翻译:表面声波滤波器通过找到实现扩宽带的最佳值和降低叉指式换能器和反射器电极的电极宽度的损耗而不受由阻抗失配引起的任何损失。 表面声波滤波器包括布置在换能器两侧的叉指换能器和反射器。 压电基板的电极厚度h与表面声波波长兰德的比率h / lambd在0.05 <= h / lambd0.15的范围内,并且反射器电极宽度wr的电极宽度比wr / pr 电极间距pr在0.5 <= wr / pr <= 0.6的范围内,并且具有叉指式换能器叉指电极宽度wi的电极宽度比wi / pi至间距p 1在0.6 <= wi / pi <= 0.9。
摘要:
A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.