公开(公告)号：US07732242B2

公开(公告)日：2010-06-08

申请号：US11680171

申请日：2007-02-28

申请人： Markus Brunnbauer ,  Jesus Mennen Belonio ,  Edward Fuergut ,  Thorsten Meyer

发明人： Markus Brunnbauer ,  Jesus Mennen Belonio ,  Edward Fuergut ,  Thorsten Meyer

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3185 ,  H01L24/96 ,  H01L2224/92 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： One aspect is a composite board including semiconductor chips in semiconductor device positions and a plastic housing composition partly embedding the semiconductor chips. A mould is provided for surrounding the semiconductor chips with plastic housing composition, the mould having a lower part and an upper part and a moldings cavity and the molding cavity having an upper contact area, which forms an interface with the top side of the plastic housing composition to be applied. The upper contact area is covered with a parting layer having essentially the same surface constitution and the same thermal conductivity as an adhesive film forming an interface with the underside of the plastic housing composition, with the result that a warpage of the composite board of less than 1% is obtained.

摘要翻译： 一个方面是包括半导体器件位置中的半导体芯片和部分地嵌入半导体芯片的塑料外壳组合物的复合板。 提供了一种用塑料外壳组合物围绕半导体芯片的模具，该模具具有下部和上部以及模制空腔，并且模制腔具有上部接触区域，该上部接触区域与塑料壳体的顶侧形成界面 要施用的组合物 上部接触区域覆盖有与塑料外壳组合物的下侧形成界面的与粘合膜基本相同的表面结构和相同导热性的分层，结果是复合板的翘曲小于 1％。

公开(公告)号：US20070205513A1

公开(公告)日：2007-09-06

申请号：US11680171

申请日：2007-02-28

申请人： Markus Brunnbauer ,  Jesus Belonio ,  Edward Fuergut ,  Thorsten Meyer

发明人： Markus Brunnbauer ,  Jesus Belonio ,  Edward Fuergut ,  Thorsten Meyer

IPC分类号： H01L23/52

CPC分类号： H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3185 ,  H01L24/96 ,  H01L2224/92 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： One aspect is a composite board including semiconductor chips in semiconductor device positions and a plastic housing composition partly embedding the semiconductor chips. A mould is provided for surrounding the semiconductor chips with plastic housing composition, the mould having a lower part and an upper part and a moldings cavity and the molding cavity having an upper contact area, which forms an interface with the top side of the plastic housing composition to be applied. The upper contact area is covered with a parting layer having essentially the same surface constitution and the same thermal conductivity as an adhesive film forming an interface with the underside of the plastic housing composition, with the result that a warpage of the composite board of less than 1% is obtained.

摘要翻译： 一个方面是包括半导体器件位置中的半导体芯片和部分地嵌入半导体芯片的塑料外壳组合物的复合板。 提供了一种用塑料外壳组合物围绕半导体芯片的模具，该模具具有下部和上部以及模制空腔，并且模制腔具有上部接触区域，该上部接触区域与塑料壳体的顶侧形成界面 要施用的组合物 上部接触区域覆盖有与塑料外壳组合物的下侧形成界面的与粘合膜基本相同的表面结构和相同导热性的分层，结果是复合板的翘曲小于 1％。

公开(公告)号：US20070249102A1

公开(公告)日：2007-10-25

申请号：US11738213

申请日：2007-04-20

申请人： Markus Brunnbauer ,  Edward Fuergut ,  Thorsten Meyer

发明人： Markus Brunnbauer ,  Edward Fuergut ,  Thorsten Meyer

IPC分类号： H01L21/00 ,  H01L21/82

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00

摘要： A panel and a semiconductor device, in one embodiment composed of a composite plate with semiconductor chips and plastic housing composition and to a method for producing the same is disclosed. The embodiments include a wiring structure with interconnects and dielectric layers composed of a low-k dielectric is arranged on the top side of the composite plate.

摘要翻译： 公开了一种面板和半导体器件，在一个实施例中，由具有半导体芯片的复合板和塑料外壳组成构成，以及其制造方法。 这些实施例包括具有互连的布线结构和由低k电介质构成的电介质层布置在复合板的顶侧上。

公开(公告)号：US07943423B2

公开(公告)日：2011-05-17

申请号：US12401111

申请日：2009-03-10

申请人： Jens Pohl ,  Edward Fuergut ,  Markus Brunnbauer ,  Thorsten Meyer ,  Peter Strobel ,  Daniel Porwol ,  Ulrich Wachter

发明人： Jens Pohl ,  Edward Fuergut ,  Markus Brunnbauer ,  Thorsten Meyer ,  Peter Strobel ,  Daniel Porwol ,  Ulrich Wachter

IPC分类号： H01L21/00

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.

摘要翻译： 制造半导体器件的方法包括将多个芯片放置在载体上。 将封装材料施加到多个芯片和用于形成封装工件的载体。 封装工件具有面向载体的第一主面和与第一主面相对的第二主面。 此外，标记元件相对于多个芯片施加到封装工件，标记元件可在第一主面和第二主面上检测。

公开(公告)号：US20100233831A1

公开(公告)日：2010-09-16

申请号：US12401111

申请日：2009-03-10

申请人： Jens Pohl ,  Edward Fuergut ,  Markus Brunnbauer ,  Thorsten Meyer ,  Peter Strobel ,  Daniel Porwol ,  Ulrich Wachter

发明人： Jens Pohl ,  Edward Fuergut ,  Markus Brunnbauer ,  Thorsten Meyer ,  Peter Strobel ,  Daniel Porwol ,  Ulrich Wachter

IPC分类号： H01L21/50 ,  H01L21/66

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.

摘要翻译： 制造半导体器件的方法包括将多个芯片放置在载体上。 将封装材料施加到多个芯片和用于形成封装工件的载体。 封装工件具有面向载体的第一主面和与第一主面相对的第二主面。 此外，标记元件相对于多个芯片施加到封装工件，标记元件可在第一主面和第二主面上检测。

公开(公告)号：US08524542B2

公开(公告)日：2013-09-03

申请号：US13556837

申请日：2012-07-24

申请人： Markus Brunnbauer ,  Edward Fuergut

发明人： Markus Brunnbauer ,  Edward Fuergut

IPC分类号： H01L21/00

CPC分类号： H01L23/5389 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/96 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54493 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A blank and a semiconductor device include a composite panel with semiconductor chips embedded in a plastic package molding compound. The blank includes a composite panel with semiconductor chips arranged in rows and columns in a plastic package molding compound with active upper sides of the semiconductor chips forming a coplanar surface area with the upper side of the composite panel. The blank further includes an orientation indicator impressed into the plastic package molding compound when the semiconductor chips are embedded within the molding compound.

摘要翻译： 空白和半导体器件包括具有嵌入在塑料封装模塑料中的半导体芯片的复合面板。 坯料包括具有半导体芯片的复合面板，该复合面板具有以塑料封装模制化合物排成行和列的半导体芯片，半导体芯片的有源上侧与复合面板的上侧形成共面表面积。 当半导体芯片嵌入模塑料中时，该坯料还包括印模在塑料封装模塑料中的取向指示器。

公开(公告)号：US08431063B2

公开(公告)日：2013-04-30

申请号：US11581060

申请日：2006-10-16

申请人： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

发明人： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

IPC分类号： B29B17/00

CPC分类号： H01L21/561 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82

摘要： A heat treatment method is provided for a panel. The panel includes a plastic housing composition, in which semiconductor chips are embedded by their rear sides and edge sides, and the top sides of the semiconductor chips form a coplanar area with the plastic housing composition. The panel is fixed by its underside on a holder, and a temperature gradient (ΔT) is then generated between top side and the underside of the panel. The temperature gradient (ΔT) is then maintained for at least one delimited or selected time period. The panel is then cooled to room temperature (TR).

摘要翻译： 为面板提供热处理方法。 面板包括塑料外壳组合物，其中半导体芯片由其后侧和边缘侧嵌入，并且半导体芯片的顶侧与塑料外壳组合物形成共面区域。 面板通过其下侧固定在支架上，然后在面板的顶侧和底面之间产生温度梯度（DeltaT）。 然后将温度梯度（DeltaT）保持至少一个定界或选定的时间段。 然后将面板冷却至室温（TR）。

公开(公告)号：US20070094982A1

公开(公告)日：2007-05-03

申请号：US11581060

申请日：2006-10-16

申请人： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

发明人： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

IPC分类号： E04C3/00

CPC分类号： H01L21/561 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82

摘要： A heat treatment method is provided for a panel. The panel includes a plastic housing composition, in which semiconductor chips are embedded by their rear sides and edge sides, and the top sides of the semiconductor chips form a coplanar area with the plastic housing composition. The panel is fixed by its underside on a holder, and a temperature gradient (ΔT) is then generated between top side and the underside of the panel. The temperature gradient (ΔT) is then maintained for at least one delimited or selected time period. The panel is then cooled to room temperature (TR).

摘要翻译： 为面板提供热处理方法。 面板包括塑料外壳组合物，其中半导体芯片由其后侧和边缘侧嵌入，并且半导体芯片的顶侧与塑料外壳组合物形成共面区域。 面板通过其下侧固定在支架上，然后在面板的顶侧和底面之间产生温度梯度（DeltaT）。 然后将温度梯度（DeltaT）保持至少一个定界或选定的时间段。 然后将面板冷却至室温（T R R）。

公开(公告)号：US08394308B2

公开(公告)日：2013-03-12

申请号：US13448941

申请日：2012-04-17

申请人： Markus Brunnbauer ,  Edward Fuergut ,  Daniel Porwol

发明人： Markus Brunnbauer ,  Edward Fuergut ,  Daniel Porwol

IPC分类号： H01L21/56

CPC分类号： B29C45/14639 ,  B29C33/10 ,  B29C43/18 ,  B29C43/36 ,  B29C45/02 ,  B29C2043/3644 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus and method for producing an article by molding is disclosed. In one embodiment, the method includes a mold with an upper part, a lower part and at least one mold cavity, and has a vacuum clamping ring with a least one closable vent, which is arranged between the upper part and the lower part. The mold cavity is at least partially filled with a mold material. The vent is closed, and the mold cavity is filled with a thermoplastic or thermoset material.

摘要翻译： 公开了一种通过模制制造制品的装置和方法。 在一个实施例中，该方法包括具有上部，下部和至少一个模腔的模具，并且具有设置在上部和下部之间的具有至少一个可关闭通气口的真空夹紧环。 模腔至少部分地填充有模具材料。 通风口关闭，模腔填充有热塑性或热固性材料。

公开(公告)号：US07585701B2

公开(公告)日：2009-09-08

申请号：US11439425

申请日：2006-05-24

申请人： Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

发明人： Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

IPC分类号： H01L21/00

CPC分类号： H01L24/96 ,  C09J7/35 ,  C09J7/385 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67126 ,  H01L21/67132 ,  H01L2221/68318 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and oriented toward the carrier sheet. The upper side of the base film includes an adhesive layer with semiconductor chips fixed on it, the semiconductor chips being surrounded by deactivated regions of the adhesive layer of the film upper side.

摘要翻译： 具有粘合膜的载体片包括具有上侧和下侧的耐热基膜，以及设置在基膜的下侧并且朝向载体片取向的热敏粘合剂层。 基膜的上侧包括固定有半导体芯片的粘合剂层，半导体芯片由膜上侧的粘合剂层的去活化区域包围。