公开(公告)号：US5191224A

公开(公告)日：1993-03-02

申请号：US627881

申请日：1990-12-13

申请人： Masanori Tazunoki ,  Hiromitsu Mishimagi ,  Makoto Homma ,  Toshiyuki Sakuta ,  Hisashi Nakamura ,  Keiji Sasaki ,  Minoru Enomoto ,  Toshihiko Satoh ,  Kunizo Sahara ,  Shigeo Kuroda ,  Kanji Otsuka ,  Masao Kawamura ,  Hinoko Kurosawa ,  Kazuya Ito

发明人： Masanori Tazunoki ,  Hiromitsu Mishimagi ,  Makoto Homma ,  Toshiyuki Sakuta ,  Hisashi Nakamura ,  Keiji Sasaki ,  Minoru Enomoto ,  Toshihiko Satoh ,  Kunizo Sahara ,  Shigeo Kuroda ,  Kanji Otsuka ,  Masao Kawamura ,  Hinoko Kurosawa ,  Kazuya Ito

IPC分类号： H01L23/14 ,  H01L23/32 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07

CPC分类号： H01L23/147 ,  H01L23/32 ,  H01L23/5385 ,  H01L25/0652 ,  H01L25/073 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025

摘要： To achieve higher packaging density and one wafer level for a full-sized wafer memory, or wafer-scale integration memory system, the wafers are vertically stacked with each other at a predetermined interval. A packaging technique is improved in such a way that a memory system layout can be precisely realized and a precise through hole can be formed. Moreover, other chips are fixed on the wafer so as to achieve furthermore the high packaging density.

摘要翻译： 为了实现全尺寸晶片存储器或晶片级积分存储器系统的更高的封装密度和一个晶片级，晶片以预定的间隔彼此垂直堆叠。 改进了封装技术，使得可以精确地实现存储器系统布局并且可以形成精确的通孔。 此外，其他芯片固定在晶片上，从而进一步实现高封装密度。

公开(公告)号：US5309011A

公开(公告)日：1994-05-03

申请号：US960848

申请日：1992-10-14

申请人： Masanori Tazunoki ,  Hiromitsu Mishimagi ,  Makoto Homma ,  Toshiyuki Sakuta ,  Hisashi Nakamura ,  Keiji Sasaki ,  Minoru Enomoto ,  Toshihiko Satoh ,  Kunizo Sahara ,  Shigeo Kuroda ,  Kanji Otsuka ,  Masao Kawamura ,  Hinoko Kurosawa ,  Kazuya Ito

发明人： Masanori Tazunoki ,  Hiromitsu Mishimagi ,  Makoto Homma ,  Toshiyuki Sakuta ,  Hisashi Nakamura ,  Keiji Sasaki ,  Minoru Enomoto ,  Toshihiko Satoh ,  Kunizo Sahara ,  Shigeo Kuroda ,  Kanji Otsuka ,  Masao Kawamura ,  Hinoko Kurosawa ,  Kazuya Ito

IPC分类号： H01L23/14 ,  H01L23/32 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L27/02 ,  H01L27/10 ,  H01L27/15

CPC分类号： H01L23/147 ,  H01L23/32 ,  H01L23/5385 ,  H01L25/0652 ,  H01L25/073 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025

摘要： To achieve higher packaging density and one wafer level for a full-sized wafer memory, or wafer-scale integration memory system, the wafers are vertically stacked with each other at a predetermined interval. A packaging technique is improved in such a way that a memory system layout can be precisely realized and a precise through hole can be formed. Moreover, other chips are fixed on the wafer so as to achieve furthermore the high packaging density.

摘要翻译： 为了实现全尺寸晶片存储器或晶片级积分存储器系统的更高的封装密度和一个晶片级，晶片以预定的间隔彼此垂直堆叠。 改进了封装技术，使得可以精确地实现存储器系统布局并且可以形成精确的通孔。 此外，其他芯片固定在晶片上，从而进一步实现高封装密度。

公开(公告)号：US10255744B2

公开(公告)日：2019-04-09

申请号：US13316847

申请日：2011-12-12

申请人： Minoru Enomoto

发明人： Minoru Enomoto

IPC分类号： B65D83/04 ,  B65D59/00 ,  G07D9/00 ,  G07F11/34

摘要： A disk transferring device transferring disks delivered one by one from an disk reception opening to an disk ejection opening includes: a disk guide path having left and right guide surfaces that guide a peripheral surface of each of the disks and front and back guide surfaces that guide an front surface and a back surface of the disk, the disk guide path extending from the disk reception opening toward the disk ejection opening; and a plurality of disk pushers protruding into the disk guide path and pushing the disks by making a rotational movement about a plurality of rotational axis lines approximately at a right angle with respect to the front and back guide surfaces.

公开(公告)号：US08377752B2

公开(公告)日：2013-02-19

申请号：US13019926

申请日：2011-02-02

申请人： Masakatsu Goto ,  Minoru Enomoto

发明人： Masakatsu Goto ,  Minoru Enomoto

IPC分类号： H01L21/00

CPC分类号： H01L24/81 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01064 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00

摘要： In regard to a semiconductor device having a multilayered wiring board where a semiconductor chip is embedded inside, a technology which allows the multilayered wiring board to be made thinner is provided. A feature of the present invention is that, in a semiconductor device where bump electrodes are formed over a main surface (element forming surface) of a semiconductor chip embedded in a chip-embedded wiring board, an insulating film is formed over a back surface (a surface on the side opposite to the main surface) of the semiconductor chip. As a result, it becomes unnecessary to form a prepreg over the back surface of the semiconductor chip. Therefore, an effect of thinning the chip-embedded wiring board in which the semiconductor chip is embedded is obtained.

摘要翻译： 关于具有嵌入半导体芯片的多层布线基板的半导体器件，提供了使多层布线基板制成薄型化的技术。 本发明的特征在于，在埋设在芯片嵌入式布线基板上的半导体芯片的主表面（元件形成面）上形成凸起电极的半导体器件中，绝缘膜形成在背面（ 半导体芯片的与主表面相对的一侧的表面）。 结果，不需要在半导体芯片的背面上形成预浸料。 因此，获得了嵌入半导体芯片的芯片嵌入式布线基板的薄型化的效果。

公开(公告)号：US20120051023A1

公开(公告)日：2012-03-01

申请号：US13218314

申请日：2011-08-25

申请人： Izen Sakuma ,  Minoru Enomoto

发明人： Izen Sakuma ,  Minoru Enomoto

IPC分类号： H05K7/00

CPC分类号： G06F1/1616 ,  G06F2200/1633

摘要： According to one embodiment, an electronic apparatus includes: a display device including a display screen; a first housing which houses the display device and which includes a first surface having an opening through which the display screen is exposed, and a second surface located on a opposite side to the first surface; a second housing connected to the first housing so that the first housing is rotatable between a first position where the display screen is uncovered and a second position where the display screen is covered; first guard portions attached to the second surface to guard corner portions of the first housing along a circumferential edge of the first housing; and second guard portions which are attached to the second housing to guard corner portions of the second housing along a circumferential edge of the second housing and which abut on the first housing in the second position.

摘要翻译： 根据一个实施例，电子设备包括：显示装置，包括显示屏; 第一壳体，其容纳所述显示装置，所述第一壳体包括具有所述显示屏露出的开口的第一表面和位于所述第一表面相对侧的第二表面; 连接到所述第一壳体的第二壳体，使得所述第一壳体可在显示屏未被覆盖的第一位置与所述显示屏幕被覆盖的第二位置之间旋转; 第一防护部分附接到第二表面以沿着第一壳体的周缘保护第一壳体的角部; 以及第二保护部分，其附接到所述第二壳体，以沿着所述第二壳体的周向边缘保护所述第二壳体的角部，并且在所述第二位置抵靠所述第一壳体。

公开(公告)号：US07961468B2

公开(公告)日：2011-06-14

申请号：US12724195

申请日：2010-03-15

申请人： Masahiko Takakusaki ,  Minoru Enomoto

发明人： Masahiko Takakusaki ,  Minoru Enomoto

IPC分类号： H05K7/20

CPC分类号： H05K1/141 ,  G06F1/1616 ,  G06F1/1658 ,  G06F1/185 ,  G06F1/203 ,  H05K1/144 ,  H05K2201/045 ,  H05K2201/09954 ,  H05K2201/10189

摘要： An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

摘要翻译： 电子设备包括：壳体; 住在房屋中的主板; 容纳在壳体中的第一个子板; 容纳在壳体中的第二子板; 安装在主板上的主机控制器; 桥式控制器，其安装在第一子板上并电连接到主机控制器; 安装在第一子板上并电连接到桥接控制器的第一芯片; 以及安装在第二子板上并电连接到桥接控制器的第二芯片。

公开(公告)号：US20100172097A1

公开(公告)日：2010-07-08

申请号：US12724195

申请日：2010-03-15

申请人： Masahiko Takakusaki ,  Minoru Enomoto

发明人： Masahiko Takakusaki ,  Minoru Enomoto

IPC分类号： H05K7/20 ,  H01R12/16

CPC分类号： H05K1/141 ,  G06F1/1616 ,  G06F1/1658 ,  G06F1/185 ,  G06F1/203 ,  H05K1/144 ,  H05K2201/045 ,  H05K2201/09954 ,  H05K2201/10189

摘要： An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

摘要翻译： 电子设备包括：壳体; 住在房屋中的主板; 容纳在壳体中的第一个子板; 容纳在壳体中的第二子板; 安装在主板上的主机控制器; 桥式控制器，其安装在第一子板上并电连接到主机控制器; 安装在第一子板上并电连接到桥接控制器的第一芯片; 以及安装在第二子板上并电连接到桥接控制器的第二芯片。

公开(公告)号：US07628685B2

公开(公告)日：2009-12-08

申请号：US11869994

申请日：2007-10-10

申请人： Minoru Enomoto

发明人： Minoru Enomoto

IPC分类号： G07D1/00

CPC分类号： G07D9/008

摘要： A coin hopper is provided that can dispense coins of different diameters without any trouble. A rotating disk has coin stoppers that are upwardly inclined at a specified angle, and a circular supporting rack at the center of the upper surface thereof. The stoppers expand radially at regular intervals, from the supporting rack side to the circumferential direction. The rotating disk makes the coins contact a holding surface between the coin stoppers and receives the coins one by one, and supports them by the supporting rack and feeds them out. An outer covering unit covers at least the lower outer circumference of the rotating disk. A storing bowl stores coins in bulk following the outer covering unit. A coin receiving unit expands from the vicinity of the supporting rack to the circumferential direction of the rotating disk, wherein the coin stoppers are arranged in a state fixed to the rotating disk. The coin receiving unit is arranged so as to contact and get away from the holding surface of the rotating disk.

摘要翻译： 提供了可以分配不同直径的硬币而没有任何麻烦的硬币漏斗。 旋转盘具有以特定角度向上倾斜的硬币止动件和位于其上表面中心的圆形支撑齿条。 止动件以规则的间隔从支撑架侧朝向圆周方向径向扩张。 旋转盘使硬币接触硬币止动器之间的保持表面并逐个接收硬币，并由支撑架支撑并将其送出。 外覆盖单元至少覆盖旋转盘的下外周。 存储碗在外部覆盖单元之后大量存储硬币。 硬币接收单元从支撑架附近朝向旋转盘的圆周方向膨胀，其中硬币止动器以固定到旋转盘的状态设置。 硬币接收单元布置成接触并远离旋转盘的保持表面。

公开(公告)号：US07470174B2

公开(公告)日：2008-12-30

申请号：US11583591

申请日：2006-10-19

申请人： Masayoshi Umeda ,  Minoru Enomoto

发明人： Masayoshi Umeda ,  Minoru Enomoto

IPC分类号： G07D3/00 ,  G07D3/14

CPC分类号： G07D9/008 ,  G07D3/14 ,  G07D9/00

摘要： A compact coin distribution device is capable of separating a plurality of coin denominations that are stored in bulk. A separator feeding device removes the coins in a one-by-one manner to a transfer device for translating the coins in one direction. The denomination of the coins can be sensed and a plurality of coin selecting ports can be aligned on either side of a coin transfer path. A plurality of movable guide members form a support for the coins both at the bottom and side of the coins. An activating unit can selectively activate a specific guide member, to thereby enable a specific coin to be released into a specific coin selecting port. The ability of the coins to be released on either side of the transfer path enables an efficient and compact configuration.

摘要翻译： 紧凑的硬币分配装置能够分离大量存储的多个硬币面额。 分离器供给装置将硬币逐一地移动到用于在一个方向上翻译硬币的转印装置。 可以感测硬币的面额，并且可以在硬币传送路径的任一侧上对准多个硬币选择端口。 多个可移动引导构件在硬币的底部和侧面形成用于硬币的支撑件。 激活单元可以选择性地激活特定的引导构件，从而使特定硬币能够释放到特定的硬币选择端口。 在传送路径的任一侧上释放硬币的能力使得能够有效且紧凑地配置。

公开(公告)号：US4110674A

公开(公告)日：1978-08-29

申请号：US748272

申请日：1976-12-07

申请人： Minoru Enomoto

发明人： Minoru Enomoto

IPC分类号： G05B19/18 ,  G05B19/05 ,  G05B19/416 ,  G05B19/24

CPC分类号： G05B19/4166 ,  G05B19/05

摘要： A programmable feed control apparatus for controlling the feed movement of a machine member in response to control data of a feed control program stored in a program memory is disclosed wherein the programmable feed control apparatus includes a flip flop which is set by completion of the generation of a set of timing pulses in order to perform a feed movement of the machine member. The flip flop is reset when the feed movement is completed in order to generate another set of timing pulses to read out the control data.

摘要翻译： 公开了一种可编程进给控制装置，用于响应于存储在程序存储器中的进给控制程序的控制数据来控制机器构件的进给运动，其中可编程进给控制装置包括通过完成生成 一组定时脉冲，以便执行机器构件的进给运动。 当进给运动完成时触发器复位，以产生另一组定时脉冲以读出控制数据。