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36 条记录 (耗时 0.034 秒)

    Method for producing multilayer substrate and electronic part, and multilayer electronic part
    9.
    发明授权
    Method for producing multilayer substrate and electronic part, and multilayer electronic part 失效
    多层基板和电子部件的制造方法以及多层电子部件

    公开(公告)号：US06808642B2

    公开(公告)日：2004-10-26

    申请号：US10238677

    申请日：2002-09-11

    申请人： Minoru Takaya ,  Toshikazu Endo ,  Masami Sasaki

    发明人： Minoru Takaya ,  Toshikazu Endo ,  Masami Sasaki

    IPC分类号： H01B1300

    CPC分类号： H05K1/0373 ,  H01F17/0006 ,  H01F17/0013 ,  H01F41/041 ,  H01G4/308 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0052 ,  H05K3/06 ,  H05K3/20 ,  H05K3/403 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/086 ,  Y10T29/49124 ,  Y10T29/49155

    摘要： This invention has an object of providing a method for producing a multilayer substrate or an electronic part wherein decrease in the thickness has been enabled without causing the problem of insufficient strength or the like in the handling, as well as the electronic part. Such object has been attained by a method for producing a multilayer substrate or an electronic part comprising the steps of adhering a conductor layer to a transfer film, patterning the conductor layer to form a predetermined pattern, placing the transfer film overlaid with the patterned conductor layer on a prepreg so that the side of the conductor layer faces the prepreg, and then adhering the transfer film to the prepreg by applying heat and pressure and peeling the transfer film to produce the prepreg having the conductor layer formed thereon; and the multilayer electronic part produced by such method.

    摘要翻译： 本发明的目的在于提供一种制造多层基板或电子部件的方法，其中已经实现了厚度的减小，而不会导致处理中的强度等不足的问题以及电子部件。 这样的目的已经通过多层基板或电子部件的制造方法来实现，该方法包括以下步骤：将导体层粘合到转印膜上，图案化导体层以形成预定图案，将转印膜重叠在图案化导体层 在预浸料坯上使导体层的一侧面向预浸料坯，然后通过施加热和压力将转印膜粘附到预浸料上，并剥离转印膜以制备其上形成有导体层的预浸料; 和通过这种方法制造的多层电子部件。

    Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module
    10.
    发明授权
    Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module 失效
    电感元件，层叠电子元件，层叠电子元件模块及其制造方法，元件及模块

    公开(公告)号：US07081803B2

    公开(公告)日：2006-07-25

    申请号：US10767373

    申请日：2004-01-30

    申请人： Minoru Takaya ,  Toshikazu Endo

    发明人： Minoru Takaya ,  Toshikazu Endo

    IPC分类号： H01F5/00

    CPC分类号： H01F41/041 ,  H01F17/0033 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H05K1/165 ,  H05K3/4602 ,  H05K2201/097 ,  H01L2924/00014

    摘要： A laminated electronic component including at least one inductance element and produced from a laminate having electrical insulators and electrical conductors laminated alternately. The inductance element is formed as a helical coil having a plurality of turns each constituted by four sides. The inductance element has pairs of parallel conductor pieces and pairs of bridging conductor pieces. Each pair of parallel conductor pieces form two of the four sides of one turn of the coil. Each pair of bridging conductor pieces form the other two sides of one turn of the coil. Grooves are formed in the laminate to thereby form the parallel conductor pieces. The grooves are filled with an electrically insulating material. The bridging conductor pieces are formed on the electrically insulating material.

    摘要翻译： 一种层叠电子部件，包括至少一个电感元件，并且由具有电绝缘体和电导体的交替层压体制成。 电感元件形成为具有多个由四边构成的匝数的螺旋线圈。 电感元件具有成对的平行导体片和成对的桥接导体片。 每对平行的导体片形成线圈一圈的四个侧面中的两个。 每对桥接导体片形成线圈一圈的另外两侧。 在层叠体中形成槽，从而形成平行的导体片。 槽中填充有电绝缘材料。 桥接导体片形成在电绝缘材料上。