公开(公告)号：USD786203S1

公开(公告)日：2017-05-09

申请号：US29537037

申请日：2015-08-21

Applicant: Nichia Corporation

Designer： Yoshiyuki Ide

公开(公告)号：US10276767B2

公开(公告)日：2019-04-30

申请号：US15608006

申请日：2017-05-30

Applicant: NICHIA CORPORATION

Inventor： Yoshiyuki Ide

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/56

Abstract: A light emitting device includes an element mounting board including a base, a set of conductive patterns, one or more light emitting elements, and a cover member. The set of conductive patterns includes one or more first conductive layers and one or more second conductive layers made of a different material. The second conductive layers partially cover the first conductive layers. The set of conductive patterns defines one or more element mounting areas each including a part of the first conductive layers not covered by the second conductive layers, and external connectors each including one or more outer edge exposed parts where a part of an outer edge of a corresponding one of the first conductive layers is exposed from the second conductive layers. The cover member covers the light emitting elements and the element mounting areas. The cover member is spaced apart from the outer edge exposed parts.

公开(公告)号：US11769862B2

公开(公告)日：2023-09-26

申请号：US17211473

申请日：2021-03-24

Applicant: NICHIA CORPORATION

Inventor： Dai Wakamatsu ,  Kimihiro Miyamoto ,  Kensuke Yamaoka ,  Yoshiyuki Ide

IPC: H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L33/64 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641

Abstract: A light emitting device includes: a first substrate including: a first lead, and a second lead positioned apart from the first lead; a second substrate disposed on an upper face of the second lead, the second substrate including: a base, and a first conducting part disposed on an upper face of the base; a light emitting element disposed on the second substrate and electrically connected to the first conducting part; a first wire electrically connecting the first lead and the first conducting part; and a wall part straddling and covering an upper face of the first lead and an upper face of the second lead. A height of the wall part is less than a height of the second substrate.

公开(公告)号：US09887333B2

公开(公告)日：2018-02-06

申请号：US15356999

申请日：2016-11-21

Applicant: NICHIA CORPORATION

Inventor： Yoshiyuki Ide

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60

Abstract: A light emitting device includes: an element mounting board having a base and conductive patterns disposed on a main surface of the base, and each having one or more element mounting areas and one or more external connection areas; conductive patterns each having first and second conductive layers which is made of a different material from that of the first conductive layer, and disposed in this order starting from the base side; element mounting areas, on which the light emitting elements are mounted, having the first conductive layer that is not covered by the second conductive layer; external connection areas having the first conductive layer in which an outer edge is exposed from the second conductive layer; a light reflecting component integrally covers the element mounting areas and lateral surfaces of the light emitting elements; and a light-transmissive component exposing the external connection areas.

公开(公告)号：US09627591B2

公开(公告)日：2017-04-18

申请号：US15050713

申请日：2016-02-23

Applicant: NICHIA CORPORATION

Inventor： Masashi Ishida ,  Yoshiyuki Ide ,  Tatsuya Hayashi ,  Tadayuki Kitajima ,  Takeshi Aki

IPC: H01L23/00 ,  H01L33/48 ,  H01L33/62 ,  H05K1/11 ,  H01L23/498

CPC classification number: H01L33/486 ,  H01L23/49838 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/12041 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3431 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/10106 ,  Y02P70/611

Abstract: A mounting substrate includes: a base; and at least one pair of wiring patterns disposed apart from each other on the base. At least one of the wiring patterns has a mounting portion, which is configured to support an electronic part thereon and which is rectangular in a plan view. The at least one of the wiring patterns defines a hole, which exposes a part of the base and which is disposed in at least a part of an outer edge of the mounting portion.