公开(公告)号：US09276180B2

公开(公告)日：2016-03-01

申请号：US14074084

申请日：2013-11-07

申请人： NICHIA CORPORATION

发明人： Masashi Ishida ,  Daisuke Sato ,  Tadayuki Kitajima

IPC分类号： H01L33/54 ,  H01L33/60 ,  H01L33/48 ,  H01L33/52 ,  H01L23/28 ,  H01L23/31 ,  H01L25/075 ,  H01L23/00 ,  H01L33/50

CPC分类号： H01L23/31 ,  H01L23/28 ,  H01L23/3135 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/483 ,  H01L33/502 ,  H01L33/505 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/00

摘要： A manufacturing method of a light emitting device includes a light emitting element disposed over a substrate and a reflective resin disposed along the side surface of the light emitting element. The method includes disposing light emitting elements in a matrix over an aggregate substrate, and disposing a semiconductor element between the adjacent light emitting elements in one direction of column and row directions of the light emitting elements in the matrix. A reflective resin is disposed to cover the semiconductor elements along the side surfaces of the light emitting elements and the side surfaces of the phosphor layers. The reflective resin and the substrate disposed in between the adjacent light emitting elements is cut in the column or row direction and between the light emitting element and the adjacent semiconductor element in the other direction, to include a light emitting element or a semiconductor element.

公开(公告)号：US09349664B2

公开(公告)日：2016-05-24

申请号：US14815742

申请日：2015-07-31

申请人： NICHIA CORPORATION

发明人： Masashi Ishida ,  Daisuke Sato ,  Tadayuki Kitajima

IPC分类号： H01L23/31 ,  H01L33/60 ,  H01L33/48 ,  H01L33/52 ,  H01L33/54 ,  H01L23/28 ,  H01L33/50 ,  H01L25/075 ,  H01L23/00

CPC分类号： H01L23/31 ,  H01L23/28 ,  H01L23/3135 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/483 ,  H01L33/502 ,  H01L33/505 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/00

摘要： A manufacturing method of a light emitting device includes a light emitting element disposed over a substrate and a reflective resin disposed along the side surface of the light emitting element. The method includes disposing light emitting elements in a matrix over an aggregate substrate, and disposing a semiconductor element between the adjacent light emitting elements in one direction of column and row directions of the light emitting elements in the matrix. A reflective resin is disposed to cover the semiconductor elements along the side surfaces of the light emitting elements and the side surfaces of the phosphor layers. The reflective resin and the substrate disposed in between the adjacent light emitting elements is cut in the column or row direction and between the light emitting element and the adjacent semiconductor element in the other direction, to include a light emitting element or a semiconductor element.

摘要翻译： 发光器件的制造方法包括设置在基板上的发光元件和沿着发光元件的侧表面设置的反射树脂。 该方法包括将矩阵中的发光元件设置在聚集衬底上，并且在矩阵中的发光元件的列和行方向的一个方向上在相邻的发光元件之间设置半导体元件。 反射树脂设置成沿着发光元件的侧表面和荧光体层的侧表面覆盖半导体元件。 设置在相邻的发光元件之间的反射树脂和基板在列或行方向上以及在另一方向上在发光元件和相邻的半导体元件之间被切割以包括发光元件或半导体元件。

公开(公告)号：USD731987S1

公开(公告)日：2015-06-16

申请号：US29459146

申请日：2013-06-26

申请人： Nichia Corporation

设计人： Masashi Ishida ,  Daisuke Sato ,  Atsushi Hashizume

公开(公告)号：US09627591B2

公开(公告)日：2017-04-18

申请号：US15050713

申请日：2016-02-23

申请人： NICHIA CORPORATION

发明人： Masashi Ishida ,  Yoshiyuki Ide ,  Tatsuya Hayashi ,  Tadayuki Kitajima ,  Takeshi Aki

IPC分类号： H01L23/00 ,  H01L33/48 ,  H01L33/62 ,  H05K1/11 ,  H01L23/498

CPC分类号： H01L33/486 ,  H01L23/49838 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/12041 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3431 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/10106 ,  Y02P70/611

摘要： A mounting substrate includes: a base; and at least one pair of wiring patterns disposed apart from each other on the base. At least one of the wiring patterns has a mounting portion, which is configured to support an electronic part thereon and which is rectangular in a plan view. The at least one of the wiring patterns defines a hole, which exposes a part of the base and which is disposed in at least a part of an outer edge of the mounting portion.