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公开(公告)号：US11038090B2
公开(公告)日：2021-06-15
申请号：US16632613
申请日：2018-07-31
Applicant: OSRAM OLED GmbH
Inventor： Daniel Leisen , Herbert Brunner , Emilia Dinu , Jens Eberhard , Christina Keith , Markus Pindl , Thomas Reeswinkel , Daniel Richter , Christopher Wiesmann , Ludwig Peyker , Alexander Linkov
IPC: H01L33/54 , H01L33/50 , H01L33/56 , H01L31/0203 , H01L31/18 , H01L31/0232
Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.
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2.发明授权公开(公告)号：US10964861B2
公开(公告)日：2021-03-30
申请号：US16866890
申请日：2020-05-05
Applicant: OSRAM OLED GmbH
Inventor： Markus Pindl , Thomas Schwarz , Frank Singer , Sandra Sobczyk
IPC: H01L33/54 , H01L33/00 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/50 , H01L33/48 , H01L33/56 , H01L21/56
Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.
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公开(公告)号：US10804439B2
公开(公告)日：2020-10-13
申请号：US16037388
申请日：2018-07-17
Applicant: OSRAM OLED GmbH
Inventor： Markus Pindl , Martin Brandl
IPC: H01L33/50
Abstract: A method produces a plurality of conversion elements including: A) providing a first carrier; B) applying a first element to the first carrier using a first application technique, the first element including a conversion material, the first application technique being different from compression molding; C) applying a second element to the first carrier by a second application technique, the second element including quantum dots, the quantum dots being introduced into a matrix material and being different from the conversion material, the second application technique being molding or compression molding; D) hardening of the matrix material; E) optionally, rearranging the arrangement produced according to step D) to a second carrier; and F) separating so that a plurality of conversion elements are generated.
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4.发明授权公开(公告)号：US11508884B2
公开(公告)日：2022-11-22
申请号：US17181458
申请日：2021-02-22
Applicant: OSRAM OLED GmbH
Inventor： Markus Pindl , Thomas Schwarz , Frank Singer , Sandra Sobczyk
IPC: H01L33/54 , H01L33/00 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/50 , H01L33/48 , H01L33/56 , H01L21/56
Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.
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公开(公告)号：US11211524B2
公开(公告)日：2021-12-28
申请号：US16631294
申请日：2018-07-31
Applicant: OSRAM OLED GmbH
Inventor： Daniel Leisen , Herbert Brunner , Emilia Dinu , Jens Eberhard , Christina Keith , Markus Pindl , Thomas Reeswinkel , Daniel Richter
Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.
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Patent Agency Ranking
6.发明授权公开(公告)号：US10686104B2
公开(公告)日：2020-06-16
申请号：US16240584
申请日：2019-01-04
Applicant: OSRAM OLED GMBH
Inventor： Markus Pindl , Thomas Schwarz , Frank Singer , Sandra Sobczyk
IPC: H01L33/54 , H01L33/00 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/50 , H01L33/48 , H01L33/56 , H01L21/56
Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.
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7.发明授权公开(公告)号：US11881544B2
公开(公告)日：2024-01-23
申请号：US17960794
申请日：2022-10-05
Applicant: OSRAM OLED GmbH
Inventor： Markus Pindl , Thomas Schwarz , Frank Singer , Sandra Sobczyk
IPC: H01L33/54 , H01L33/00 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/50 , H01L33/48 , H01L33/56 , H01L21/56
CPC classification number: H01L33/54 , H01L31/0203 , H01L31/02322 , H01L31/186 , H01L33/0095 , H01L33/502 , H01L21/568 , H01L33/486 , H01L33/505 , H01L33/56 , H01L2224/18 , H01L2224/24 , H01L2224/2518 , H01L2224/82 , H01L2933/005 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058
Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.
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公开(公告)号：US20210135068A1
公开(公告)日：2021-05-06
申请号：US16632613
申请日：2018-07-31
Applicant: OSRAM OLED GmbH
Inventor： Daniel Leisen , Herbert Brunner , Emilia Dinu , Jens Eberhard , Christina Keith , Markus Pindl , Thomas Reeswinkel , Daniel Richter , Christopher Wiesmann , Ludwig Peyker , Alexander Linkov
IPC: H01L33/54 , H01L33/50 , H01L33/56 , H01L31/0203 , H01L31/0232 , H01L31/18
Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.
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公开(公告)号：US20210126156A1
公开(公告)日：2021-04-29
申请号：US16631294
申请日：2018-07-31
Applicant: OSRAM OLED GmbH
Inventor： Daniel Leisen , Herbert Brunner , Emilia Dinu , Jens Eberhard , Christina Keith , Markus Pindl , Thomas Reeswinkel , Daniel Richter
Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.
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10.发明授权公开(公告)号：US10931081B2
公开(公告)日：2021-02-23
申请号：US16074925
申请日：2017-02-03
Applicant: OSRAM OLED GmbH
Inventor： Andreas Wojcik , Tobias Gebuhr , Markus Pindl
Abstract: A method of producing an optoelectronic lighting device includes providing a laser chip carrier on which two edge emitting laser chips, arranging a carrier including two optical elements onto the laser chip carrier, forming a respective optical connection by an optical material between a respective laser facet and a respective optical element, singulating the two laser chips by dividing the laser chip carrier between the two laser chips to form two mutually divided laser chip carrier parts, wherein the dividing includes dividing the carrier between the two optical elements to form two mutually divided carrier parts each including one of the two optical elements, such that two singulated laser chips arranged on the respective divided laser chip carrier part are formed, the respective laser facets of which are optically connected to the respective optical element of the respective carrier part by the optical material.
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