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公开(公告)号：US10177293B2
公开(公告)日：2019-01-08
申请号：US15524644
申请日：2015-11-05
Applicant: OSRAM Opto Semiconductors Gmbh
Inventor： Michael Wittmann , Tobias Gebuhr , David Racz
Abstract: An optoelectronic component includes a first lead frame section and a second lead frame section spaced apart from one another, and having an optoelectronic semiconductor chip arranged on the first lead frame section and the second lead frame section, wherein the first lead frame section and the second lead frame section respectively have an upper side, a lower side and a first side flank extending between the upper side and the lower side, a first lateral solder contact surface of the optoelectronic component is formed on the first side flank of the first lead frame section, and the first lateral solder contact surface is formed by a recess arranged on the first side flank of the first lead frame section and extends from the upper side to the lower side of the first lead frame section.
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公开(公告)号：US09997559B2
公开(公告)日：2018-06-12
申请号：US15825003
申请日：2017-11-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Groetsch , Matthias Kiessling , Michael Wittmann , Stefan Gruber
CPC classification number: H01L27/15 , H05B33/0803 , H05B33/0815 , H05B33/083
Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.
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公开(公告)号：US20180114744A1
公开(公告)日：2018-04-26
申请号：US15737525
申请日：2016-06-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Martin Brandl , Ion Stoll , Michael Wittmann
IPC: H01L23/495 , H01L33/62 , H01L33/48 , H01L25/16 , H01L33/60 , H01L31/0203 , H01L25/075 , H01L33/50
CPC classification number: H01L23/49541 , H01L25/0753 , H01L25/167 , H01L31/0203 , H01L33/486 , H01L33/505 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/12041 , H01L2924/19107 , H01L2933/0066 , H01L2924/00014
Abstract: A method of producing an optoelectronic component includes providing a lead frame having an upper side including a contact region and a chip reception region raised relative to the contact region; arranging an electrically conductive element on the contact region; embedding the lead frame in a molded body, wherein the contact region is covered by the molded body, and the chip reception region and the electrically conductive element remain accessible on an upper side of the molded body; arranging an optoelectronic semiconductor chip on the chip reception region; and connecting the optoelectronic semiconductor chip and the electrically conductive element by a bonding wire.
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公开(公告)号：US20220149019A1
公开(公告)日：2022-05-12
申请号：US17541798
申请日：2021-12-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Brandl , Andreas Dobner , Matthias Goldbach , Sebastian Wittmann , Uli Hiller , Markus Klein , Thomas Schwarz , Andreas Waldschik , Michael Wittmann , Matthias Bruckschloegl , Stefan Groetsch , Rainer Huber , Peter Brick , Ludwig Hofbauer
IPC: H01L25/075 , H01L33/46 , H01L33/62 , H01L33/64
Abstract: An optoelectronic device comprises a layer stack, which includes a carrier layer, a cover layer, and a first layer. The first layer is in particular an intermediate layer, arranged between the cover layer and the carrier layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is arranged on the first layer and at least one layer of the layer stack and preferably all layers of the layer stack are at least partially transparent. The layer stack comprises at least one layer which comprises particles with a high thermal conductivity and/or at least one thermally conductive layer which is arranged between two adjacent layers of the layer stack.
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公开(公告)号：US10312416B2
公开(公告)日：2019-06-04
申请号：US15090028
申请日：2016-04-04
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Wittmann
Abstract: A radiation-emitting semiconductor device includes a housing body having a chip mounting area, a chip connection region, a radiation-emitting semiconductor chip, and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at selected locations at which the chip connection region is not covered by the radiation-emitting semiconductor chip, the radiation-emitting semiconductor chip is free of the light-absorbing material in selected locations, the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged, the chip mounting area is a surface of the housing body which abuts the cavity, and the chip mounting area is free of the light-absorbing material in selected locations remote from the chip connection region.
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Patent Agency Ranking
公开(公告)号：US20190074418A1
公开(公告)日：2019-03-07
申请号：US16079749
申请日：2017-02-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Wittmann , Martin Brandl
Abstract: An optoelectronic component has at least one lead frame section, wherein an optoelectronic element is arranged on the lead frame section, a mold material is applied at least on a first face of the lead frame section and adhesively connected to the lead frame section by the first face, the lead frame section consists of a predetermined material, a part of the first face of the lead frame section is provided with a coating, a region of the first face is free of the coating, and the mold material connects to the material of the lead frame section in the free region.
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公开(公告)号：US20180219125A1
公开(公告)日：2018-08-02
申请号：US15746625
申请日：2016-07-21
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Markus Wicke , Michael Wittmann
CPC classification number: H01L33/08 , H01L33/504 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
Abstract: An optoelectronic lighting device includes a black housing including a cavity, wherein the cavity includes a base, a semiconductor component is arranged on the base of the cavity with an underside of a main body facing the base, and the cavity is filled with a reflective material from the base up to a predetermined height, which is smaller than a height of a top side of the main body relative to the base of the cavity such that electromagnetic radiation emerging from the main body through side faces may be reflected by the reflective material back in the direction of the side faces to couple reflected electromagnetic radiation into the main body such that at least part of the electromagnetic radiation coupled in may emerge again from the main body through the top side of the main body.
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公开(公告)号：US20180083063A1
公开(公告)日：2018-03-22
申请号：US15825003
申请日：2017-11-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Groetsch , Matthias Kiessling , Michael Wittmann , Stefan Gruber
CPC classification number: H01L27/15 , H05B33/0803 , H05B33/0815 , H05B33/083
Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.
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公开(公告)号：US20170324012A1
公开(公告)日：2017-11-09
申请号：US15524644
申请日：2015-11-05
Applicant: OSRAM Opto Semiconductors Gmbh
Inventor： Michael Wittmann , Tobias Gebuhr , David Racz
CPC classification number: H01L33/62 , H01L33/486 , H01L33/50 , H01L2933/0041 , H01L2933/0066
Abstract: An optoelectronic component includes a first lead frame section and a second lead frame section spaced apart from one another, and having an optoelectronic semiconductor chip arranged on the first lead frame section and the second lead frame section, wherein the first lead frame section and the second lead frame section respectively have an upper side, a lower side and a first side flank extending between the upper side and the lower side, a first lateral solder contact surface of the optoelectronic component is formed on the first side flank of the first lead frame section, and the first lateral solder contact surface is formed by a recess arranged on the first side flank of the first lead frame section and extends from the upper side to the lower side of the first lead frame section.
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公开(公告)号：US20170222103A1
公开(公告)日：2017-08-03
申请号：US15119503
申请日：2015-02-18
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Luca Haiberger , Michael Wittmann
CPC classification number: H01L33/56 , H01L33/465 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/54 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
Abstract: An optoelectronic component includes a housing having a cavity in which an optoelectronic semiconductor chip having an emission face that emits light rays and a transparent potting material are arranged, wherein the cavity includes at least one side wall at least partly reflecting light rays incident on the side wall and reflectivity of which decreases as an operating period of the component increases, conversion particles are embedded into the potting material, which conversion particles convert light rays having a first wavelength incident on the conversion particles into light rays having a second wavelength, and scattering particles are embedded into the potting material, which scattering particles scatter light rays incident on the scattering particles and the scattering capability of which scattering particles increases as the operating period increases.
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