摘要:
In a method of manufacturing a sheet member comprising: obtaining a sintered compact by sintering a sheet-like compact having a reduced-thickness portion and an enlarged-thickness portion; and then repressing the sintered compact into a sheet member, a difference in density between the reduced-thickness portion and the enlarged-thickness portion of the sintered compact after repressing is adjusted to be in a range of .+-.1.5%. By doing so, the accuracy of flatness is enhanced and the amount of distortion, which would otherwise remain in the sheet member, is reduced because the sheet member is formed by sintering the sheet-like compact. In addition, the deformation caused by heating is greatly restricted. Accordingly, the prospect of the sheet member of the present invention is bright as a heat dissipating plate.
摘要:
Disclosed is a thin plate member for forming a semiconductor package, having a recess for receiving a semiconductor chip. The thin plate is composed of sintered metal, e.g. sintered copper or sintered alluminum alloy. A sintered metal body being porous and having a shape which is close to the shape of the thin plate member is prepared, and it is sized into the shape of the thin plate member. The sintered alluminum alloy comprises 0.4 to 0.8% by weight of magnesium, 0.2 to 0.6% by weight of silicon and the balance aluminum and has a structure comprising an aluminum phase being formed of aluminum particles and an alloy phase being composed of magnesium, silicon and aluminum and interposing between the aluminum particles, and the sintered copper has a metallographic structure comprising a phase of copper particles.
摘要:
A plurality of blanks divided at a division end face 5 or a blank-bonded product comprising a plurality of blanks sintered and bonded together are or is compressed in the same mold, so that they are plastically deformed until the division end faces 5 are cohered. Thereafter, a load is applied to the plastically worked product in a direction of breaking of the division end faces 5 to break the division end faces 5 and divide the plastically worked product into a plurality of members. In this manner, a split type mechanical part having irregularities meshed with each other on mating faces and easily positionable relative to each other can be produced with a good dimentional accuracy.
摘要:
There is provided a connecting rod including a connecting rod body and a cap having excellent alignment properties, and a method of producing such a connecting rod. A connecting rod body and a cap are produced through the steps of molding green compacts respectively corresponding to the connecting rod body and the cap; sintering and unifying both the green compacts; forging the resultant sintered product in a mold; and fracturing the resultant forged product. The green compact corresponding to the cap and/or the green compact corresponding to the connecting rod body includes opposite circumferential end faces formed with one or more projection. A clearance c is formed between both circumferential end faces of the sintered product due to the projection. With this clearance c, both the circumferential end faces are formed with recesses and projections which are fitted to each other during the forging process and which are relatively large and thus have large biting amounts. During the fracturing process, the recesses and the projections are separated into two pieces.
摘要:
The Al-Si sintered alloy having good mechanical strength and elongation and is especially excellent in wear resistance, and a method for producing the same. The sintered alloy consists of 2.4-23.5% Si, 2-5% Cu, 0.2-1.5% Mg, 0.01-1% of transition metals and the balance of aluminum and unavoidable impurities, and has a dapple grain structure of an Al-solid solution phase and an Al-Si alloy phase containing dispersed pro-eutectic Si crystals having a maximum diameter of 5-60 .mu.m either in the whole body or in the surface contact portion, and the area ratio of the Al-solid solution phase in the grain structure is in the range of 20-80%.
摘要:
A forming die assembly for microcomponents includes a forming die and a punch. The forming die is formed with a cavity, a punch hole connected to the cavity, and a supply path for supplying a raw material with a metal powder and a binder having plasticity. The supply path is connected to the cavity so as to have a gate therebetween and is used for supplying the raw material into the cavity. The punch is slidably inserted into the punch hole, and it opens and closes the gate by reciprocatory sliding. The punch closes the gate and compresses the raw material in the cavity into a green compact by sliding in the direction of the cavity.
摘要:
A production method for a fluid dynamic pressure sintered bearing includes: preparing a sintered bearing having a porosity of 8 to 20 vol % as a material; and controlling at least one of an overall length, an outer diameter, and an inner diameter of the sintered bearing by repressing the sintered bearing. The production method further includes: forming grooves for generating a fluid dynamic pressure on a bearing surface of the sintered bearing by performing repressing and plastic working on the sintered bearing; and sealing pores exposed on the bearing surface by infiltrating a resin into at least the pores; and barreling entire surface of the sintered bearing by magnetic barreling or electromagnetic barreling.
摘要:
A forming die assembly for microcomponents includes a forming die, a plunger, and a punch. The forming die is formed with a cavity, a storage portion for storing a raw material with a metal powder and a binder having plasticity, and a punch hole that connects the cavity and the storage portion so as to form a gate therebetween. The plunger is formed so as to be slidably inserted into the storage portion and to fill the raw material stored in the storage portion into the cavity through the punch hole. The punch is slidably inserted into the plunger in the sliding direction of the plunger and opens and closes the gate by reciprocatory sliding. The punch closes the gate and compresses the raw material in the cavity into a green compact by sliding in the direction of the cavity.
摘要:
Provided is a high temperature thermoelectric converting module including a plurality of p type thermoelectric elements; a plurality of n type thermoelectric elements; a plurality of electrodes; and a lead line. The plurality of p type thermoelectric elements, the plurality of n type thermoelectric elements, and the plurality of electrodes are electrically serially connected to each other, a pair of connecting lines that connects the lead line to one of the plurality of electrodes to output to the outside is further included, at least one electrode which is disposed at the high temperature side and the plurality of p type and n type thermoelectric elements are bonded with an intermediate layer therebetween. The plurality of p type and n type thermoelectric elements contain silicon as a component and the intermediate layer is formed as a layer containing aluminum and silicon and components other than silicon of the thermoelectric elements.
摘要:
A production method includes: preparing a metal powder composed of one of Mo and W, and a binder composed of a thermoplastic resin and a wax; mixing the metal powder and 40 to 60 volume % of the binder with respect to the metal powder into a mixed powder; and heating and kneading the mixed powder into a raw material. The production method further includes: supplying a predetermined of the raw material in a hole of a die; and compacting the raw material into a cup-shaped green compact by pressing the raw material by a punch, the cup-shaped green compact having a cylindrical portion, a bottom formed at one end portion thereof, and an opening formed at another end portion thereof. The production method further includes: ejecting the cup-shaped green compact from the hole of the die; removing the binder from the ejected cup-shaped green compact by heating; and sintering the cup-shaped green compact by heating the green compact and diffusion-bonding particles of the green compact.