公开(公告)号：US20150250058A1

公开(公告)日：2015-09-03

申请号：US14463367

申请日：2014-08-19

Applicant: QUALCOMM Incorporated

Inventor： Vidhya RAMACHANDRAN ,  Urmi RAY ,  Ravindra Vaman SHENOY ,  Kwan-Yu LAI ,  Jon Bradley LASITER

IPC: H05K1/18 ,  H01L21/768 ,  H01L21/28 ,  H01L23/538

CPC classification number: H05K1/185 ,  H01L21/28008 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/84 ,  H01L23/147 ,  H01L23/49827 ,  H01L23/5384 ,  H01L25/065 ,  H01L27/0629 ,  H01L27/0688 ,  H01L27/12 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/00

Abstract: An integrated interposer between a first component and a second component includes a substrate. The substrate may have thermal and/or mechanical properties with values lying between the thermal and/or mechanical properties of the first component and the second component. Active devices are disposed on a first surface of the substrate. A contact layer is coupled to the active devices and configured to couple at least the first component and a third component to the integrated interposer. At least one through via(s) is coupled to the contact layer and extends through the substrate to a second surface of the substrate. An interconnect layer is disposed on the second surface of the substrate and coupled to the at least one through via(s). The interconnect layer is configured to couple the second component to the integrated interposer.

Abstract translation: 第一部件和第二部件之间的集成插入件包括基板。 衬底可以具有热和/或机械性能，其中值位于第一部件和第二部件的热和/或机械性能之间。 有源器件设置在衬底的第一表面上。 接触层耦合到有源器件并且被配置为将至少第一部件和第三部件耦合到集成插入器。 至少一个通孔连接到接触层并且延伸穿过衬底到衬底的第二表面。 互连层设置在衬底的第二表面上并且耦合到至少一个通孔。 互连层被配置为将第二组件耦合到集成插入器。

公开(公告)号：US20170125512A1

公开(公告)日：2017-05-04

申请号：US15375137

申请日：2016-12-11

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie YUN ,  Daeik Daniel KIM ,  Chengjie ZUO ,  Jonghae KIM ,  Mario Francisco VELEZ ,  Donald William KIDWELL JR ,  Jon Bradley LASITER ,  Kwan-Yu LAI ,  Jitae KIM ,  Ravindra Vaman SHENOY

IPC: H01L49/02

CPC classification number: H01L28/90 ,  H01G4/012 ,  H01G4/33 ,  H01L21/28282 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5223 ,  H01L27/0805 ,  H01L27/12 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are space-efficient capacitors that have a higher quality factor than conventional designs and improve coupling of electrical energy from a through-glass via (TGV) to a dielectric. For example, provided is a TGV having a non-rectangular cross-section, where one end of the TGV is coupled to a first metal plate. A dielectric material is formed on the first metal plate. A second metal plate is formed on the dielectric material in a manner that overlaps at least a portion of the first metal plate to form at least one overlapped region of the dielectric material. At least a part of the perimeter of the overlapped region is non-planar. The overlapped region can be formed in a shape of a closed ring, in a plurality of portions of a ring shape, in substantially a quarter of a ring shape, and/or in substantially a half of a ring shape.

公开(公告)号：US20150228712A1

公开(公告)日：2015-08-13

申请号：US14177072

申请日：2014-02-10

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie YUN ,  Daeik Daniel KIM ,  Chengjie ZUO ,  Jonghae KIM ,  Mario Francisco VELEZ ,  Donald William KIDWELL ,  Jon Bradley LASITER ,  Kwan-Yu LAI ,  Jitae KIM ,  Ravindra Vaman SHENOY

IPC: H01L49/02 ,  H01L23/48

CPC classification number: H01L28/90 ,  H01G4/012 ,  H01G4/33 ,  H01L21/28282 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5223 ,  H01L27/0805 ,  H01L27/12 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are space-efficient capacitors that have a higher quality factor than conventional designs and improve coupling of electrical energy from a through-glass via (TGV) to a dielectric. For example, provided is a TGV having a non-rectangular cross-section, where one end of the TGV is coupled to a first metal plate. A dielectric material is formed on the first metal plate. A second metal plate is formed on the dielectric material in a manner that overlaps at least a portion of the first metal plate to form at least one overlapped region of the dielectric material. At least a part of the perimeter of the overlapped region is non-planar. The overlapped region can be formed in a shape of a closed ring, in a plurality of portions of a ring shape, in substantially a quarter of a ring shape, and/or in substantially a half of a ring shape.

Abstract translation: 提供的空间效率电容器具有比传统设计更高的品质因数，并且改善了从直通玻璃通孔（TGV）到电介质的电能的耦合。 例如，提供了具有非矩形横截面的TGV，其中TGV的一端耦合到第一金属板。 在第一金属板上形成电介质材料。 第二金属板以与第一金属板的至少一部分重叠以形成电介质材料的至少一个重叠区域的方式形成在电介质材料上。 重叠区域的周边的至少一部分是非平面的。 重叠区域可以形成为环形的多个部分中的大致四分之一环形的闭环形状和/或大致一半的环形形状。

公开(公告)号：US20210400178A1

公开(公告)日：2021-12-23

申请号：US17446895

申请日：2021-09-03

Applicant: QUALCOMM Incorporated

Inventor： Russell GRUHLKE ,  Jon LASITER ,  Ravindra Vaman SHENOY ,  Ravishankar SIVALINGAM ,  Kebin LI ,  Khurshid Syed ALAM

IPC: H04N5/225 ,  H04N5/232

Abstract: Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.

公开(公告)号：US20200344413A1

公开(公告)日：2020-10-29

申请号：US16857045

申请日：2020-04-23

Applicant: QUALCOMM Incorporated

Inventor： Jon LASITER ,  Evgeni GOUSEV ,  Ravindra Vaman SHENOY ,  Russell GRUHLKE ,  Khurshid Syed ALAM ,  Kebin LI ,  Edwin Chongwoo PARK

IPC: H04N5/232 ,  H04N5/225

Abstract: In one example, an image sensor module comprises one or more covers having at least a first opening and a second opening, a first lens mounted in the first opening and having a first field of view (FOV) centered at a first axis having a first orientation, a second lens mounted in the second opening and having a second FOV centered at a second axis having a second orientation different from the first orientation, a first image sensor housed within the one or more covers and configured to detect light via the first lens, and a second image sensor housed within the one or more covers and configured to detect light via the second lens. The first image sensor and the second image sensor are configured to provide, based on the detected light, image data of a combined FOV larger than each of the first FOV and the second FOV.

公开(公告)号：US20190164681A1

公开(公告)日：2019-05-30

申请号：US15826735

申请日：2017-11-30

Applicant: QUALCOMM Incorporated

Inventor： Donald William KIDWELL, JR. ,  Ravindra Vaman SHENOY ,  Alan LEWIS ,  Christopher Feuling FERGUSON

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/24 ,  H01F41/04 ,  H01F41/12 ,  H05K1/18 ,  H01L23/498 ,  H01L23/64 ,  H01L23/00

Abstract: Some aspects pertain to an inductor apparatus that includes a first metal layer including a plurality of first interconnects, a second metal including a plurality of second interconnects, a first dielectric layer between the first metal layer and the second metal layer, and an inductor. The inductor includes a plurality of vias, where the plurality of vias are configured to couple the plurality of first interconnects to the plurality of second interconnects. The inductor includes a plurality of inductor loops formed by the plurality of vias, the plurality of first interconnects and the plurality of second interconnects. The inductor further includes a first magnetic layer and a second magnetic layer, located between the first interconnects and the second interconnects; and a third magnetic layer and an optional fourth magnetic layer outside of the plurality of inductor loops.

公开(公告)号：US20170343346A1

公开(公告)日：2017-11-30

申请号：US15169503

申请日：2016-05-31

Applicant: QUALCOMM Incorporated

Inventor： Firas SAMMOURA ,  Stephanie FUNG ,  Donald William KIDWELL, JR. ,  Ravindra Vaman SHENOY ,  David William BURNS

IPC: G01C9/20 ,  G01F23/296

CPC classification number: G01C9/20 ,  G01C9/18 ,  G01F23/2965

Abstract: A device may include a surface at least partially defining an enclosed region, a plurality of fluids within the enclosed region, the plurality of fluids comprising at least a first fluid having a first acoustic impedance and a second fluid having a second acoustic impedance different from the first acoustic impedance, a first piezoelectric transducer disposed on the surface, the first piezoelectric transducer being configured to generate a first wave reception signal based, at least in part, on an ultrasonic return wave received through at least one of the plurality of fluids, and a processor coupled to the first piezoelectric transducer and configured to determine a measurement of a tilt of the device based, at least in part, on the first wave reception signal.

公开(公告)号：US20170062398A1

公开(公告)日：2017-03-02

申请号：US14843964

申请日：2015-09-02

Applicant: QUALCOMM Incorporated

Inventor： Karim ARABI ,  Ravindra Vaman SHENOY ,  Evgeni Petrovich GOUSEV ,  Mete ERTURK

IPC: H01L25/18 ,  H01L23/538 ,  H01L49/02 ,  H01L25/00 ,  H01L21/48

CPC classification number: H01L28/10 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/645 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/16267 ,  H01L2224/16268 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19042 ,  H01L2924/19103

Abstract: A voltage regulator having a coil inductor is integrated or embedded in a system-on-chip (SOC) device. The coil inductor is fabricated on an inductor wafer with through vias, and the inductor wafer is joined with an SOC wafer for integration with the SOC device.

Abstract translation: 具有线圈电感器的电压调节器集成或嵌入到片上系统（SOC）器件中。 线圈电感器制造在具有通孔的电感器晶片上，并且电感器晶片与SOC晶片连接以与SOC器件集成。

公开(公告)号：US20160315024A1

公开(公告)日：2016-10-27

申请号：US14691946

申请日：2015-04-21

Applicant: QUALCOMM Incorporated

Inventor： Kwan-yu LAI ,  Ravindra Vaman SHENOY ,  Urmi RAY

IPC: H01L23/15 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/15 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/81 ,  H01L2224/04105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73267 ,  H01L2224/81805 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15788 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00014

Abstract: An integrated circuit package includes a core such as a thin glass core with through-core vias. A photo-patternable material is disposed directly on surfaces of the core and in the through-core vias and is selectively patterned to expose at least an exposed portion of the surface of the core and the through-core vias. A metal layer, such as copper, is disposed in the exposed portion of the core and in the through-core vias. A mechanical handler frame may be used to clamp together the various layers including the core and the photo-patternable material. The photo-patternable material that remains after patterning is permanent, and prevents the mechanical handler frame from directly contacting the core. Thus the photo-patternable material provides mechanical support to the core and protects the core from the mechanical handler.

Abstract translation: 集成电路封装包括芯，例如具有贯通芯通孔的薄玻璃芯。 光可图案化材料直接设置在芯的表面和通孔通孔中，并且被选择性地图案化以暴露核心表面和透核通孔的至少暴露部分。 金属层，例如铜，被布置在芯的暴露部分和通孔通孔中。 可以使用机械处理器框架将包括芯和可光图案化材料的各种层夹在一起。 在图案化之后保留的可光图案的材料是永久性的，并且防止机械处理器框架直接接触芯部。 因此，可照光图案材料为芯提供机械支撑并且保护芯不受机械处理器的影响。

公开(公告)号：US20200147643A1

公开(公告)日：2020-05-14

申请号：US16738530

申请日：2020-01-09

Applicant: Qualcomm Incorporated

Inventor： Firas SAMMOURA ,  David William BURNS ,  Ravindra Vaman SHENOY

IPC: B06B1/06 ,  G06K9/00 ,  G06F3/041 ,  G06F1/3234 ,  G06F3/043

Abstract: Implementations of the subject matter described herein relate to sensors including piezoelectric micromechanical ultrasonic transducer (PMUT) sensor elements and arrays thereof. The PMUT sensor elements may be switchable between a non-ultrasonic force detection mode and an ultrasonic imaging mode. A PMUT sensor element may include a diaphragm that is capable of a static displacement on application of a force and is capable of a dynamic displacement when the PMUT sensor element transmits or receives ultrasonic signals. In some implementations, a PMUT sensor element includes a two dimensional-electron gas structure on the diaphragm. The sensors may further include a sensor controller configured to switch between a non-ultrasonic force detection mode and an ultrasonic imaging mode for one or more of the PMUT sensor elements, wherein an applied force is measured in the non-ultrasonic force detection mode and wherein an object is imaged ultrasonically during the ultrasonic imaging mode.