INTEGRATED INTERPOSER WITH EMBEDDED ACTIVE DEVICES
    3.
    发明申请
    INTEGRATED INTERPOSER WITH EMBEDDED ACTIVE DEVICES 有权
    具有嵌入式有源器件的集成式插补器

    公开(公告)号:US20150250058A1

    公开(公告)日:2015-09-03

    申请号:US14463367

    申请日:2014-08-19

    Abstract: An integrated interposer between a first component and a second component includes a substrate. The substrate may have thermal and/or mechanical properties with values lying between the thermal and/or mechanical properties of the first component and the second component. Active devices are disposed on a first surface of the substrate. A contact layer is coupled to the active devices and configured to couple at least the first component and a third component to the integrated interposer. At least one through via(s) is coupled to the contact layer and extends through the substrate to a second surface of the substrate. An interconnect layer is disposed on the second surface of the substrate and coupled to the at least one through via(s). The interconnect layer is configured to couple the second component to the integrated interposer.

    Abstract translation: 第一部件和第二部件之间的集成插入件包括基板。 衬底可以具有热和/或机械性能,其中值位于第一部件和第二部件的热和/或机械性能之间。 有源器件设置在衬底的第一表面上。 接触层耦合到有源器件并且被配置为将至少第一部件和第三部件耦合到集成插入器。 至少一个通孔连接到接触层并且延伸穿过衬底到衬底的第二表面。 互连层设置在衬底的第二表面上并且耦合到至少一个通孔。 互连层被配置为将第二组件耦合到集成插入器。

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