公开(公告)号：US20220208628A1

公开(公告)日：2022-06-30

申请号：US17565402

申请日：2021-12-29

Applicant: Richtek Technology Corporation

Inventor： Shih-Chieh Lin ,  Yong-Zhong Hu ,  Heng-Chi Huang ,  Hao-Lin Yen

IPC: H01L23/31 ,  H01L23/15 ,  H01L23/495 ,  H01L23/367

Abstract: A chip packaging structure includes: at least one semiconductor chip, having a signal processing function; a base material, wherein the semiconductor chip is disposed on the base material; at least one thermal conduction plate, disposed on the base material; and a package material, encapsulating the base material, the thermal conduction plate, and the semiconductor chip. The thermal conduction plate forms at least one thermal conduction channel in the package material.

公开(公告)号：US20170328800A1

公开(公告)日：2017-11-16

申请号：US15649062

申请日：2017-07-13

Applicant: RICHTEK TECHNOLOGY CORPORATION

Inventor： Cheng-Syun Li ,  Chiung-Cheng Lo ,  Chia-Yu Wu ,  Shih-Chieh Lin

IPC: G01L19/00 ,  B81B7/02 ,  G01L9/00

CPC classification number: G01L19/0092 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0353 ,  B81B2207/11 ,  B81C1/00309 ,  G01L9/0042 ,  G01L9/0054 ,  G01L9/0072 ,  G01L9/0073 ,  G01L19/0618

Abstract: The invention provides a combo MEMS device. The combo MEMS device includes a substrate, a device layer, a cap, and at least two sensor units. The device layer is on the substrate. The cap is on the device layer. At least two sensor units which are adjacent to each other are both formed by the substrate, the device layer, and the cap. The first sensor unit includes a sealed space, and the second sensor unit includes a membrane and a semi-sealed space. The membrane is formed by reducing a thickness of a portion of the device layer. The semi-sealed space is formed between the substrate and the device layer or between the device layer and the cap, to receive an external pressure through an external pressure communication opening. The external pressure communication opening is formed between the substrate and the device layer, or between the device layer and the cap, or between the substrate and the cap.

公开(公告)号：US20170122974A1

公开(公告)日：2017-05-04

申请号：US14931696

申请日：2015-11-03

Applicant: RICHTEK TECHNOLOGY CORPORATION

Inventor： Shih-Chieh Lin

IPC: G01P15/125

CPC classification number: G01P15/125 ,  B81B2201/0235 ,  B81B2203/0181 ,  B81B2203/051 ,  G01P15/18 ,  G01P21/00 ,  G01P2015/0814 ,  G01P2015/0831 ,  G01P2015/0868

Abstract: A MEMS device includes: a substrate; a proof mass suspended over the substrate, the proof mass including at least one proof mass body and a proof mass frame connected to and accommodating the proof mass body, the proof mass frame including at least one self-test frame; and at least one self-test electrode inside the self-test frame, and connected to the substrate; wherein when a voltage difference is applied between the self-test electrode and the self-test frame, the proof mass is driven to have an in-plane movement, and wherein the self-test electrode and the self-test frame do not form a sensing capacitor in between.

公开(公告)号：US20240203840A1

公开(公告)日：2024-06-20

申请号：US18520789

申请日：2023-11-28

Applicant: Richtek Technology Corporation

Inventor： Shih-Chieh Lin ,  Min-Shun Lo ,  Heng-Chi Huang ,  Yong-Zhong Hu

IPC: H01L23/495

CPC classification number: H01L23/49544

Abstract: A lead frame includes: a die pad having a die disposing area; a plurality of lead pads located around the die pad; an outer frame, located at a periphery of the die pad and the lead pads; and at least two tie bars, respectively connected between the outer frame and two opposite sides of the die pad. At least one of the die pad and the tie bars includes a thermal deformation mitigation structure.

公开(公告)号：US20180004233A1

公开(公告)日：2018-01-04

申请号：US15249253

申请日：2016-08-26

Applicant: Richtek Technology Corporation

Inventor： Shih-Chieh Lin ,  Yu-Fu Kang ,  Chiung-Cheng Lo

IPC: G05D7/06 ,  F16K1/04 ,  B67D7/32 ,  B05B12/08 ,  B67D7/12 ,  B67D7/04 ,  F16K1/12 ,  B67D7/42

CPC classification number: G05D7/0635 ,  B05B12/08 ,  B67D7/04 ,  B67D7/12 ,  B67D7/3218 ,  B67D7/425 ,  F16K1/04 ,  F16K1/126 ,  F16K17/36

Abstract: A fluid dispenser, includes: a fluid dispensation pipe, for receiving a fluid and controlling a dispensation the fluid; a MEMS sensor, for sensing a movement of the fluid dispenser, wherein when the movement is determined to be in an abnormal status, the MEMS sensor generates an alarm signal; and a dispensation stopper, for stopping the dispensation of the fluid according to the alarm signal.

公开(公告)号：US20230163042A1

公开(公告)日：2023-05-25

申请号：US17858124

申请日：2022-07-06

Applicant: Richtek Technology Corporation

Inventor： Heng-Chi Huang ,  Sheng-Yao Wu ,  Min-Shun Lo ,  Shih-Chieh Lin ,  Yong-Zhong Hu

IPC: H01L23/367 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/373

CPC classification number: H01L23/3675 ,  H01L25/0655 ,  H01L24/16 ,  H01L24/96 ,  H01L24/97 ,  H01L21/568 ,  H01L21/561 ,  H01L24/11 ,  H01L21/4882 ,  H01L23/3121 ,  H01L23/3735 ,  H01L2924/30101 ,  H01L2924/30107 ,  H01L2224/95001 ,  H01L24/13 ,  H01L2224/13147 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13116 ,  H01L2224/11462 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/16235 ,  H01L2924/182

Abstract: A package structure includes: a heat dissipation substrate; at least one die, including a signal transmitting side and a heat conduction side, wherein the signal transmitting side and the heat conduction side are two opposite sides on the die, and the heat conduction side is disposed on and in contact with the heat dissipation substrate; plural metal bumps, disposed on the signal transmitting side; and a package material, encapsulating the die, a side of the heat dissipation substrate in contact with the die, and the metal bumps, wherein a portion of each metal bump is exposed to an outside of the package material.

公开(公告)号：US10012671B2

公开(公告)日：2018-07-03

申请号：US14931696

申请日：2015-11-03

Applicant: RICHTEK TECHNOLOGY CORPORATION

Inventor： Shih-Chieh Lin

IPC: G01P15/125

CPC classification number: G01P15/125 ,  G01P15/18 ,  G01P21/00 ,  G01P2015/0814 ,  G01P2015/0831 ,  G01P2015/0868

Abstract: A MEMS device includes: a substrate; a proof mass suspended over the substrate, the proof mass including at least one proof mass body and a proof mass frame connected to and accommodating the proof mass body, the proof mass frame including at least one self-test frame; and at least one self-test electrode inside the self-test frame, and connected to the substrate; wherein when a voltage difference is applied between the self-test electrode and the self-test frame, the proof mass is driven to have an in-plane movement, and wherein the self-test electrode and the self-test frame do not form a sensing capacitor in between.