公开(公告)号：US06900132B2

公开(公告)日：2005-05-31

申请号：US10691688

申请日：2003-10-22

申请人： Raymon F. Thompson ,  Jeffry A. Davis ,  Randy Harris ,  Dana R. Scranton ,  Ryan Pfeifle ,  Steven A. Peace ,  Brian Aegerter

发明人： Raymon F. Thompson ,  Jeffry A. Davis ,  Randy Harris ,  Dana R. Scranton ,  Ryan Pfeifle ,  Steven A. Peace ,  Brian Aegerter

IPC分类号： H01L21/00 ,  H01L21/3213 ,  H01L21/311

CPC分类号： H01L21/6715 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/6708 ,  Y10S438/913

摘要： A system for processing semiconductor wafers has process units on a deck of a frame. The process units and the deck have precision locating features, such as tapered pins, for precisely positioning the process units on the deck. Process units can be removed and replacement process units installed on the deck, without the need for recalibrating the load/unload robot. This reduces the time needed to replace process units and restart processing operations. Liquid chemical consumption during processing is reduced by drawing unused liquid out of supply lines and pumping it back to storage.

摘要翻译： 用于处理半导体晶片的系统在框架的台面上具有处理单元。 过程单元和甲板具有精确的定位特征，例如锥形销，用于将处理单元精确地定位在甲板上。 可以拆卸加工单元并安装在甲板上的更换过程单元，而无需重新校准装载/卸载机器人。 这减少了更换过程单元并重新启动处理操作所需的时间。 通过将未使用的液体从供应管线中抽出并将其抽回储存器来减少加工过程中的液体化学品消耗。

公开(公告)号：US06692613B2

公开(公告)日：2004-02-17

申请号：US10223974

申请日：2002-08-20

申请人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

发明人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

IPC分类号： H01L2348

CPC分类号： H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

摘要： A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

摘要翻译： 用于处理半导体晶片或类似物品的方法包括在旋转晶片时旋转晶片并将其施加到晶片的第一侧的步骤。 流体通过离心力在晶片的第一侧上在所有方向上径向向外流动。 当流体从晶片的圆周边缘流出时，其被包含在环形储存器中，使得流体也流到晶片的第二侧的外部环形区域。 开口允许流体从储存器流出。 开口限定分流线的位置，超过该分隔线，流体不会在晶片的第二侧上行进。 用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。 晶片支撑在转子之间。 转子由旋转电机旋转。 处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。 流体向外均匀地向各个方向流动。 晶片支架自动提升晶片，从而当转子在加工后彼此分离时，可以通过机器人将其从反应器中移除。

公开(公告)号：US06423642B1

公开(公告)日：2002-07-23

申请号：US09437711

申请日：1999-11-10

申请人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

发明人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

IPC分类号： H01L21311

CPC分类号： H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

摘要： A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

公开(公告)号：US06447633B1

公开(公告)日：2002-09-10

申请号：US09710530

申请日：2000-11-09

申请人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

发明人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

IPC分类号： C28F102

CPC分类号： H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

摘要： A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

公开(公告)号：US07337663B2

公开(公告)日：2008-03-04

申请号：US11078997

申请日：2005-03-11

申请人： Paul Z. Wirth ,  Dana R. Scranton ,  Brian Aegerter

发明人： Paul Z. Wirth ,  Dana R. Scranton ,  Brian Aegerter

IPC分类号： B08B3/12

CPC分类号： H01L21/6719 ,  H01L21/67028 ,  H01L21/67086 ,  Y10S134/902

摘要： A system for processing a workpiece includes a base having a bowl or recess for holding a processing fluid. A sonic energy source, such as a megasonic transducer, provides sonic energy into a processing fluid in the bowl. A process head holds a workpiece. A process head lifter lowers the head holding the workpiece into the processing fluid in the bowl. Sonic energy is provided to the workpiece through the processing fluid, optionally while the processing head spins the workpiece. The processing fluid may include de-ionized water and an etchant.

摘要翻译： 用于处理工件的系统包括具有用于保持处理流体的碗或凹部的底座。 声能量源，例如兆声换能器，为碗中的处理流体提供声能。 工艺头保持工件。 工艺头升降器将保持工件的头部降低到碗中的处理流体中。 通过处理流体，任选地在处理头旋转工件时，将能量提供给工件。 处理流体可以包括去离子水和蚀刻剂。

公开(公告)号：US06794291B2

公开(公告)日：2004-09-21

申请号：US10202074

申请日：2002-07-23

申请人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

发明人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

IPC分类号： H01L21311

CPC分类号： H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

摘要： An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

摘要翻译： 用于处理半导体晶片或类似物品的设备包括具有由上下转子形成的处理室的反应器。 晶片支撑在转子之间。 转子由旋转电机旋转。 处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。 流体向外均匀地向各个方向流动。 晶片支架自动提升晶片，从而当转子在加工后彼此分离时，它可以由机器人从反应器中移出。

公开(公告)号：US06413436B1

公开(公告)日：2002-07-02

申请号：US09437926

申请日：1999-11-10

申请人： Brian Aegerter ,  Curt T. Dundas ,  Michael Jolley ,  Tom L. Ritzdorf ,  Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson

发明人： Brian Aegerter ,  Curt T. Dundas ,  Michael Jolley ,  Tom L. Ritzdorf ,  Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson

IPC分类号： C23F102

CPC分类号： H01L21/67017 ,  C23F1/18 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S438/928 ,  Y10S438/963

摘要： In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

公开(公告)号：US20060118132A1

公开(公告)日：2006-06-08

申请号：US11005553

申请日：2004-12-06

申请人： Eric Bergman ,  Dana Scranton ,  Brian Aegerter

发明人： Eric Bergman ,  Dana Scranton ,  Brian Aegerter

IPC分类号： B08B3/12 ,  B08B3/00

CPC分类号： B08B3/02 ,  B08B3/10 ,  B08B3/12 ,  B08B2203/0288 ,  H01L21/02052 ,  H01L21/67051

摘要： In a method for cleaning a wafer, the wafer is placed a processing chamber. A layer or film of liquid is provided on the wafer. Electrically charged aerosol droplets of a liquid are formed and directed to the workpiece. The charged aerosol particles accumulate on the workpiece. This creates an electrical charge on the workpiece. Contaminant particles on the workpiece are released and/or repelled by the electrical charge and are carried away in the liquid layer. The liquid layer is optionally continuously replenished with fresh liquid. The liquid layer may be thinned out in a localized aerosol impingement area, via a jet of gas, to allow the electrical charge of the aerosol to better collect on or near the surface of the workpiece.

摘要翻译： 在清洁晶片的方法中，将晶片放置在处理室中。 在晶片上设置一层或多层液体。 形成液体的带电气溶胶液滴并将其导向工件。 带电气溶胶颗粒聚集在工件上。 这会在工件上产生电荷。 工件上的污染物颗粒被电荷释放和/或排斥，并在液体层中被带走。 任选地用新鲜液体连续补充液体层。 液体层可以通过气体喷射在局部气溶胶冲击区域中变薄，以允许气溶胶的电荷更好地收集在工件的表面上或附近。

公开(公告)号：US06774056B2

公开(公告)日：2004-08-10

申请号：US10200043

申请日：2002-07-19

申请人： Jon Kuntz ,  Steven Peace ,  Ed Derks ,  Brian Aegerter

发明人： Jon Kuntz ,  Steven Peace ,  Ed Derks ,  Brian Aegerter

IPC分类号： H01L2131

CPC分类号： H01L21/68785 ,  H01L21/67057 ,  H01L21/67086 ,  H01L21/6715 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/14 ,  Y10S438/906 ,  Y10S438/913

摘要： A process system for processing a semiconductor wafer or other similar flat workpiece has a head including a workpiece holder. A motor in the head spins the workpiece. A head lifter lowers the head to move the workpiece into a bath of liquid in a bowl. Sonic energy is introduced into the liquid and travels through the liquid to the workpiece, to assist in processing. The head is lifted to bring the workpiece to a rinse position. The bath liquid is drained. The workpiece is rinsed via radial spray nozzles in the base. The head is lifted to a dry position. A reciprocating swing arm sprays a drying fluid onto the bottom surface of the spinning wafer, to dry the wafer.

摘要翻译： 用于处理半导体晶片或其它类似的平坦工件的处理系统具有包括工件保持器的头部。 头部的电机旋转工件。 头部升降器降低头部以将工件移动到碗中的液体浴中。 声能被引入到液体中并通过液体传送到工件，以帮助加工。 抬起头部以使工件进入冲洗位置。 浴液被排出。 工件通过基座中的径向喷嘴冲洗。 头部被抬起到干燥的位置。 往复摇摆臂将干燥流体喷射到旋转晶片的底表面上，以干燥晶片。

公开(公告)号：US20070000527A1

公开(公告)日：2007-01-04

申请号：US11172162

申请日：2005-06-30

申请人： Brian Aegerter ,  Daniel Woodruff ,  Coby Grove ,  Gregory Wilson

发明人： Brian Aegerter ,  Daniel Woodruff ,  Coby Grove ,  Gregory Wilson

IPC分类号： B08B3/00

CPC分类号： H01L21/68728 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67751 ,  H01L21/68785

摘要： A workpiece support apparatus for use in a process vessel and process system for treating semiconductor workpieces. The process vessel is to be utilized in an integrated tool for wet chemical treatment of a semiconductor workpiece. The workpiece support apparatus includes a rotor having a central cavity and guide pins mounted at an outer perimeter. A workpiece support having extendable workpiece support fingers is connected to the rotor. The extendable workpiece support fingers are moveable from a first position to a second position. A bellows seal connects the workpiece support to the rotor. A fluid delivery tube is positioned in the central cavity of the rotor and connected to a supply of fluid. When the extendable workpiece support fingers are in the first position, the guide pins of the rotor cannot interfere with the loading of a workpiece onto the extendable workpiece support fingers, and when the extendable workpiece support fingers are in the second position, a pressurized fluid is delivered through the delivery tube to create a low pressure region adjacent an inner surface of the workpiece, lifting the workpiece off the extendable workpiece support fingers, exposing the entire backside of the workpiece for processing.

摘要翻译： 用于处理容器的工件支撑装置和用于处理半导体工件的处理系统。 该处理容器用于半导体工件的湿化学处理的集成工具中。 工件支撑装置包括具有安装在外周的中心腔和导销的转子。 具有可延伸的工件支撑指的工件支撑件连接到转子。 可伸展工件支撑指可从第一位置移动到第二位置。 波纹管密封将工件支撑件连接到转子。 流体输送管定位在转子的中心空腔中并连接到流体供应源。 当可延伸的工件支撑指状件处于第一位置时，转子的引导销不会干扰工件对可延伸的工件支撑指的加载，并且当可延伸的工件支撑指状件处于第二位置时，加压流体是 通过输送管输送以产生邻近工件的内表面的低压区域，将工件从可延伸的工件支撑指状物上提起，暴露工件的整个背面进行处理。