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    Reducing backside deposition in a substrate processing apparatus through the use of a shadow ring
    10.
    发明授权
    Reducing backside deposition in a substrate processing apparatus through the use of a shadow ring 失效
    通过使用阴影环来减少衬底处理设备中的背面沉积

    公开(公告)号：US5476548A

    公开(公告)日：1995-12-19

    申请号：US263617

    申请日：1994-06-20

    申请人： Lawrence C. Lei ,  Cissy S. Leung ,  Eric A. Englhardt ,  Ashok K. Sinha

    发明人： Lawrence C. Lei ,  Cissy S. Leung ,  Eric A. Englhardt ,  Ashok K. Sinha

    IPC分类号： C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C30B25/14 ,  H01L21/205 ,  H01L21/285 ,  H01L21/683 ,  C23C16/00 ,  B05C13/00 ,  H01L21/00

    CPC分类号： C23C16/45521 ,  C23C16/4585 ,  C30B25/14 ,  H01L21/6838

    摘要： A substrate processing apparatus for processing a substrate having a peripheral edge, an upper surface for processing and a lower surface lying on a support. The apparatus includes a processing chamber which houses the substrate support, in the form of a heater pedestal including a substrate receiving surface for receiving the lower surface of the substrate. A circumscribing shadow ring is located around the pedestal to cover peripheral edge portion of the substrate. The shadow ring also defines a cavity, between itself and the pedestal, at the peripheral edge of the substrate. In operation, the chamber receives processing gas at a first pressure and purge gas is introduced into the cavity, between the ring and the pedestal, at a second pressure which is greater than the first pressure. Fluid conduits are provided to enhance the flow of the purge gas away from the peripheral edge of the substrate.

    摘要翻译： 一种基板处理装置，用于处理具有外围边缘的基板，用于加工的上表面和位于支撑件上的下表面。 该设备包括处理室，该处理室以加热器底座的形式容纳衬底支撑件，该加热器基座包括用于接收衬底的下表面的衬底接收表面。 位于基座周围的外接阴影环覆盖基板的周边部分。 阴影环还在基板的周边边缘处限定了在其自身与基座之间的空腔。 在操作中，室以第一压力接收处理气体，并且净化气体以大于第一压力的第二压力被引入空腔中，在环和基座之间。 提供流体导管以增强净化气体远离衬底的周边边缘的流动。