-
1.发明申请公开(公告)号：US20180182551A1
公开(公告)日：2018-06-28
申请号：US15641990
申请日：2017-07-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Mo AHN , Sun Cheol Lee
Abstract: A capacitor component includes a body including a plurality of dielectric layers having a stacked structure, and first and second internal electrodes which are alternately disposed while having the dielectric layer interposed therebetween; and first and second external electrodes formed on an outer surface of the body, and connected to the first and second internal electrodes, respectively, wherein the body includes an active region having capacity by the first and second internal electrodes and a cover region located above and below the active region, the cover region includes a protection pattern of a metal material connected to the first external electrode or the second external electrode, and the protection pattern does not overlap with the internal electrode having a different polarity among the first and second internal electrodes in a thickness direction of the body.
-
公开(公告)号：US20160189840A1
公开(公告)日：2016-06-30
申请号：US14949425
申请日：2015-11-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Mo AHN , Yun Suk OH
CPC classification number: H01F41/046 , H01F3/08 , H01F17/0013 , H01F17/04 , H01F27/255 , H01F27/292
Abstract: An electronic component includes a magnetic body, and a coil pattern embedded in the magnetic body and including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body. The lead parts include a plurality of protruding portions spaced apart from each other and connected to the ends of the internal coil parts to protrude externally from the ends of the internal coil parts.
Abstract translation: 电子部件包括磁体和嵌入在磁体中的线圈图案，并且包括具有螺旋形状的内部线圈部分和与内部线圈部分的端部连接并从磁体外部暴露的引线部分。 引线部分包括彼此间隔开并连接到内部线圈部分的端部的多个突出部分，以从内部线圈部分的端部向外突出。
-
公开(公告)号：US20220165501A1
公开(公告)日：2022-05-26
申请号：US17468242
申请日：2021-09-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jeong Mo KANG , Jin Mo AHN , Ga Young AN
Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode including a connection portion disposed on one of the third and fourth surfaces, an upper band portion extending from the connection portion onto a portion of the second surface, and a lower band portion extending onto a portion of the first surface. The external electrode includes a Pd plating layer disposed on an external surface of the lower band portion, and the Pd plating layer is disposed to extend onto a portion of the connection portion.
-
公开(公告)号：US20180286560A1
公开(公告)日：2018-10-04
申请号：US15818130
申请日：2017-11-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yun Suk OH , Jin Mo AHN
Abstract: A coil component includes a body having a winding coil and a plurality of guide members therein. The guide members are spaced apart from each other along an outer periphery of the winding coil, and each of the guide members has an exposed surface exposed externally of the body. A method for manufacturing a coil component includes seating opposing ends of a winding coil on a support member of a frame having guide members restricting movement of the winding coil relative to the frame. A body is formed that embeds the winding coil and at least a portion of each of the guide members therein, and the guide members restrict movement of the winding coil during the forming of the body.
-
公开(公告)号：US20230215627A1
公开(公告)日：2023-07-06
申请号：US17981851
申请日：2022-11-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Do Young JEONG , Jin Mo AHN , Ji Hong JO
Abstract: A multilayer electronic component may include a cover layer disposed on a first surface of a body and extending onto a first band portion of a first external electrode and a second band portion of a second external electrode, in which the cover layer includes an insulating portion disposed between the first external electrode and the second external electrode and including an insulating material, a first conductive portion connected to the insulating portion and disposed on the first band portion, and a second conductive portion connected to the insulating portion and disposed on the second band portion, and the first and second conductive portions include a conductive metal and a resin.
-
Patent Agency Ranking
公开(公告)号：US20170213647A1
公开(公告)日：2017-07-27
申请号：US15276228
申请日：2016-09-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Mo AHN
CPC classification number: H01G4/232 , H01G4/012 , H01G4/12 , H01G4/1209 , H01G4/248 , H01G4/30 , H05K1/111 , H05K1/181 , H05K3/341 , H05K3/3442 , H05K2201/10015 , H05K2201/10636 , Y02P70/611 , Y02P70/613
Abstract: A multilayer ceramic capacitor includes a body including an active region including first and second internal electrodes, and an upper cover region disposed on the active region, and a lower cover region disposed below the active region. First and second external electrodes are disposed on first and second surfaces of the body in the length direction and connected to the first and second internal electrodes, respectively. At least one stress dispersion pattern occupying an area equal to 30% to 95% of an area of the first or second internal electrode is disposed in the cover region.
-
公开(公告)号：US20160126006A1
公开(公告)日：2016-05-05
申请号：US14926953
申请日：2015-10-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Mo AHN , Yun Suk OH , Jae Yeol CHOI
IPC: H01F27/28 , H01F41/02 , H01F41/04 , H01F27/255 , H01F27/29
CPC classification number: H01F27/29 , H01F17/04 , H01F27/2823 , H01F27/2828 , H01F27/306 , H01F2017/048
Abstract: A coil component assembly includes a support member, a plurality of processed spaces penetrating through the support member, a plurality of coils disposed in the plurality of processed spaces, respectively, and a magnetic material covering the support member and the plurality of coils. The coil component assembly can be diced to form individually coil components.
Abstract translation: 线圈部件组件包括支撑部件，穿过支撑部件的多个加工空间，分别设置在多个加工空间中的多个线圈以及覆盖支撑部件和多个线圈的磁性材料。 线圈部件组件可以被切割成单独的线圈部件。
-
公开(公告)号：US20230215651A1
公开(公告)日：2023-07-06
申请号：US17725162
申请日：2022-04-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Hyun PARK , Jin Mo AHN , Ji Hong JO
CPC classification number: H01G4/30 , H01G4/1209 , H01G4/012
Abstract: A ceramic electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in the first direction and side surfaces connected to the first and second surfaces, an external electrode disposed on one of the side surfaces of the body extending onto a portion of the first surface of the body, and an insulating layer covering a surface of the external electrode and including a plurality of openings exposing the external electrode, wherein a ratio of an area of the plurality of openings to an area of the surface of the external electrode covered by the insulating layer is 20% to 70%.
-
公开(公告)号：US20200090871A1
公开(公告)日：2020-03-19
申请号：US16525732
申请日：2019-07-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Mo AHN , Sang Roc LEE , Dong Hwi SHIN
Abstract: A multilayer capacitor includes a body including a stack structure of a plurality of dielectric layers, and a plurality of internal electrodes stacked with the dielectric layers interposed therebetween. A stress alleviation portion is disposed on at least one surface among surfaces of the body, and an external electrode is disposed on an external portion of the body and connected to the internal electrodes. The stress alleviation portion includes a first resin layer adjacent to the body, and a second resin layer covering the first resin layer and including a filler dispersed in a resin of the second resin layer.
-
公开(公告)号：US20190122823A1
公开(公告)日：2019-04-25
申请号：US15995637
申请日：2018-06-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Beom Joon CHO , Ki Young KIM , Jae Young NA , Jin Mo AHN
CPC classification number: H01G4/30 , H01G2/06 , H01G4/005 , H01G4/1227 , H01G4/232 , H01G4/38 , H05K1/181 , H05K3/3426 , H05K3/3442 , H05K2201/10015 , H05K2201/10515 , H05K2201/1053 , H05K2201/10946
Abstract: A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.
-
-
-
-
-
-
-
-
-
Search Results
16
records
(took 0.015 seconds)
