公开(公告)号：US20040262721A1

公开(公告)日：2004-12-30

申请号：US10833883

申请日：2004-04-27

Applicant: STMicroelectronics S.r.I.

Inventor： Claudio Deodato ,  Roberto Tiziani

IPC: H01L021/48 ,  H01L023/495

CPC classification number: H01L21/4842 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A planar metallic foil is formed defining a lie plane which includes a supporting frame for a mount pad and corresponding leads being short-circuited to the mount pad. The mount pad is then down-set on a plane being parallel to the lie plane so as to keep at least a group of leads on the lie plane and separate by shearing the mount plane from the group of leads. A die is then mounted on a first surface of the mount pad. Electrical connections are then formed between the die and the group of leads. The frame is then encapsulated in a protective package so as to leave a second surface of the mount pad, being opposite to the first surface, exposed from the protective package.

Abstract translation: 形成平面金属箔，限定了一个平面，其包括用于安装垫的支撑框架，并且相应的引线被短路到安装垫。 然后将安装焊盘放置在平行于平面的平面上，以便在平面上保持至少一组引线，并通过将安装平面与引线组剪切分离。 然后将模具安装在安装垫的第一表面上。 然后在管芯和导线组之间形成电连接。 然后将框架封装在保护性封装中，以便从安全衬垫的第二表面离开第一表面，露出自保护封装。

公开(公告)号：US20040072396A1

公开(公告)日：2004-04-15

申请号：US10449749

申请日：2003-05-29

Applicant: STMicroelectronics S.r.I.

Inventor： Roberto Tiziani ,  Loic Renard ,  Battista Vitali

IPC: H01L021/8238

CPC classification number: H01L24/85 ,  H01L23/4952 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05073 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/20757 ,  H01L2924/2076 ,  H01L2924/351 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A semiconductor electronic device is disclosed, which includes a die of a semiconductor material and a holder connected electrically together by wire leads of copper, the semiconductor material die being formed with a plurality of contact pads; the device being characterized by having a welding stud bump of a metal material selected from a group comprising gold, palladium, and alloys thereof, formed on each contact pad in said plurality, each copper wire lead being welded with one end on a stud bump and with the other end to said holder. This electronic device is highly reliable and can be fabricated simply at a low cost.

Abstract translation: 公开了一种半导体电子器件，其包括半导体材料的裸片和由铜的引线电连接的保持器，所述半导体材料管芯形成有多个接触焊盘; 该装置的特征在于具有形成在所述多个中的每个接触焊盘上的金，钯及其合金的金属材料的焊接凸块，每个铜线引线一端焊接在螺柱凸块上， 另一端到所述支架。 该电子装置是高度可靠的，并且可以以低成本简单地制造。

公开(公告)号：US20030127701A1

公开(公告)日：2003-07-10

申请号：US10319441

申请日：2002-12-13

Applicant: STMicroelectronics S.r.I.

Inventor： Roberto Tiziani ,  Carlo Passagrilli

IPC: H01L031/00

CPC classification number: H01L24/05 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05083 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A semiconductor electronic device includes a die of semiconductor material and a support. The die of semiconductor material includes an integrated electronic circuit and a plurality of contact pads associated with the electronic circuit and connected electrically to the support by wire leads. Each contact pad may include a lower layer of aluminum, copper, or alloys thereof, and an upper layer including at least one film of a metal and/or metallic alloy including nickel, palladium, or alloys thereof, and being deposited by an electroless chemical process.

Abstract translation: 半导体电子器件包括半导体材料的裸片和支持体。 半导体材料的管芯包括集成电子电路和与电子电路相关联的多个接触焊盘，并且通过引线电连接到支撑件。 每个接触垫可以包括铝，铜或其合金的下层，以及包括至少一种包含镍，钯或其合金的金属和/或金属合金膜的上层，并通过无电化学材料 处理。