公开(公告)号：US20190181388A1

公开(公告)日：2019-06-13

申请号：US16132981

申请日：2018-09-17

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Byoung Yong KIM ,  Jeong Ho HWANG

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/00 ,  H01L51/10 ,  H01L23/00 ,  G09F9/30

Abstract: A display device includes a flexible base layer including a first portion and a second portion. A display unit is disposed on a first surface of the first portion. The display unit includes a light emitting element. A driving circuit is disposed on a first surface of the second portion. The driving circuit includes a driving chip. A first support member is disposed on a second surface of the first portion opposite the first surface. A second support member is disposed on a second surface of the second portion. The second support member includes a first opening overlapping the driving circuit. The second surface of the second portion is on an opposite side of the second portion from the first surface of the second portion. A first reinforcing member is disposed in the first opening. The first reinforcing member includes a different material from the second support member.

公开(公告)号：US20180114768A1

公开(公告)日：2018-04-26

申请号：US15787609

申请日：2017-10-18

Applicant: Samsung Display Co., Ltd.

Inventor： Sang Hyeon SONG ,  Seung Hwa HA ,  Byoung Yong KIM ,  Jeong Ho HWANG

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L24/81 ,  H01L23/293 ,  H01L23/296 ,  H01L23/31 ,  H01L23/3171 ,  H01L2224/81007 ,  H01L2224/81193 ,  H01L2224/81206 ,  H01L2224/8183

Abstract: Provided herein may be an electronic device. The electronic device may include a substrate provided with a plurality of connecting pads including a first metal, a semiconductor chip on an area of the substrate, facing the connecting pads, and including a base substrate including a first surface facing the substrate, and a second surface opposite the first surface, a plurality of connecting terminals on the first surface, facing the connecting pads, and including a second metal, and a non-adhesive polymer layer on the second surface, and a conductive joining layer electrically connecting, and interposed between, respective ones of the connecting pads to the connecting terminals, and including a diffusion layer in which the first metal and the second metal are mixed.

公开(公告)号：US20180063954A1

公开(公告)日：2018-03-01

申请号：US15679095

申请日：2017-08-16

Applicant: Samsung Display Co., Ltd.

Inventor： Byoung Yong KIM ,  Jeong Ho HWANG

IPC: H05K1/11 ,  H01L27/12 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/111 ,  G02F1/13452 ,  G02F1/13458 ,  G02F1/136286 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/3276 ,  H01L51/0096 ,  H05K1/0268 ,  H05K1/113 ,  H05K1/18 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: A display device including: a display substrate including a display area configured to display an image and a pad area positioned on the periphery of the display area; a first pad part positioned above the pad area and including first pad terminals arranged in a first direction; and a printed circuit board including a base film and a second pad part positioned at one side of the base film and coupled with the first pad part, the second pad part includes first contact terminals coupled with first pad terminals, each of first contact terminals includes first contact pad terminals arranged along a first row forming a first inclination angle with the first direction, and second contact pad terminals spaced from first contact pad terminals and arranged along a second row forming a second inclination angle with the first direction.

公开(公告)号：US20180061748A1

公开(公告)日：2018-03-01

申请号：US15659547

申请日：2017-07-25

Applicant: Samsung Display Co., Ltd.

Inventor： Byoung Yong KIM ,  Jeong Ho Hwang

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L23/532

CPC classification number: H01L23/49811 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/53204 ,  H01L23/53209 ,  H01L23/562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05666

Abstract: A semiconductor chip, a display device or an electronic device includes a substrate, one or more conductive pads disposed on the substrate, and one or more bumps electrically connected to the one or more conductive pads, in which the one or more bumps includes a metal core, a polymer layer disposed over a surface of the metal core, and a conductive coating layer disposed over a surface of the polymer layer and electrically connected to the one or more conductive pads.

公开(公告)号：US20160026019A1

公开(公告)日：2016-01-28

申请号：US14551326

申请日：2014-11-24

Applicant: Samsung Display Co., Ltd.

Inventor： Byung Seok CHOI ,  Su Jung HUH ,  Byoung Yong KIM ,  Ji Eun LEE ,  Jun Ho SONG

IPC: G02F1/1339 ,  G02F1/1335

CPC classification number: G02F1/1339 ,  G02F1/133351 ,  G02F1/133514 ,  G02F1/13394

Abstract: A mother substrate for a display device, includes an upper mother substrate and a lower mother substrate each divided into, from among areas of the display device, a display area which displays an image, a sealing area which surrounds the display area and in which a seal material is disposed, and an outer area disposed outside the sealing area, in which a pad area is disposed and from which a signal is applied to the display area; and a spacer between the upper mother substrate and the lower mother substrate, and in the outer area. The spacer is disposed at a cutting line at which the upper mother substrate and the lower mother substrate are separated from the mother substrate to form the display device.

Abstract translation: 一种用于显示装置的母基板，包括上母母基板和下母基板，每个从显示装置的区域中分别显示图像的显示区域，围绕显示区域的密封区域，其中， 设置密封材料，以及设置在密封区域外部的外部区域，其中设置有焊盘区域，并且将信号施加到显示区域; 以及上母基板和下母基板之间的间隔件，以及外部区域。 间隔件设置在上母基板和下母基板与母基板分离的切割线上，以形成显示装置。

公开(公告)号：US20230207577A1

公开(公告)日：2023-06-29

申请号：US18083731

申请日：2022-12-19

Applicant: Samsung Display Co., LTD.

Inventor： Byoung Yong KIM

IPC: H01L27/12

CPC classification number: H01L27/1244 ,  H01L27/1218

Abstract: A display device includes a substrate including a first surface, a second surface facing the first surface, and a side surface connecting the first surface and the second surface; a first side wiring disposed on the side surface of the substrate and extending in a first direction from the first surface to the second surface. The first side wiring includes a first upper part adjacent to the first surface, a first lower part adjacent to the second surface, and a first connecting part connecting between the first upper part and the first lower part. At least one of the first upper part and the first lower part has a width greater than a width of the first connecting part.

公开(公告)号：US20210134756A1

公开(公告)日：2021-05-06

申请号：US17149888

申请日：2021-01-15

Applicant: Samsung Display Co. Ltd.

Inventor： Byoung Yong KIM ,  Jeong Ho HWANG

IPC: H01L23/00 ,  G02F1/13

Abstract: A bonding apparatus for bonding a driving circuit to a display panel includes: a bonding stage unit on which the display panel is supported in bonding the driving circuit to the display panel; a head unit located above the bonding stage unit and with which ultrasonic waves are applied to the driving circuit to couple the driving circuit with a bonding area of the display panel supported on the bonding stage unit; and a protrusion disposed at an edge portion of the bonding stage unit, the edge portion corresponding to an end of the display panel at which the bonding area is disposed.

公开(公告)号：US20180174952A1

公开(公告)日：2018-06-21

申请号：US15827382

申请日：2017-11-30

Applicant: Samsung Display Co., Ltd.

Inventor： Byoung Yong KIM ,  Jong Hyuk LEE ,  Jeong Ho HWANG

IPC: H01L23/498 ,  H01L23/00 ,  H05K1/02 ,  H05K5/00

Abstract: A substrate includes a base substrate, and a pad at one side of the base substrate, wherein the pad comprises: a first conductive pattern on the base substrate, an insulating layer including a plurality of contact holes exposing a portion of the first conductive pattern, and second conductive patterns separately on the insulating layer and connected to the first conductive pattern through the plurality of contact holes, wherein side surfaces of the second conductive patterns are exposed.

公开(公告)号：US20180076235A1

公开(公告)日：2018-03-15

申请号：US15696303

申请日：2017-09-06

Applicant: Samsung Display Co., Ltd.

Inventor： Byoung Yong KIM ,  Jeong Ho Hwang

IPC: H01L27/12 ,  H01L23/00

CPC classification number: H01L27/1244 ,  G02F1/13452 ,  H01L24/06 ,  H01L2224/06051 ,  H01L2224/06163 ,  H01L2224/06165 ,  H01L2224/06515

Abstract: A display device includes a substrate and a first pad. The substrate includes a display area to display an image, and a pad area outside the display area. The first pad is in the pad area, and includes first pad terminals extending parallel to one another in a first direction. The first pad terminals include: first connection pad terminals arranged along a first column that forms a first slope angle with the first direction; second connection pad terminals spaced apart from the first connection pad terminals and arranged along a second column that forms a second slope angle with the first direction; and a first dummy pad terminal between a pair of adjacent first connection pad terminals among the first connection pad terminals along the first column. The first dummy pad terminal and the first connection pad terminals are in different layers than one another.

公开(公告)号：US20180068931A1

公开(公告)日：2018-03-08

申请号：US15685640

申请日：2017-08-24

Applicant: Samsung Display Co., Ltd.

Inventor： Seung Hwa HA ,  Jung Yun JO ,  Byoung Yong KIM ,  Jeong Do YANG ,  Jeong Ho HWANG

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/4952 ,  H01L23/49816 ,  H01L24/10 ,  H01L24/12 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13019

Abstract: A semiconductor chip includes: a base substrate; a conductive pad on one surface of the base substrate; an insulating layer on the one surface of the base substrate and having an opening exposing a portion of the conductive pad; and a bump on the exposed portion of the conductive pad and on the insulating layer around the opening. The bump includes a plurality of concave portions corresponding to the opening and is arranged in a longitudinal direction of the bump.