Abstract:
The semiconductor memory device includes a memory cell array and an error correction code (ECC) circuit. The memory cell array is divided into a first memory region and a second memory region. Each of the first and second memory regions includes a plurality of pages each page including a plurality of memory cells connected to a word line. The ECC circuit corrects single-bit errors of the first memory region using parity bits. The first memory region provides a consecutive address space to an external device by correcting the single-bit errors using the ECC circuit and the second memory region is reserved for repairing at least one of a first failed page of the first memory region or a second failed page of the second memory region.
Abstract:
Disclosed is a computer system which includes a host and a memory module. The host transfers a plurality of cache lines to a memory module through a plurality of channels, the cache lines including a plurality of data elements and allocates cache lines with target data elements in the plurality of data elements to one channel of the plurality of channels. The target data elements are arranged within the ache lines according to a stride interval. The stride interval is a number of data elements between consecutive ones of the target data elements. The memory module includes gather-scatter engines that are respectively connected to the plurality of channels and scatter or gather the target data elements under control of the host.
Abstract:
A memory module includes a master memory device and at least one slave memory device. The master memory device may generate a refresh clock signal, and perform a refresh operation in synchronization with the refresh clock signal. The slave memory device may be connected to receive the refresh clock signal, and perform a refresh operation in synchronization with the refresh clock signal.
Abstract:
A semiconductor memory device includes a control logic and a memory cell array in which a plurality of memory cells are arranged. The memory cell array includes a plurality of bank arrays, and each of the plurality of bank arrays includes a plurality of sub-arrays. The control logic controls an access to the memory cell array based on a command and an address signal. The control logic dynamically sets a keep-away zone that includes a plurality of memory cell rows which are deactivated based on a first word-line when the first word-line is enabled. The first word-line is coupled to a first memory cell row of a first sub-array of the plurality of sub-arrays. Therefore, increased timing parameters may be compensated, and parallelism may be increased.
Abstract:
A semiconductor memory device may include a plurality of data input/output DQ pads and a plurality of first and second memory cell arrays. Each path of a first set of data paths from each of the plurality of first memory cell arrays to a corresponding DQ pad is physically shorter than each path of a second set of data paths from each of the plurality of second memory cell arrays to the corresponding DQ pad. Each of the plurality of first memory cell arrays is a designated first-speed access cell array and each of the plurality of second memory cell arrays is a designated second-speed access cell array, the second-speed being slower than the first-speed. A size of the each of the plurality of first memory cell arrays is smaller than a size of the each of the plurality of second memory cell arrays.
Abstract:
In a method of refreshing in a memory device having a plurality of pages, a candidate refresh address corresponding to a page scheduled to be refreshed after a monitoring period is generated. Whether an active command is processed for the candidate refresh address is monitored during the monitoring period. If an active command is processed for the candidate refresh address during the monitoring period, the scheduled refresh for that page is skipped. If no active command is processed for the candidate refresh address during the monitoring period, the scheduled refresh operation is performed.
Abstract:
A neuromorphic device includes a memory cell array that includes first memory cells corresponding to a first address and storing first weights and second memory cells corresponding to a second address and storing second weights, and a neuron circuit that includes an integrator summing first read signals from the first memory cells and an activation circuit outputting a first activation signal based on a first sum signal of the first read signals output from the integrator.
Abstract:
A test method of the semiconductor memory device including a memory cell array and an anti-fuse array includes detecting failed cells included in the memory cell array; determining a fail address corresponding to the detected failed cells; storing the determined fail address in a first region of the memory cell array; and reading the fail address stored in the first region to program the read fail address in the anti-fuse array. According to the test method of a semiconductor memory device and the semiconductor memory system, since the test operation can be performed without an additional memory for storing an address, the semiconductor memory device and the test circuit can be embodied by a small area.
Abstract:
A semiconductor memory device may include a cell array comprising a plurality of memory cells, each memory cell connected to a word line and a bit line, the cell array divided into a plurality of blocks, each block including a plurality of word lines, the plurality of blocks including at least a first defective block; a nonvolatile storage circuit configured to store address information of the first defective block, and to output the address information to an external device; and a fuse circuit configured to cut off an activation of word lines of the first defective block.
Abstract:
In one example embodiment, a memory system includes a memory module and a memory controller. The memory module is configured generate density information of the memory module based on a number of the bad pages of the memory module, the bad pages being pages that have a fault. The memory controller is configured to map a continuous physical address to a dynamic random access memory (dram) address of the memory module based on the density information received from the memory module.