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公开(公告)号:US11810964B2
公开(公告)日:2023-11-07
申请号:US17060193
申请日:2020-10-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Bongseok Suh , Daewon Kim , Beomjin Park , Sukhyung Park , Sungil Park , Jaehoon Shin , Bongseob Yang , Junggun You , Jaeyun Lee
IPC: H01L29/66 , H01L29/10 , H01L29/423 , H01L29/786 , H01L29/772 , H01L21/28 , H01L21/8234
CPC classification number: H01L29/6656 , H01L29/1033 , H01L29/42376 , H01L29/66553 , H01L29/78696 , H01L21/28141 , H01L21/823468 , H01L29/1037 , H01L29/66719 , H01L29/7727
Abstract: A semiconductor device includes a first active region defined on a substrate, a first gate electrode across the first active region, a first drain region in the first active region at a position adjacent to the first gate electrode, an undercut region between the first active region and the first gate electrode, and a first gate spacer on a side surface of the first gate electrode and extending into the undercut region.
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公开(公告)号:US20220165729A1
公开(公告)日:2022-05-26
申请号:US17382956
申请日:2021-07-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaehoon Shin , Bongseok Suh , Daewon Kim , Sukhyung Park , Junggun You , Jaeyun Lee
IPC: H01L27/092 , H01L29/06 , H01L29/423 , H01L29/49 , H01L29/786 , H01L21/02 , H01L21/28 , H01L21/8238 , H01L29/66
Abstract: A semiconductor device may include a substrate including first and second active regions and a field region therebetween, first and second active patterns respectively provided on the first and second active regions, first and second source/drain patterns respectively provided on the first and second active patterns, a first channel pattern between the first source/drain patterns and a second channel pattern between the second source/drain patterns, and a gate electrode extended from the first channel pattern to the second channel pattern to cross the field region. Each of the first and second channel patterns may include semiconductor patterns, which are stacked to be spaced apart from each other. A width of a lower portion of the gate electrode on the field region may decrease with decreasing distance from a top surface of the substrate.
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公开(公告)号:US12040401B2
公开(公告)日:2024-07-16
申请号:US17994565
申请日:2022-11-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junggun You , Joohee Jung , Jaehyeoung Ma , Namhyun Lee
IPC: H01L29/78 , H01L27/088 , H01L29/06 , H01L29/10 , H01L29/423
CPC classification number: H01L29/785 , H01L27/0886 , H01L29/0653 , H01L29/1033 , H01L29/42392 , H01L2029/7858
Abstract: A semiconductor device including a substrate having a central region and a peripheral region; an integrated circuit structure on the central region; and a first structure on the peripheral region and surrounding the central region, wherein a portion of the first structure includes a first fin structure defined by a device isolation region in the substrate; a first dielectric layer covering an upper surface and side surfaces of the first fin structure and an upper surface of the device isolation region; a first gate structure on the first fin structure, the first gate structure including a first gate conductive layer, a first gate dielectric layer covering lower and side surfaces of the first gate conductive layer, and first gate spacer layers on side walls of the first gate conductive layer; and a first insulating structure covering the first dielectric layer and the first gate structure.
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公开(公告)号:US11996406B2
公开(公告)日:2024-05-28
申请号:US18148233
申请日:2022-12-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junggun You , Sungil Park , Joohee Jung , Sunggi Hur
IPC: H01L27/088 , H01L21/762 , H01L21/768 , H01L21/8234 , H01L29/06 , H01L29/423 , H01L29/786
CPC classification number: H01L27/088 , H01L21/823456 , H01L21/823481
Abstract: A semiconductor device includes a substrate including first and second active regions extending in a first direction and isolated from direct contact with each other in the first direction; a device isolation layer between the first and second active regions in the substrate; and first and second gate structures extending in a second direction on the substrate while respectively intersecting end portions of the first and second active regions. The first gate structure includes a first gate electrode. The second gate structure includes a second gate electrode. The first gate structure protrudes further toward the device isolation layer, as compared to the second gate structure, in a vertical direction that is perpendicular to the first and second directions, and a lower end of the first gate electrode is located on a lower height level than a lower end of the second gate electrode.
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公开(公告)号:US20250133819A1
公开(公告)日:2025-04-24
申请号:US19001750
申请日:2024-12-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaehoon Shin , Bongseok Suh , Daewon Kim , Sukhyung Park , Junggun You , Jaeyun Lee
IPC: H10D84/85 , H01L21/02 , H01L21/28 , H10D30/01 , H10D30/67 , H10D62/10 , H10D64/01 , H10D64/23 , H10D64/27 , H10D64/66 , H10D84/01 , H10D84/03
Abstract: A semiconductor device may include a substrate including first and second active regions and a field region therebetween, first and second active patterns respectively provided on the first and second active regions, first and second source/drain patterns respectively provided on the first and second active patterns, a first channel pattern between the first source/drain patterns and a second channel pattern between the second source/drain patterns, and a gate electrode extended from the first channel pattern to the second channel pattern to cross the field region. Each of the first and second channel patterns may include semiconductor patterns, which are stacked to be spaced apart from each other. A width of a lower portion of the gate electrode on the field region may decrease with decreasing distance from a top surface of the substrate.
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公开(公告)号:USRE49963E1
公开(公告)日:2024-05-07
申请号:US17155615
申请日:2021-01-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ki Hwan Kim , Gigwan Park , Junggun You , DongSuk Shin , Jin-Wook Kim
IPC: H01L29/78 , H01L21/8238 , H01L21/84 , H01L23/535 , H01L27/092 , H01L29/06 , H01L29/08 , H01L29/16 , H01L29/161 , H01L29/66 , H10B10/00 , H01L27/12 , H01L29/165
CPC classification number: H01L29/7848 , H01L21/823814 , H01L21/823821 , H01L21/823871 , H01L21/823878 , H01L23/535 , H01L27/0924 , H01L29/0653 , H01L29/0847 , H01L29/1608 , H01L29/161 , H01L29/66545 , H01L29/66636 , H10B10/12 , H10B10/18 , H01L21/845 , H01L27/1211 , H01L29/165
Abstract: A semiconductor device includes first and second active patterns protruding upward from a substrate, a gate electrode crossing the first and second active patterns and extending in a first direction, a first source/drain region on the first active pattern and on at least one side of the gate electrode, and a second source/drain region on the second active pattern and on at least one side of the gate electrode. The first and second source/drain regions have a conductivity type different from each other, and the second source/drain region has a bottom surface in contact with a top surface of the second active pattern and at a lower level than that of a bottom surface of the first source/drain region in contact with a top surface of the first active pattern. The first active pattern has a first width smaller than a second width of the second active pattern.
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公开(公告)号:US20240038873A1
公开(公告)日:2024-02-01
申请号:US18483413
申请日:2023-10-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Bongseok Suh , Daewon Kim , Beomjin Park , Sukhyung Park , Sungil Park , Jaehoon Shin , Bongseob Yang , Junggun You , Jaeyun Lee
IPC: H01L29/66 , H01L29/10 , H01L29/423 , H01L29/786
CPC classification number: H01L29/6656 , H01L29/1033 , H01L29/42376 , H01L29/78696 , H01L29/66553 , H01L29/7727
Abstract: A semiconductor device includes a first active region defined on a substrate, a first gate electrode across the first active region, a first drain region in the first active region at a position adjacent to the first gate electrode, an undercut region between the first active region and the first gate electrode, and a first gate spacer on a side surface of the first gate electrode and extending into the undercut region.
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公开(公告)号:US11545489B2
公开(公告)日:2023-01-03
申请号:US17180989
申请日:2021-02-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junggun You , Sungil Park , Joohee Jung , Sunggi Hur
IPC: H01L27/088 , H01L21/8234 , H01L21/762 , H01L21/768 , H01L29/06 , H01L29/423 , H01L29/786
Abstract: A semiconductor device includes a substrate including first and second active regions extending in a first direction and isolated from direct contact with each other in the first direction; a device isolation layer between the first and second active regions in the substrate; and first and second gate structures extending in a second direction on the substrate while respectively intersecting end portions of the first and second active regions. The first gate structure includes a first gate electrode. The second gate structure includes a second gate electrode. The first gate structure protrudes further toward the device isolation layer, as compared to the second gate structure, in a vertical direction that is perpendicular to the first and second directions, and a lower end of the first gate electrode is located on a lower height level than a lower end of the second gate electrode.
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公开(公告)号:US10784376B2
公开(公告)日:2020-09-22
申请号:US16450193
申请日:2019-06-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ki Hwan Kim , Gigwan Park , Junggun You , DongSuk Shin , Jin-Wook Kim
IPC: H01L29/78 , H01L21/8238 , H01L23/535 , H01L27/092 , H01L27/11 , H01L29/06 , H01L29/08 , H01L29/16 , H01L29/161 , H01L29/66 , H01L27/12 , H01L21/84 , H01L29/165
Abstract: A semiconductor device includes first and second active patterns protruding upward from a substrate, a gate electrode crossing the first and second active patterns and extending in a first direction, a first source/drain region on the first active pattern and on at least one side of the gate electrode, and a second source/drain region on the second active pattern and on at least one side of the gate electrode. The first and second source/drain regions have a conductivity type different from each other, and the second source/drain region has a bottom surface in contact with a top surface of the second active pattern and at a lower level than that of a bottom surface of the first source/drain region in contact with a top surface of the first active pattern. The first active pattern has a first width smaller than a second width of the second active pattern.
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公开(公告)号:US10559673B2
公开(公告)日:2020-02-11
申请号:US16284843
申请日:2019-02-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sungil Park , Changhee Kim , Yunil Lee , Mirco Cantoro , Junggun You , Donghun Lee
IPC: H01L29/66 , H01L29/78 , H01L29/06 , H01L29/08 , H01L29/10 , H01L21/28 , H01L29/40 , H01L29/423 , H01L29/786 , H01L29/417
Abstract: A semiconductor device includes an active pillar on a substrate. A first source/drain region is disposed at a top end of the active pillar and has a greater width than the active pillar. A first insulating layer is disposed on a sidewall of the active pillar and a second insulating layer is disposed on at least a bottom surface of the first source/drain region. A gate electrode is disposed on the first insulating layer and the second insulating layer. A second source/drain region is disposed in the substrate at a bottom end of the active pillar. Methods of fabrication are also described.
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