Semiconductor device
    3.
    发明授权

    公开(公告)号:US12040401B2

    公开(公告)日:2024-07-16

    申请号:US17994565

    申请日:2022-11-28

    Abstract: A semiconductor device including a substrate having a central region and a peripheral region; an integrated circuit structure on the central region; and a first structure on the peripheral region and surrounding the central region, wherein a portion of the first structure includes a first fin structure defined by a device isolation region in the substrate; a first dielectric layer covering an upper surface and side surfaces of the first fin structure and an upper surface of the device isolation region; a first gate structure on the first fin structure, the first gate structure including a first gate conductive layer, a first gate dielectric layer covering lower and side surfaces of the first gate conductive layer, and first gate spacer layers on side walls of the first gate conductive layer; and a first insulating structure covering the first dielectric layer and the first gate structure.

    Semiconductor devices having reflective symmetry

    公开(公告)号:US11996406B2

    公开(公告)日:2024-05-28

    申请号:US18148233

    申请日:2022-12-29

    CPC classification number: H01L27/088 H01L21/823456 H01L21/823481

    Abstract: A semiconductor device includes a substrate including first and second active regions extending in a first direction and isolated from direct contact with each other in the first direction; a device isolation layer between the first and second active regions in the substrate; and first and second gate structures extending in a second direction on the substrate while respectively intersecting end portions of the first and second active regions. The first gate structure includes a first gate electrode. The second gate structure includes a second gate electrode. The first gate structure protrudes further toward the device isolation layer, as compared to the second gate structure, in a vertical direction that is perpendicular to the first and second directions, and a lower end of the first gate electrode is located on a lower height level than a lower end of the second gate electrode.

    Semiconductor devices having asymmetrical structures

    公开(公告)号:US11545489B2

    公开(公告)日:2023-01-03

    申请号:US17180989

    申请日:2021-02-22

    Abstract: A semiconductor device includes a substrate including first and second active regions extending in a first direction and isolated from direct contact with each other in the first direction; a device isolation layer between the first and second active regions in the substrate; and first and second gate structures extending in a second direction on the substrate while respectively intersecting end portions of the first and second active regions. The first gate structure includes a first gate electrode. The second gate structure includes a second gate electrode. The first gate structure protrudes further toward the device isolation layer, as compared to the second gate structure, in a vertical direction that is perpendicular to the first and second directions, and a lower end of the first gate electrode is located on a lower height level than a lower end of the second gate electrode.

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