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公开(公告)号：US20210343552A1
公开(公告)日：2021-11-04
申请号：US17376369
申请日：2021-07-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung-Min SHIN , Seok-Hoon KIM , Young-Hoo KIM , In-Gi KIM , Tae-Hong KIM , Sung-Hyun PARK , Jin-Woo LEE , Ji-Hoon CHA , Yong-Jun CHOI
Abstract: A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.
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2.发明申请公开(公告)号：US20190241844A1
公开(公告)日：2019-08-08
申请号：US16250069
申请日：2019-01-17
Applicant: Samsung Electronics Co., Ltd. , SEMES Co., Ltd.
Inventor： Mi Hyun PARK , Jung-Min OH , Young-Hoo KIM , Hyo San LEE , Tae Keun KIM , Ye Rim YEON , Hae Rim OH , Ji Soo JEONG , Min Hee CHO
IPC: C11D11/00 , H01L21/67 , H01L21/687 , H01L21/02 , B08B3/10 , C11D17/00 , C11D1/14 , C11D3/20 , C11D3/34 , C11D3/32 , C11D3/28
CPC classification number: C11D11/0047 , B08B3/10 , C11D1/146 , C11D3/201 , C11D3/2017 , C11D3/2044 , C11D3/2096 , C11D3/28 , C11D3/32 , C11D3/3445 , C11D17/0008 , H01L21/02057 , H01L21/67051 , H01L21/68764
Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.035.
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公开(公告)号：US20160071745A1
公开(公告)日：2016-03-10
申请号：US14706546
申请日：2015-05-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Young-Hoo KIM , Il-Sang LEE , Yong-sun KO , Chang-Gil RYU , Kun-Tack LEE , Hyo-San LEE
IPC: H01L21/67 , H01L21/683 , B23K26/146 , B08B3/08 , B08B7/00
CPC classification number: B23K26/146 , B08B3/10 , B08B7/0071 , C11D11/0047 , H01L21/67028 , H01L21/6708 , H01L21/67109 , H01L21/67115 , H01L21/67248 , H01L21/67253 , H01L21/68785 , H01L21/68792
Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
Abstract translation: 提供点加热器和使用其的用于清洁晶片的装置。 晶片清洗装置包括加热器卡盘，其上安装有晶片，加热器卡盘构造成加热晶片的底面; 化学液体喷嘴，被配置为在所述晶片的顶表面上喷射化学液体以进行蚀刻; 以及点加热器，其被配置为加热晶片的顶表面的点。
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公开(公告)号：US20250167012A1
公开(公告)日：2025-05-22
申请号：US18794556
申请日：2024-08-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jihoon JEONG , Junho YOON , Young-Hoo KIM , Taeheon KIM , Woogwan SHIM , Jongwon LEE , Junho LEE , Jiwoong JUNG
Abstract: A substrate processing apparatus includes a stage configured to support a substrate, a rotation driving portion configured to rotate the stage around a first axis extending in a vertical direction, a first nozzle arm disposed on the stage and configured to rotate around a second axis parallel to the first axis, and a second nozzle arm disposed on the stage and configured to rotate around a third axis parallel to the second axis. The first nozzle arm includes a first nozzle supporting member extended parallel to the stage, a first connection member coupled to an end of the first nozzle supporting member, the first connection member having a stepwise shape, and a first nozzle coupled to the first connection member and configured to spray a fluidic material.
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公开(公告)号：US20220415643A1
公开(公告)日：2022-12-29
申请号：US17660449
申请日：2022-04-25
Applicant: Semes Co., Ltd. , Samsung Electronics Co., Ltd.
Inventor： Hae-Won CHOI , Anton KORIAKIN , Sangjine Park PARK , Keonyoung KIM , Sukhoon KIM , Seohyun KIM , Young-Hoo KIM , Kuntack LEE , Jihoon JEONG
Abstract: In a substrate processing method, a rinse process using a rinse solution is performed on a development-processed photoresist pattern on a substrate. A substitution process including a first substitution step using a mixed solution of a non-polar organic solvent and a surfactant and a second substitution step using the non-polar organic solvent is performed on the substrate. The substitution process is performed a plurality of times until the rinse solution remaining on the substrate is less than a predetermined value. A supercritical fluid drying process is performed on the substrate to dry the non-polar organic solvent remaining on the substrate.
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Patent Agency Ranking
公开(公告)号：US20200083063A1
公开(公告)日：2020-03-12
申请号：US16371461
申请日：2019-04-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung-Min SHIN , Seok-Hoon KIM , Young-Hoo KIM , In-Gi KIM , Tae-Hong KIM , Sung-Hyun PARK , Jin-Woo LEE , Ji-Hoon CHA , Yong-Jun CHOI
Abstract: A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.
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公开(公告)号：US20190259641A1
公开(公告)日：2019-08-22
申请号：US16115943
申请日：2018-08-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young-Hoo KIM , Sung Hyun PARK , Hyun Woo NHO , Ji Hoon CHA , Yong Jun CHOI
IPC: H01L21/67 , B01D29/66 , H01L21/311
Abstract: A liquid chemical recycle system includes a buffer tank receiving a first liquid chemical from outside; a vacuum tank having a vacuum pump connected thereto and receiving the first liquid chemical from the buffer tank using the vacuum pump; and a recycle tank receiving the first liquid chemical from the vacuum tank and providing a second liquid chemical, which is a recycled first liquid chemical, to the outside, wherein the buffer tank includes a first injection portion, to which the first liquid chemical is provided, and a first supply portion, which provides the first liquid chemical to the vacuum tank, and a bottom of the buffer tank is downwardly inclined toward the first supply portion to prevent a material contained in the first liquid chemical from being accumulated in the buffer tank.
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公开(公告)号：US20200343113A1
公开(公告)日：2020-10-29
申请号：US16690498
申请日：2019-11-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yong Jun CHOI , Seok Hoon KIM , Young-Hoo KIM , In Gi KIM , Sung Hyun PARK , Seung Min SHIN , Kun Tack LEE , Jinwoo LEE , Hun Jae JANG , Ji Hoon CHA
IPC: H01L21/67 , H01L21/687 , B08B3/08
Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.
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公开(公告)号：US20180311764A1
公开(公告)日：2018-11-01
申请号：US16029828
申请日：2018-07-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Young-Hoo KIM , Il-Sang LEE , Yong-sun KO , Chang-Gil RYU , Kun-Tack LEE , Hyo-San LEE
IPC: B23K26/146 , H01L21/687 , H01L21/67 , B08B3/10 , C11D11/00 , B08B7/00
CPC classification number: B23K26/146 , B08B3/10 , B08B7/0071 , C11D11/0047 , H01L21/67028 , H01L21/6708 , H01L21/67109 , H01L21/67115 , H01L21/67248 , H01L21/67253 , H01L21/68785 , H01L21/68792
Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
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公开(公告)号：US20170062287A1
公开(公告)日：2017-03-02
申请号：US15175062
申请日：2016-06-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyoung Hwan KIM , Ingi KIM , Mihyun PARK , Young-Hoo KIM , Ui-soon PARK , Jung-Min OH , Kuntack LEE , Hyosan LEE
IPC: H01L21/66 , H01L21/306
CPC classification number: H01L21/31111 , H01L21/67086 , H01L21/67253 , H01L21/67288
Abstract: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.
Abstract translation: 一种基板处理装置及其处理方法，其特征在于，具备使用化学溶液处理基板的基板处理装置，所述化学溶液含有磷酸水溶液和硅化合物; 以及向所述基板处理单元供给所述化学溶液的化学溶液供给体，所述化学溶液供给体包含测定所述化学溶液浓度的浓度测定器，所述浓度测定器包括测定所述化学溶液的水浓度的第一浓度测定器 ; 以及测量化学溶液的硅浓度的第二浓度测量器。
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