公开(公告)号：US20160093586A1

公开(公告)日：2016-03-31

申请号：US14619736

申请日：2015-02-11

Applicant: TANAKA DENSHI KOGYO K.K.

Inventor： Kazuhiko YASUHARA ,  Nanako MAEDA ,  Junichi OKAZAKI ,  Jun CHIBA ,  Wei CHEN ,  Yuki ANTOKU

IPC: H01L23/00

CPC classification number: H01L24/45 ,  H01L24/43 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/456 ,  H01L2224/48247 ,  H01L2224/78601 ,  H01L2224/85045 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/013 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/2064 ,  H01L2924/01079 ,  H01L2924/01204 ,  H01L2924/01008 ,  H01L2924/00015 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2924/20753 ,  H01L2924/00014 ,  H01L2924/20105 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01004

Abstract: The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.

Abstract translation: 本发明的银 - 金合金接合线包括由金（Au）的10％以上且30％以下且不低于30ppm且不高于90ppm的钙（Ca）组成的合金， 相对于除元素Au和Ca之外的金属元素的银（Ag）的剩余部分为99.99％以上，以质量％计; 在合金表面上形成有作为表面层的氧（O）和钙（Ca）的富集层; 以及形成在表面层正下方的金富集层。

公开(公告)号：US20200350273A1

公开(公告)日：2020-11-05

申请号：US16869694

申请日：2020-05-08

Applicant: Tanaka Denshi Kogyo K.K.

Inventor： Yuki ANTOKU ,  Shota KAWANO ,  Yusuke SAKITA

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00

Abstract: A gold-coated silver bonding wire includes: a core material containing silver as a main component; and a coating layer provided on a surface of the core material and containing gold as a main component. The gold-coated silver bonding wire contains gold in a range of not less than 2 mass % nor more than 7 mass %, and at least one sulfur group element selected from the group consisting of sulfur, selenium, and tellurium in a range of not less than 1 mass ppm nor more than 80 mass ppm, with respect to a total content of the bonding wire.

公开(公告)号：US20210050321A1

公开(公告)日：2021-02-18

申请号：US16969357

申请日：2018-04-19

Applicant: TANAKA DENSHI KOGYO K.K.

Inventor： Jun CHIBA ,  Yuki ANTOKU ,  Shota KAWANO

IPC: H01L23/00

Abstract: A noble metal-coated silver bonding wire suppresses corrosion at the bonding interface under severe conditions of high temperature and high humidity, and the noble metal-coated silver bonding wire can be ball-bonded in the air. The noble metal-coated silver wire for ball bonding is a noble metal-coated silver wire including a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes a palladium intermediate layer and a gold skin layer, the palladium content relative to the entire wire is 0.01 mass % or more and 5.0 mass % or less, the gold content relative to the entire wire is 1.0 mass % or more and 6.0 mass % or less, and the sulfur group element content relative to the entire wire is 0.1 mass ppm or more and 100 mass ppm or less.

公开(公告)号：US20170125135A1

公开(公告)日：2017-05-04

申请号：US15337771

申请日：2016-10-28

Applicant: TANAKA DENSHI KOGYO K.K.

Inventor： Hiroyuki AMANO ,  Somei YARITA ,  Yusuke SAKITA ,  Yuki ANTOKU ,  Wei CHEN

IPC: H01B1/02 ,  H01L23/00

Abstract: A noble metal-coated copper wire for ball bonding, with a wire diameter between 10 μm or more, and 25 μm or less, includes a core material having a copper alloy having a copper purity of 98 mass % or higher, and a noble metal-coating layer formed on the core material. The noble metal-coating layer includes a palladium cavitating layer containing palladium; at least one element selected from the group consisting of Group 13 to 16 elements or an oxygen element, finely dispersed in the palladium; and a diffusion layer formed of copper diffused into the palladium. The noble metal-coating layer may include a palladium cavitating layer containing palladium, at least one element selected from the group consisting of Group 13 to 16 elements or an oxygen element, finely dispersed therein, and a nickel intermediate layer disposed between the core material and the noble metal-coating layer.

公开(公告)号：US20140302317A1

公开(公告)日：2014-10-09

申请号：US14142152

申请日：2013-12-27

Applicant: TANAKA DENSHI KOGYO K.K.

Inventor： Yuki ANTOKU ,  Kazuhiko YASUHARA ,  Jun CHIBA ,  Wei CHEN ,  Junichi OKAZAKI ,  Nanako MAEDA

IPC: H01L23/00

CPC classification number: H01L24/45 ,  H01L24/05 ,  H01L24/43 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48669 ,  H01L2924/00011 ,  Y10T428/2958 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01204 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/01044 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/01012 ,  H01L2924/0103 ,  H01L2924/01013 ,  H01L2924/01049 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01004 ,  H01L2924/01083 ,  H01L2924/01034 ,  H01L2924/01058 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/01203 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/00013 ,  H01L2924/01079 ,  H01L2924/0105 ,  H01L2924/01022 ,  H01L2924/01052 ,  H01L2224/45644 ,  H01L2924/00015 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2924/01048

Abstract: An object is to provide a bonding wire for a high-speed signal line, formed by an Ag—Pd—Pt three-element alloy or an Ag—Pd—Pt ternary alloy, that is able to transmit a stable super-high frequency signal in a several GHz band, and that does not have a strong silver sulfide (Ag2S) film even when an unstable silver sulfide layer is formed on the surface of the bonding wire. Provided is the bonding wire for the high-speed signal line formed by a three-element alloy containing 0.8 to 2.5 mass % of palladium (Pd), 0.1 to 0.7 mass % of platinum (Pt), and a balance being silver (Ag) with purity of 99.99 mass % or more, or a ternary alloy obtained by adding a trace element to the three-element alloy, in which cross section of the bonding wire is formed by a skin film and a core, and in which a surface segregation layer containing highly-concentrated silver (Ag) is present in the skin film of the silver alloy.

Abstract translation: 目的是提供一种由Ag-Pd-Pt三元素合金或Ag-Pd-Pt三元合金形成的用于高速信号线的接合线，其能够传输稳定的超高频信号 即使在接合线的表面上形成不稳定的硫化银层，也不具有强硫化银（Ag 2 S）膜。 提供了由含有钯（Pd）0.8〜2.5质量％，铂（Pt）0.1〜0.7质量％，余量为银（Ag））的三元素合金形成的高速信号线用接合线， 纯度为99.99质量％以上的三元合金，或通过在三元素合金中添加微量元素而获得的三元合金，其中，接合线的截面通过皮膜和芯形成，并且其中表面偏析 含有高浓度银（Ag）的层存在于银合金的皮膜中。

公开(公告)号：US20170057020A1

公开(公告)日：2017-03-02

申请号：US15248196

申请日：2016-08-26

Applicant: TANAKA DENSHI KOGYO K.K.

Inventor： Hiroyuki AMANO ,  Somei YARITA ,  Yusuke SAKITA ,  Yuki ANTOKU ,  Wei CHEN

IPC: B23K35/02 ,  C22C9/00 ,  C22C5/04 ,  C22C5/02 ,  B23K35/30 ,  B21C1/02 ,  C22F1/14 ,  C25D3/50 ,  C23C14/16 ,  C23C14/35 ,  C23C26/00 ,  B32B15/01 ,  C22C9/06 ,  C22F1/08

CPC classification number: B23K35/0227 ,  B21C1/02 ,  B23K35/302 ,  B32B15/018 ,  C22C5/02 ,  C22C5/04 ,  C22C9/00 ,  C22C9/06 ,  C22F1/08 ,  C22F1/14 ,  C23C14/165 ,  C23C14/35 ,  C23C26/00 ,  C25D3/50 ,  H01L2224/05624 ,  H01L2224/45 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/01201 ,  H01L2924/00012 ,  H01L2924/01016 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01006 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/01004 ,  H01L2924/013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01078 ,  H01L2924/01203 ,  H01L2924/01206

Abstract: A palladium coated copper wire for ball bonding includes a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and a palladium draw coated layer coated on the core. The copper wire has a diameter of 10 to 25 μm, and the palladium drawn layer contains sulfur, phosphorus, boron or carbon.

Abstract translation: 用于球接的钯包铜线包括由纯度为98质量％以上的纯铜或铜合金形成的芯和涂覆在芯上的钯吸附涂层。 铜线的直径为10〜25μm，钯拉伸层含有硫，磷，硼或碳。