公开(公告)号：US09487684B2

公开(公告)日：2016-11-08

申请号：US14389596

申请日：2013-03-25

Applicant: tesa SE

Inventor： Thorsten Krawinkel ,  Klaus Keite-Telgenbüsher ,  Judith Grünauer ,  Jan Ellinger

IPC: C08K5/07 ,  C09J153/02 ,  C08F8/36 ,  C09J7/02 ,  C09J193/04 ,  C09J11/06 ,  C09J5/02 ,  C09J5/06 ,  C09J153/00 ,  C08K5/00 ,  H01L51/52 ,  C08L91/00

CPC classification number: C09J153/025 ,  C08F8/36 ,  C08K5/0091 ,  C08K5/07 ,  C08L53/025 ,  C08L91/00 ,  C08L2205/02 ,  C09J5/02 ,  C09J5/06 ,  C09J7/20 ,  C09J7/35 ,  C09J7/387 ,  C09J11/06 ,  C09J153/00 ,  C09J193/04 ,  C09J2203/318 ,  C09J2453/00 ,  H01L51/5246 ,  H01L2924/0002 ,  Y10T428/2852 ,  H01L2924/00

Abstract: Adhesive compound as a permeant barrier, comprising (i) block copolymers having a construction A-B-A, (A-B)n, (A-B)nX, or (A-B-A)nX, where X is the radical of the coupling reagent, n is a whole number between 2 and 10, A is a polymer made of a vinyl aromatic compound and B is a polymer block made of an alkene or diene, wherein this polymer block can also be hydrated, with the condition that at least part of the A blocks is sulfonated, optionally with two-block copolymers in the form of A-B as an admixture component, and (ii) at least one tackifier resin.

Abstract translation: 粘合剂作为渗透屏障，包括（i）嵌段共聚物，其具有结构ABA，（AB）n，（AB）nX或（ABA）nX，其中X是偶联剂的基团，n是 如图2和图10所示，A是由乙烯基芳族化合物制成的聚合物，B是由烯烃或二烯制成的聚合物嵌段，其中该聚合物嵌段也可以水合，条件是至少部分A嵌段被磺化， 任选地以AB作为混合组分的形式的双嵌段共聚物，和（ii）至少一种增粘树脂。

公开(公告)号：US20150337174A1

公开(公告)日：2015-11-26

申请号：US14653143

申请日：2013-12-05

Applicant: TESA SE

Inventor： Klaus Keite-Telgenbüscher ,  Jan Ellinger ,  Judith Grünauer ,  Anika Petersen

IPC: C09J7/02

CPC classification number: C09J7/22 ,  B32B27/14 ,  B32B27/32 ,  B32B2264/10 ,  B32B2405/00 ,  C08K3/08 ,  C08K3/22 ,  C08K3/34 ,  C09J7/29 ,  C09J153/005 ,  C09J153/025 ,  C09J171/00 ,  C09J177/02 ,  C09J177/06 ,  C09J2201/128 ,  C09J2201/20 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2400/123 ,  C09J2400/243 ,  C09J2400/263 ,  C09J2423/006 ,  C09J2423/046 ,  C09J2433/00 ,  C09J2453/00 ,  C09J2463/00 ,  C09J2471/00 ,  H01L23/26 ,  H01L23/3164 ,  H01L51/524 ,  H01L2924/0002 ,  Y10T428/24331 ,  Y10T428/249983 ,  Y10T428/2848 ,  H01L2924/00

Abstract: The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.

Abstract translation: 本发明的目的是有效地保护扁平的粘合剂化合物免受来自周围环境的渗透物以及在层压，缠绕，堆叠或其它加工步骤期间被捕获的渗透物。 为此目的，粘合带至少包括以下顺序的层：第一外部粘合剂化合物层A，含有至少一种无机吸气剂材料的层B和第二外部粘合剂化合物层C.本发明 还涉及使用所述胶带作为包封材料。

公开(公告)号：US20150162568A1

公开(公告)日：2015-06-11

申请号：US14411585

申请日：2013-05-27

Applicant: TESA SE

Inventor： Minyoung Bai ,  Jan Ellinger ,  Judith Grünauer ,  Klaus Keite-Telgenbüscher ,  Anika Petersen

IPC: H01L51/56 ,  C09J7/00 ,  H01L51/52

CPC classification number: H01L51/56 ,  C09J7/00 ,  C09J7/10 ,  C09J7/20 ,  C09J7/35 ,  C09J7/38 ,  C09J11/04 ,  C09J153/005 ,  C09J153/02 ,  C09J157/02 ,  C09J163/00 ,  C09J177/06 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/22 ,  C09J2453/00 ,  C09J2463/00 ,  C09J2477/00 ,  H01L51/0096 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2924/16195 ,  Y02E10/549

Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

Abstract translation: 本发明涉及一种用于保护电子装置的方法，该电子装置设置在基板上并且包括有机成分，其中盖子以这样的方式施加到电子装置，使得电子装置至少部分被盖盖住，盖子 至少在部分区域上粘合到基底和/或电子装置上，粘合剂粘合通过粘合带中的至少一层粘合剂产生，其特征在于，所述粘合剂包括吸气剂材料，其为 能够至少一种可渗透物质，基于与吸气剂材料的粘合剂，吸气剂材料以不超过2重量％的比例存在于粘合剂中。

公开(公告)号：US20150064462A1

公开(公告)日：2015-03-05

申请号：US14389529

申请日：2013-03-25

Applicant: tesa SE

Inventor： Klaus Keite-Telgenbüsher ,  Jan Ellinger ,  Judith Grünauer ,  Thorsten Krawinkel

IPC: C09J153/00 ,  B05D3/02 ,  C09J7/02

CPC classification number: C09J153/00 ,  B05D3/0218 ,  B05D3/0254 ,  C08K5/0025 ,  C08K5/0091 ,  C09J7/387 ,  C09J11/06 ,  C09J153/025 ,  C09J2453/00 ,  Y10T428/2857

Abstract: Temperature-stable adhesive compound, comprising (i) block copolymers having a construction A-B-A, (A-B)n, (A-B)nX, or (A-B-A)nX, where X is the radical of a coupling reagent, n is an integer between 2 and 10, A is a polymer block of a vinylaromatic, and B is a polymer block of an alkene or diene, at least some of the A blocks being sulfonated, and optionally diblock copolymers of the form A-B, and (ii) at least one tackifier resin, and (iii) at least one metal complex with a substitutable complexing agent.

Abstract translation: 温度稳定的粘合剂化合物，其包含（i）具有结构ABA，（AB）n，（AB）nX或（ABA）nX的嵌段共聚物，其中X是偶联试剂的基团，n是2和 10，A是乙烯基芳族化合物的聚合物嵌段，B是烯烃或二烯的聚合物嵌段，至少一些A嵌段被磺化，和任选的AB型的二嵌段共聚物，和（ii）至少一种增粘剂 树脂，和（iii）至少一种具有可取代的络合剂的金属络合物。

公开(公告)号：US09631127B2

公开(公告)日：2017-04-25

申请号：US14422203

申请日：2013-07-04

Applicant: tesa SE

Inventor： Klaus Keite-Telgenbüscher ,  Jan Ellinger

IPC: C08L27/00 ,  C09J127/12 ,  C09J127/16 ,  C08K3/22 ,  C08K11/00 ,  H05K5/06 ,  H01L51/52

CPC classification number: C09J127/12 ,  C08K3/22 ,  C08K11/00 ,  C08K2003/222 ,  C08L27/16 ,  C09J127/16 ,  H01L51/5253 ,  H01L2924/0002 ,  H05K5/065 ,  H01L2924/00

Abstract: Pressure-sensitive adhesive material for encasing an electronic arrangement to prevent permeate, which material comprises at least 70 percent by weight of a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, wherein the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer is between 5:95 to 55:45.

公开(公告)号：US09422466B2

公开(公告)日：2016-08-23

申请号：US14389529

申请日：2013-03-25

Applicant: tesa SE

Inventor： Klaus Keite-Telgenbüsher ,  Jan Ellinger ,  Judith Grünauer ,  Thorsten Krawinkel

IPC: C09J7/02 ,  C09J153/00 ,  C09J11/06 ,  C09J153/02 ,  B05D3/02 ,  C08K5/00

CPC classification number: C09J153/00 ,  B05D3/0218 ,  B05D3/0254 ,  C08K5/0025 ,  C08K5/0091 ,  C09J7/387 ,  C09J11/06 ,  C09J153/025 ,  C09J2453/00 ,  Y10T428/2857

Abstract: Temperature-stable adhesive compound, comprising (i) block copolymers having a construction A-B-A, (A-B)n, (A-B)nX, or (A-B-A)nX, where X is the radical of a coupling reagent, n is an integer between 2 and 10, A is a polymer block of a vinylaromatic, and B is a polymer block of an alkene or diene, at least some of the A blocks being sulfonated, and optionally diblock copolymers of the form A-B, and (ii) at least one tackifier resin, and (iii) at least one metal complex with a substitutable complexing agent.

Abstract translation: 温度稳定的粘合剂化合物，其包含（i）具有结构ABA，（AB）n，（AB）nX或（ABA）nX的嵌段共聚物，其中X是偶联试剂的基团，n是2和 10，A是乙烯基芳族化合物的聚合物嵌段，B是烯烃或二烯的聚合物嵌段，至少一些A嵌段被磺化，和任选的AB型的二嵌段共聚物，和（ii）至少一种增粘剂 树脂，和（iii）至少一种具有可取代的络合剂的金属络合物。

公开(公告)号：US20150099081A1

公开(公告)日：2015-04-09

申请号：US14382130

申请日：2013-02-07

Applicant: tesa SE

Inventor： Minyoung Bai ,  Thilo Dollase ,  Jan Ellinger ,  Judith Grünauer

IPC: C09J7/02 ,  B32B38/10 ,  B32B37/12 ,  C09J5/00

CPC classification number: B32B37/12 ,  B32B38/10 ,  C09J5/00 ,  C09J7/10 ,  C09J7/403 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2423/005 ,  C09J2423/105 ,  H01L51/5253 ,  H01L2924/0002 ,  Y10T428/1443 ,  Y10T428/1452 ,  Y10T428/1476 ,  H01L2924/00

Abstract: An adhesive strip, with improved barrier effect, encapsulates electronic arrangements against permeates, whereby the composite system comprises at least (a) an adhesive strip containing at least one pressure-sensitive adhesive substance for direct application on a substrate; and (b) at least one release liner which lies directly upon the pressure-sensitive adhesive substance, wherein the surface of the release liner, that faces the pressure-sensitive adhesive substance, has a surface roughness of less that 100 nm, measured as an arithmetic mean Sa as per ISO/FDIS 25178-2:2011 of the amounts of at least 10,000 height values of the profile of a partial surface of at least 200 μm×200 μm. A method produces a release liner with a smooth surface for equipping barrier adhesive strips by removing the liner in order to encapsulate electronic arrangements with the adhesive strip.

Abstract translation: 具有改善的屏障作用的粘合剂条将电子装置封装在渗透物上，由此复合体系至少包括（a）含有至少一种直接施加在基底上的压敏粘合剂物质的粘合剂条; 和（b）直接位于压敏粘合剂物质上的至少一个剥离衬垫，其中剥离衬垫的面向压敏粘合剂物质的表面的表面粗糙度小于100nm，测量为 根据ISO / FDIS 25178-2：2011的至少200μm×200μm的局部表面轮廓的至少10,000个高度值的算术平均值Sa。 一种方法产生具有光滑表面的剥离衬垫，用于通过移除衬垫来装备阻挡粘合剂条，以便封装具有粘合剂条的电子装置。

公开(公告)号：US10323163B2

公开(公告)日：2019-06-18

申请号：US14653143

申请日：2013-12-05

Applicant: TESA SE

Inventor： Klaus Keite-Telgenbüscher ,  Jan Ellinger ,  Judith Grünauer ,  Anika Petersen

IPC: H01L23/26 ,  C09J7/22 ,  C09J7/29 ,  C09J153/02 ,  C09J171/00 ,  C09J177/02 ,  C09J177/06 ,  C09J7/38 ,  C09J7/40 ,  C08K3/08 ,  C08K3/22 ,  C08K3/34 ,  B32B27/14 ,  B32B27/32 ,  C09J153/00 ,  H01L51/52 ,  H01L23/31

Abstract: The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.

公开(公告)号：US09957423B2

公开(公告)日：2018-05-01

申请号：US14916348

申请日：2014-08-22

Applicant: TESA SE

Inventor： Marc Husemann ,  Jan Ellinger ,  Matthias Koop ,  Niko Lübbert

IPC: C09J7/02 ,  C09J133/06 ,  C09J5/00 ,  C09J133/14 ,  C09J11/06 ,  C09J133/04 ,  C08K5/11 ,  C08K5/20 ,  C08K5/3435 ,  C08K5/3475

CPC classification number: C09J133/06 ,  C08K5/11 ,  C08K5/20 ,  C08K5/3435 ,  C08K5/3475 ,  C08L2201/08 ,  C09J5/00 ,  C09J7/385 ,  C09J11/06 ,  C09J133/04 ,  C09J133/14 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2433/00

Abstract: The invention relates to an adhesive tape comprising at least one layer of a pressure-sensitive acrylate adhesive comprising a polymer component and at least one additive, where the polymer component is composed of one or more copolymers each based on the following monomers: a) from 5 to 35% by weight of one or more monomers containing hydroxy groups and having a copolymerizable double bond; b) from 0 to 50% by weight of one or more acrylate and/or methacrylate monomers each having at least one amide group, urethane group, urea group, or carboxylic anhydride unit and/or ethylene glycol unit, c) from 15 to 95% by weight of an alkyl (meth)acrylate, where the alkyl moiety has from 1 to 14 carbon atoms, where the pressure-sensitive acrylate adhesive comprises one or more 2-(2H-Benzotriazol-2-yl) derivatives admixed as additive; and also a corresponding adhesive.

公开(公告)号：US09543549B2

公开(公告)日：2017-01-10

申请号：US14411585

申请日：2013-05-27

Applicant: TESA SE

Inventor： Minyoung Bai ,  Jan Ellinger ,  Judith Grünauer ,  Klaus Keite-Telgenbüscher ,  Anika Petersen

IPC: H01L21/00 ,  H01L51/56 ,  C09J7/00 ,  C09J7/02 ,  C09J11/04 ,  H01L51/00 ,  H01L51/52 ,  C09J153/00 ,  C09J153/02 ,  C09J157/02 ,  C09J163/00 ,  C09J177/06

CPC classification number: H01L51/56 ,  C09J7/00 ,  C09J7/10 ,  C09J7/20 ,  C09J7/35 ,  C09J7/38 ,  C09J11/04 ,  C09J153/005 ,  C09J153/02 ,  C09J157/02 ,  C09J163/00 ,  C09J177/06 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/22 ,  C09J2453/00 ,  C09J2463/00 ,  C09J2477/00 ,  H01L51/0096 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2924/16195 ,  Y02E10/549

Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

Abstract translation: 本发明涉及一种用于保护电子装置的方法，该电子装置设置在基板上并且包括有机成分，其中盖子以这样的方式施加到电子装置，使得电子装置至少部分被盖盖住，盖子 至少在部分区域上粘合到基底和/或电子装置上，粘合剂粘合通过粘合带中的至少一层粘合剂产生，其特征在于，所述粘合剂包括吸气剂材料，其为 能够至少一种可渗透物质，基于与吸气剂材料的粘合剂，吸气剂材料以不超过2重量％的比例存在于粘合剂中。