公开(公告)号：US08828799B2

公开(公告)日：2014-09-09

申请号：US13939804

申请日：2013-07-11

Applicant: Texas Instruments Incorporated

Inventor： Kenneth Robert Rhyner ,  Peter R. Harper

IPC: H01L21/60 ,  H01L23/00 ,  H01L23/48

CPC classification number: H01L24/03 ,  H01L21/50 ,  H01L23/48 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/05 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: A method for forming an integrated circuit package is disclosed. A flex circuit is form by forming a direct connect pad on a first side of a dielectric layer. After forming the direct connect pad, an opening from a second side of the dielectric layer is formed to expose the direct connect pad. A blind via is formed within the opening in the dielectric layer. A first conductor is formed within the opening. A bond pad of a semiconductor die is electrically coupled with the direct connect pad using a second conductor, wherein the bond pad and the second conductor directly overlie the direct connect pad.

Abstract translation: 公开了一种用于形成集成电路封装的方法。 通过在电介质层的第一侧上形成直接连接焊盘来形成柔性电路。 在形成直接连接焊盘之后，形成从电介质层的第二侧的开口以暴露直接连接焊盘。 在电介质层的开口内形成盲通孔。 第一导体形成在开口内。 半导体管芯的接合焊盘使用第二导体与直接连接焊盘电耦合，其中接合焊盘和第二导体直接覆盖在直接连接焊盘上。

公开(公告)号：US09941228B2

公开(公告)日：2018-04-10

申请号：US15497024

申请日：2017-04-25

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rajen Manicon Murugan ,  Minhong Mi ,  Gary Paul Morrison ,  Jie Chen ,  Kenneth Robert Rhyner ,  Stanley Craig Beddingfield ,  Chittranjan Mohan Gupta ,  Django Earl Trombley

IPC: H01Q1/00 ,  H01L23/66 ,  H01L23/498 ,  H01L23/00 ,  H05K1/18 ,  H05K1/02 ,  H01Q1/22 ,  H01Q1/32 ,  H01Q23/00

CPC classification number: H01L23/66 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1423 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01Q1/3233 ,  H01Q23/00 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/181 ,  H05K2201/09609 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

公开(公告)号：US09666553B2

公开(公告)日：2017-05-30

申请号：US14740190

申请日：2015-06-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rajen Manicon Murugan ,  Minhong Mi ,  Gary Paul Morrison ,  Jie Chen ,  Kenneth Robert Rhyner ,  Stanley Craig Beddingfield ,  Chittranjan Mohan Gupta ,  Django Earl Trombley

IPC: H01Q1/00 ,  H01L23/00 ,  H01L23/66 ,  H01L23/498 ,  H01Q1/22 ,  H01Q23/00 ,  H05K1/02

CPC classification number: H01L23/66 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1423 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01Q1/3233 ,  H01Q23/00 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/181 ,  H05K2201/09609 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

公开(公告)号：US20130295722A1

公开(公告)日：2013-11-07

申请号：US13939804

申请日：2013-07-11

Applicant: Texas Instruments Incorporated

Inventor： Kenneth Robert Rhyner ,  Peter R. Harper

IPC: H01L23/00

CPC classification number: H01L24/03 ,  H01L21/50 ,  H01L23/48 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/05 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: A method for forming an integrated circuit package is disclosed. A flex circuit is form by forming a direct connect pad on a first side of a dielectric layer. After forming the direct connect pad, an opening from a second side of the dielectric layer is formed to expose the direct connect pad. A blind via is formed within the opening in the dielectric layer. A first conductor is formed within the opening. A bond pad of a semiconductor die is electrically coupled with the direct connect pad using a second conductor, wherein the bond pad and the second conductor directly overlie the direct connect pad.

Abstract translation: 公开了一种用于形成集成电路封装的方法。 通过在电介质层的第一侧上形成直接连接焊盘来形成柔性电路。 在形成直接连接焊盘之后，形成从电介质层的第二侧的开口以暴露直接连接焊盘。 在电介质层的开口内形成盲通孔。 第一导体形成在开口内。 半导体管芯的接合焊盘使用第二导体与直接连接焊盘电耦合，其中接合焊盘和第二导体直接覆盖在直接连接焊盘上。

公开(公告)号：US10262957B2

公开(公告)日：2019-04-16

申请号：US15949746

申请日：2018-04-10

Applicant: Texas Instruments Incorporated

Inventor： Rajen Manicon Murugan ,  Minhong Mi ,  Gary Paul Morrison ,  Jie Chen ,  Kenneth Robert Rhyner ,  Stanley Craig Beddingfield ,  Chittranjan Mohan Gupta ,  Django Earl Trombley

IPC: H01Q1/00 ,  H01L23/66 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/22 ,  H01Q23/00 ,  H05K1/02 ,  H01Q1/32 ,  H05K1/18

Abstract: An integrated circuit (IC) package includes an IC die and a wave channel that electrically couples the IC die to a solder ball array. The wave channel is configured to resonate at an operating frequency band of the IC die.